公开(公告)号：US06282761B1

公开(公告)日：2001-09-04

申请号：US09492069

申请日：2000-01-27

申请人： William W. Bewley ,  Edward A. Aifer ,  Christopher L. Felix ,  Igor Vurgaftman ,  Jerry R. Meyer ,  John Glesener

发明人： William W. Bewley ,  Edward A. Aifer ,  Christopher L. Felix ,  Igor Vurgaftman ,  Jerry R. Meyer ,  John Glesener

IPC分类号： A44B2100

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44974 ,  H01L2924/00

摘要： A pressure clip for contacting a heat sink device to a heat sink by means of a pressure bond having thermal resistance of less than about 5 K/kW/cm2. The pressure clip includes a mounting block, a clamp block; a spacer disposed between the mounting block and the clamp block forming a channel therebetween, support shoulders in the channel for supporting a heat sink, means for securing the clamp block and the spacer to the mounting block, pressure arm disposed above the mounting block, flexible joint for flexibly attaching the pressure arm to the mounting block, pressure screw disposed between the pressure arm and the mounting block for applying pressure to the pressure arm, and a plunger projecting into the channel between the mounting block and the clamp block for transmitting pressure from the pressure arm.

摘要翻译： 一种用于通过具有低于约5K / kW / cm 2的热阻的压力接合散热器件到散热器的压力夹。 压力夹包括安装块，夹紧块; 设置在安装块和夹紧块之间的间隔件，在其间形成通道，支撑用于支撑散热器的通道中的肩部，用于将夹具块和间隔件固定到安装块的装置，设置在安装块上方的压力臂，柔性 用于将压力臂柔性地附接到安装块的接头，设置在压力臂和用于向压力臂施加压力的安装块之间的压力螺钉，以及突出到安装块和夹紧块之间的通道中的柱塞，用于将压力从 压臂。

公开(公告)号：US06734043B2

公开(公告)日：2004-05-11

申请号：US10196147

申请日：2002-07-17

申请人： William W. Bewley ,  Edward A. Aifer ,  Christopher L. Felix ,  Igor Vurgaftman ,  Jerry R Meyer ,  John Glesener

发明人： William W. Bewley ,  Edward A. Aifer ,  Christopher L. Felix ,  Igor Vurgaftman ,  Jerry R Meyer ,  John Glesener

IPC分类号： H01L2336

CPC分类号： H01L23/40 ,  H01L33/642 ,  H01L2924/0002 ,  H01S5/0215 ,  H01S5/02256 ,  H01S5/02484 ,  H01S5/041 ,  H01S5/141 ,  H01S5/183 ,  H01S5/18388 ,  H01L2924/00

摘要： This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm2. The method is characterized by the steps of removing heat from a heat source device comprising the steps of placing a heat source device in contact with a heat source and applying a sufficient force to form a pressure bond between the heat source device and the heat sink wherein thermal resistance at the interface between the heat source device and the heat sink after the thermal bond is established is less than about 5 K/kW-cm2. The heat sink system includes a heat source device and a heat sink in contact with the heat source device with thermal resistance at the interface of the heat source device and said heat sink is less than about 5 K/kW-cm2.

摘要翻译： 本发明涉及一种用于从热源装置和散热系统中除去热量的方法，其特征在于具有低于约5K / kW-cm 2的热阻的压力键。 该方法的特征在于从热源装置中除去热量的步骤，包括以下步骤：放置与热源接触的热源装置，并施加足够的力以在热源装置和散热器之间形成压力键， 建立热粘合后热源装置与散热片之间的界面处的热阻小于约5K / kW-cm 2。 散热器系统包括热源装置和与热源装置接触的散热器，其在热源装置和所述散热器的界面处具有热阻小于约5K / kW-cm 2。

公开(公告)号：US06448642B1

公开(公告)日：2002-09-10

申请号：US09492068

申请日：2000-01-27

申请人： William W. Bewley ,  Edward A. Aifer ,  Christopher L. Felix ,  Igor Vurgaftman ,  Jerry R. Meyer ,  John Glesener

发明人： William W. Bewley ,  Edward A. Aifer ,  Christopher L. Felix ,  Igor Vurgaftman ,  Jerry R. Meyer ,  John Glesener

IPC分类号： H01L2340

CPC分类号： H01L23/40 ,  H01L33/642 ,  H01L2924/0002 ,  H01S5/0215 ,  H01S5/02256 ,  H01S5/02484 ,  H01S5/041 ,  H01S5/141 ,  H01S5/183 ,  H01S5/18388 ,  H01L2924/00

摘要： This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm2. The method is characterized by the steps of removing heat from a heat source device comprising the steps of placing a heat source device in contact with a heat source and applying a sufficient force to form a pressure bond between the heat source device and the heat sink wherein thermal resistance at the interface between the heat source device and the heat sink after the thermal bond is established is less than about 5 K/kW-cm2. The heat sink system includes a heat source device and a heat sink in contact with the heat source device with thermal resistance at the interface of the heat source device and said heat sink is less than about 5 K/kW-cm2.

摘要翻译： 本发明涉及一种用于从热源装置和散热系统中除去热量的方法，其特征在于具有小于约5K / kW-cm 2的热阻的压力键。 该方法的特征在于从热源装置中除去热量的步骤，包括以下步骤：放置与热源接触的热源装置，并施加足够的力以在热源装置和散热器之间形成压力键， 建立热粘合后热源装置与散热片之间界面处的热阻小于约5K / kW-cm2。 散热器系统包括热源装置和与热源装置接触的散热器，其在热源装置和所述散热器的界面处具有热阻小于约5K / kW-cm 2。