公开(公告)号：US20190083968A1

公开(公告)日：2019-03-21

申请号：US15825119

申请日：2017-11-29

Applicant: Wistron Corporation

Inventor： Yu-Jung Chu ,  Chen-An Sung

IPC: B01L3/02 ,  B01L9/00 ,  G01N27/447 ,  G01N1/10

Abstract: A pipetting module includes a pipette head and a pipette tip. The pipette head has a first coefficient of thermal expansion. The pipette tip includes a connecting portion. The connecting portion is adapted to be sleeved on the pipette head, and the connecting portion has a second coefficient of thermal expansion. The second coefficient of thermal expansion of the connecting portion is greater than the first coefficient of thermal expansion of the pipette head. In addition, an automatic pipetting apparatus is also provided.

公开(公告)号：US10710066B2

公开(公告)日：2020-07-14

申请号：US15825119

申请日：2017-11-29

Applicant: Wistron Corporation

Inventor： Yu-Jung Chu ,  Chen-An Sung

IPC: B01L3/02 ,  B01L9/00 ,  G01N27/447 ,  G01N1/10 ,  G01N35/10 ,  G01N35/00

Abstract: A pipetting module includes a pipette head and a pipette tip. The pipette head has a first coefficient of thermal expansion. The pipette tip includes a connecting portion. The connecting portion is adapted to be sleeved on the pipette head, and the connecting portion has a second coefficient of thermal expansion. The second coefficient of thermal expansion of the connecting portion is greater than the first coefficient of thermal expansion of the pipette head. In addition, an automatic pipetting apparatus is also provided.