Process for coating substrates by means of a magnetron cathode
    1.
    发明授权
    Process for coating substrates by means of a magnetron cathode 失效
    通过磁控管阴极涂覆基板的方法

    公开(公告)号:US5182001A

    公开(公告)日:1993-01-26

    申请号:US755293

    申请日:1991-09-05

    IPC分类号: C23C14/34 H01J37/34

    摘要: In a process for coating substrates by means of cathode sputtering, a magnetron cathode is used which has an annularly closed target 9. The sputter surface 9a of this target has an inner edge 9c and an outer edge 9d. The corresponding system of permanent magnets 7 has a first pole 7c which is disposed inside the inner edge and a second pole 7d disposed outside the outer edge. The characteristics of the poles geometrically resemble those of the target edges. This results in the generation of a circumferentially closed magnetic tunnel over the sputter surface. The flux lines thereof which are important to the enclosure of the plasma, are only slightly curved. In order to achieve a good material efficiency at high sputter rates and yet a high plasma density at the substrates, the spatial course of the magnetic flux lines is selectively distorted in such a way that the area of maximum target erosion, in absence of additional magnetic fields, is shifted to the vicinity of the outer edge 9d of the target 9. An averaged time value of an excitation current is applied to an additionally disposed magnetic coil 26. It serves to shift the zone of maximum target erosion approximately to the center between the two target edges. A periodic change of the average value of the excitation current shifts the zone of maximum target erosion from the center toward both sides.

    摘要翻译: 在通过阴极溅射涂布基板的方法中,使用具有环形封闭的靶9的磁控管阴极。该靶的溅射表面9a具有内边缘9c和外边缘9d。 永磁体7的相应系统具有设置在内边缘内的第一极7c和设置在外边缘外侧的第二极7d。 极点的几何特性与目标边缘的特征相似。 这导致在溅射表面上产生周向闭合的磁通道。 对于等离子体的外壳重要的其通量线仅是略微弯曲。 为了在高溅射速率下实现良好的材料效率,并且在基板处获得高等离子体密度,磁通线的空间过程选择性地变形,使得在没有附加磁性的情况下,最大目标侵蚀的面积 场移动到目标9的外边缘9d附近。激励电流的平均时间值被施加到另外设置的磁线圈26.它用于将最大目标侵蚀的区域大致移动到 两个目标边缘。 励磁电流的平均值的周期性变化将最大目标侵蚀的区域从中心向两侧移动。