公开(公告)号：US12294037B2

公开(公告)日：2025-05-06

申请号：US17450630

申请日：2021-10-12

Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Gong Chen ,  Su-Hui Lin ,  Sheng-Hsien Hsu ,  Kang-Wei Peng ,  Ling-Yuan Hong ,  Minyou He ,  Chia-Hung Chang

IPC: H01L33/00 ,  H01L33/24

Abstract: A light-emitting diode chip includes a substrate. The substrate has a side surface configured as a serrated surface, which includes a plurality of laser inscribed features disposed along a thickness direction of the substrate and spaced apart from each other. A method for manufacturing the light-emitting diode chip is also disclosed herein.