公开(公告)号：US20180166467A1

公开(公告)日：2018-06-14

申请号：US15893699

申请日：2018-02-12

Applicant: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.

Inventor： Guochang LAI ,  Junyi LI ,  Zhongjie ZHANG

IPC: H01L27/12

CPC classification number: H01L27/124 ,  G02F1/13452 ,  G02F2001/133388 ,  G02F2201/56 ,  H01L27/1218 ,  H01L27/1248 ,  H01L27/3276

Abstract: An array substrate, a display panel and a display device, including at least two gate lines in a display area, a gate driving circuit and at least two gate fan-out lines in a non-display are described. One end of each of the gate fan-out lines are electrically connected with one signal output of the gate driving circuit and the other end of each of the gate fan-out lines are electrically connected with the gate lines. By configuring a first gate fan-out line of the gate fan-out lines and the gate driving circuit to have an overlapping area outside a mutual connection area, an area where the gate fan-out lines are overlaps the gate driving circuit, space occupied by the first gate fan-out line outside the gate driving circuit is decreased to shorten a distance between the gate driving circuit and the display area.

公开(公告)号：US20190041681A1

公开(公告)日：2019-02-07

申请号：US16139215

申请日：2018-09-24

Applicant: Xiamen Tianma Micro-Electronics Co., Ltd.

Inventor： Guochang LAI ,  Hongbo ZHOU ,  Huangyao WU ,  Zhongjie ZHANG ,  Qiongqin MAO

IPC: G02F1/1345 ,  G02F1/1335 ,  G02F1/1362

CPC classification number: G02F1/13452 ,  G02F1/133528 ,  G02F1/13458 ,  G02F1/136204 ,  G02F1/136286 ,  G02F2202/16 ,  G02F2202/22 ,  G02F2202/28 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/49855 ,  H01L23/5387 ,  H01L23/5388 ,  H01L27/3244 ,  H01L27/3276

Abstract: A display panel and a display device are provided. The display panel includes a first substrate having a step area; a second substrate disposed opposite to the first substrate, wherein the second substrate has a first surface facing the first substrate and an opposite second surface; a Chip On Flex (COF) disposed on the step area of the first substrate and including at least one ground pad; a conductive layer disposed on the second surface of the second substrate; and a conductive adhesive electrically connected to the conductive layer and the at least one ground pad.