公开(公告)号：US20180303418A1

公开(公告)日：2018-10-25

申请号：US15861257

申请日：2018-01-03

申请人： The Board of Trustees of the University of Illinois

发明人： John A. ROGERS ,  Ming YING ,  Andrew BONIFAS ,  Nanshu LU

IPC分类号： A61B5/00 ,  A61B5/01 ,  A61B42/10 ,  H05K3/30 ,  H05K1/18 ,  H05K1/16 ,  H05K1/11 ,  H05K1/02 ,  A61N1/04

CPC分类号： A61B5/6806 ,  A41D19/015 ,  A61B5/01 ,  A61B5/1125 ,  A61B5/483 ,  A61B5/4875 ,  A61B5/6826 ,  A61B5/6843 ,  A61B5/7455 ,  A61B34/35 ,  A61B34/76 ,  A61B42/10 ,  A61B2034/741 ,  A61B2505/05 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/029 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/227 ,  A61N1/0456 ,  A61N1/0476 ,  H01L23/5388 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/303 ,  H05K7/02 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  H01L2924/00

摘要： Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

公开(公告)号：US10052066B2

公开(公告)日：2018-08-21

申请号：US15375514

申请日：2016-12-12

申请人： The Board of Trustees of the University of Illinois

发明人： John A. Rogers ,  Ming Ying ,  Andrew Bonifas ,  Nanshu Lu

IPC分类号： H05K1/00 ,  A61B5/00 ,  A61B42/10 ,  A61N1/04 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H05K3/30 ,  A61B5/01

CPC分类号： A61B5/6806 ,  A41D19/015 ,  A61B5/01 ,  A61B5/1125 ,  A61B5/483 ,  A61B5/4875 ,  A61B5/6826 ,  A61B5/6843 ,  A61B5/7455 ,  A61B34/35 ,  A61B34/76 ,  A61B42/10 ,  A61B2034/741 ,  A61B2505/05 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/029 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/227 ,  A61N1/0456 ,  A61N1/0476 ,  H01L23/5388 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/303 ,  H05K7/02 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  H01L2924/00

摘要： Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

公开(公告)号：US09870929B2

公开(公告)日：2018-01-16

申请号：US14882887

申请日：2015-10-14

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Chien Ling Hwang ,  Hsin-Hung Liao ,  Yu-Ting Chiu

IPC分类号： H01L27/08 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H01L23/538 ,  H01L23/498

CPC分类号： H01L21/4814 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5388 ,  H01L24/17 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2924/19042

摘要： A package structure includes a spiral coil, a redistribution layer (RDL) and a molding material. The molding material fills gaps of the spiral coil. The spiral coil is connected to the RDL. A fan-out package structure includes a spiral coil, an RDL and a die. The spiral coil has a depth-to-width ratio greater than about 2. The RDL is connected to the spiral coil. The die is coupled to the spiral coil through the RDL. A semiconductor packaging method includes: providing a carrier; adhering a spiral coil on the carrier; adhering a die on the carrier; dispensing a molding material on the carrier to fill gaps between the spiral coil and the die; and disposing a redistribution layer (RDL) over the carrier so as to connect the spiral coil with the die.

公开(公告)号：US20170181704A1

公开(公告)日：2017-06-29

申请号：US15375514

申请日：2016-12-12

申请人： The Board of Trustees of the University of Illinois

发明人： John A. ROGERS ,  Ming YING ,  Andrew BONIFAS ,  Nanshu LU

IPC分类号： A61B5/00 ,  A61B5/01 ,  H05K1/18 ,  A61N1/04 ,  H05K3/30 ,  H05K1/16 ,  H05K1/11 ,  A61B42/10 ,  H05K1/02

CPC分类号： A61B5/6806 ,  A41D19/015 ,  A61B5/01 ,  A61B5/1125 ,  A61B5/483 ,  A61B5/4875 ,  A61B5/6826 ,  A61B5/6843 ,  A61B5/7455 ,  A61B34/35 ,  A61B34/76 ,  A61B42/10 ,  A61B2034/741 ,  A61B2505/05 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/029 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/227 ,  A61N1/0456 ,  A61N1/0476 ,  H01L23/5388 ,  H01L2224/95 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/303 ,  H05K7/02 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  H01L2924/00

摘要： Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

公开(公告)号：US09508651B2

公开(公告)日：2016-11-29

申请号：US12039511

申请日：2008-02-28

申请人： Masanori Onodera ,  Junichi Kasai

发明人： Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L23/48 ,  H01L23/538 ,  H01L21/683 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/08 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/5388 ,  H01L24/03 ,  H01L24/17 ,  H01L24/19 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/02333 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/18162 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/83005

摘要： A semiconductor device includes a semiconductor chip, a bump electrode, a molding portion, a redistribution layer and an outer connection electrode. The bump electrode is provided on an upper face of the semiconductor chip. The molding portion encapsulates an entire side face of the semiconductor chip and seals the bump electrode so that a part of the bump electrode is exposed. The redistribution layer is provided on an upper face of the molding portion and is electrically coupled to the semiconductor chip via the bump electrode. The outer connection electrode is provided on an upper face of the redistribution layer and is electrically coupled to the bump electrode via the redistribution layer.

摘要翻译： 半导体器件包括半导体芯片，凸块电极，成型部分，再分配层和外部连接电极。 凸起电极设置在半导体芯片的上表面上。 模制部分封装半导体芯片的整个侧面并且密封凸起电极，以使凸起电极的一部分露出。 再分配层设置在模制部分的上表面上，并且经由凸块电极电耦合到半导体芯片。 外部连接电极设置在再分布层的上表面上，并且经由再分配层电连接到凸块电极。

公开(公告)号：US08519509B2

公开(公告)日：2013-08-27

申请号：US13082468

申请日：2011-04-08

申请人： Kosei Noda ,  Seiji Yasumoto ,  Kensuke Yoshizumi ,  Toshiyuki Miyamoto

发明人： Kosei Noda ,  Seiji Yasumoto ,  Kensuke Yoshizumi ,  Toshiyuki Miyamoto

IPC分类号： H01L29/00 ,  H01L29/04 ,  H01L31/036 ,  H01L27/10

CPC分类号： H01L27/1214 ,  G11C17/16 ,  H01L23/5252 ,  H01L23/5388 ,  H01L23/60 ,  H01L23/642 ,  H01L23/66 ,  H01L27/10 ,  H01L27/1021 ,  H01L27/105 ,  H01L27/112 ,  H01L27/11206 ,  H01L27/11286 ,  H01L27/1203 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object of one embodiment of the present invention is to provide an antifuse which has low writing voltage. The antifuse is used for a memory element for a read only memory device. The antifuse includes a first conductive layer, an insulating layer, a semiconductor layer, and a second conductive layer. The insulating layer included in the antifuse is a silicon oxynitride layer formed by adding ammonia to a source gas. When hydrogen is contained in the layer at greater than or equal to 1.2×1021 atoms/cm3 and less than or equal to 3.4×1021 atoms/cm3 or nitrogen is contained in the layer at greater than or equal to 3.2×1020 atoms/cm3 and less than or equal to 2.2×1021 atoms/cm3, writing can be performed at low voltage.

摘要翻译： 本发明的一个实施例的目的是提供一种具有低写入电压的反熔丝。 反熔丝用于只读存储器件的存储元件。 反熔丝包括第一导电层，绝缘层，半导体层和第二导电层。 包含在反熔丝中的绝缘层是通过向源气体添加氨形成的氧氮化硅层。 当层中含有大于或等于1.2×1021原子/ cm3且小于或等于3.4×1021原子/ cm3的氢时，或层中含氮大于或等于3.2×1020原子/ cm3 小于或等于2.2×1021原子/ cm3，可以在低电压下进行写入。

公开(公告)号：US08351982B2

公开(公告)日：2013-01-08

申请号：US11805563

申请日：2007-05-23

申请人： Ahmadreza Rofougaran

发明人： Ahmadreza Rofougaran

IPC分类号： H04M1/00

CPC分类号： H01L23/49855 ,  H01L23/5385 ,  H01L23/5388 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers. Additionally, a multi-mode transceiver is operable to configure transmit and receive circuitry based upon transmission path.

摘要翻译： 无线电收发器装置包括用于通过空间在非常高的射频辐射电磁信号以及通过形成在衬底材料内的波导来辐射电磁信号的电路。 在一个实施例中，基板包括形成在板内的电介质基板，例如印刷电路板。 在本发明的另一实施例中，波导形成在集成电路无线电收发器的管芯内。 定义了具有不同功能的多个收发器。 基板收发器可操作以通过波导传输，而本地收发器可操作以通过空间产生非常短距离的无线传输。 第三个也是最终的收发器是用于与远程（非本地到设备）收发器进行通信的典型无线收发器。 此外，多模式收发器可操作以基于传输路径来配置发送和接收电路。

公开(公告)号：US08274141B2

公开(公告)日：2012-09-25

申请号：US12400390

申请日：2009-03-09

申请人： Taku Nishiyama ,  Tetsuya Yamamoto ,  Naohisa Okumura ,  Takuya Futatsuyama

发明人： Taku Nishiyama ,  Tetsuya Yamamoto ,  Naohisa Okumura ,  Takuya Futatsuyama

IPC分类号： H01L23/02

CPC分类号： H01L23/5388 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor memory card includes a wiring board having an outer shape where a cut-out portion is provided at a first long-edge. A second surface of the wiring board includes connection pads disposed along a portion except the cut-out portion of the first long-edge. A memory device is mounted on the second surface of the wiring board. The memory device includes electrode pads arranged along a long-edge positioning in a vicinity of the first long-edge of the wiring board, and one-sidedly disposed so as to correspond to disposed positions of the connection pads. A controller device is stacked on the memory device.

摘要翻译： 半导体存储卡包括具有外部形状的布线板，其中切口部分设置在第一长边缘处。 布线板的第二表面包括沿着除了第一长边缘的切口部分之外的部分设置的连接焊盘。 存储器件安装在布线板的第二表面上。 存储装置包括沿着布线板的第一长边缘附近的长边定位布置的电极焊盘，并且一边设置成与连接焊盘的布置位置相对应。 控制器装置堆叠在存储器件上。

公开(公告)号：US08141240B2

公开(公告)日：2012-03-27

申请号：US11966871

申请日：2007-12-28

申请人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

发明人： Siew S. Hiew ,  Nan Nan ,  Paul Hsueh ,  Abraham C. Ma ,  Ming-Shiang Shen

IPC分类号： H05K3/30 ,  H05K3/00 ,  H01L23/00

CPC分类号： H05K3/0052 ,  H01L21/561 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/0909 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49146 ,  Y10T29/49789 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating MicroSD devices includes forming a PCB panel having multiple PCBs arranged in parallel rows, with each PCB connected to its neighboring PCBs in each row by relatively narrow connecting bridge pieces, and separated from PCBs of adjacent rows by elongated stamped out blank slots. Passive components are attached by conventional surface mount technology (SMT) techniques. IC chips, including a MicroSD controller chip and a flash memory chip, are attached to the PCB by wire bonding or other chip-on-board (COB) technique. A molded housing is then formed over the IC chips and passive components using a mold that prevents formation of plastic on the upper surface of each PCB. The connecting bridge pieces are then cut using using a rotary saw. A front edge chamfer process is then performed.

摘要翻译： 一种用于制造MicroSD器件的方法包括形成具有以平行排布置的多个PCB的PCB面板，每个PCB通过相对较窄的连接桥接件连接到每一行中的相邻PCB，并且通过细长冲裁的空白狭槽与相邻行的PCB分离 。 无源元件通过常规表面贴装技术（SMT）技术连接。 包括MicroSD控制器芯片和闪存芯片在内的IC芯片通过引线接合或其他芯片上的（COB）芯片技术连接到PCB。 然后使用防止在每个PCB的上表面上形成塑料的模具在IC芯片和无源部件上形成模制外壳。 然后使用旋转锯切割连接的桥接件。 然后执行前沿倒角处理。

公开(公告)号：US08136725B2

公开(公告)日：2012-03-20

申请号：US12510668

申请日：2009-07-28

申请人： Shunpei Yamazaki

发明人： Shunpei Yamazaki

IPC分类号： G06K5/00

CPC分类号： G06K19/07747 ,  G06K19/0704 ,  G06K19/072 ,  G06K19/0723 ,  G06K19/077 ,  G06K19/07703 ,  G06K19/07743 ,  G06K19/07749 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： The present invention includes an IC card that can realize high function without increasing the size of an IC chip, and that can realize cost reduction. The IC card has a first single crystal integrated circuit, a second integrated circuit, and a display device. The second integrated circuit and the display device are each formed from a thin film semiconductor film, over a plastic substrate, and the first single crystal integrated circuit is mounted on the plastic substrate so as to be electrically connected to the second integrated circuit.

摘要翻译： 本发明包括可以在不增加IC芯片的尺寸的情况下实现高功能并且可以实现成本降低的IC卡。 IC卡具有第一单晶集成电路，第二集成电路和显示装置。 第二集成电路和显示装置各自由塑料基板上的薄膜半导体膜形成，并且第一单晶集成电路安装在塑料基板上，以便电连接到第二集成电路。