Abstract:
A heat sink for cooling an electronic element of a circuit board includes a dissipating part configured for dissipating heat, and a mounting part configured for mounting the heat sink to the circuit board. The mounting part extends from the dissipating part integrally.
Abstract:
An electronic device includes a bottom plate, a circuit board having an electronic component, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall defining a number of spaced slots, and a number of stop plates selectively inserted into the corresponding slots of the airflow guide wall, to leave some of the slots directly in front of the bottom of the electronic component open.
Abstract:
A clamp includes a main shaft, a clamping sleeve, an elastic element, and a securing cap. The main shaft includes a base portion and a guide bar. The base portion includes a first end surface, and a second end surface. The base portion defines a first receiving hole in the second end surface. The guide bar extends from the base portion. The clamping sleeve is arranged around the guide bar, and includes an outer sidewall for allowing a cable to wind. The elastic element is arranged around the guide bar. The securing cap is threadedly engaged with the guide bar, and the securing cap configured for rotatably operated to press the elastic element toward the clamping sleeve, such that the elastic element pushes the clamping sleeve against the base portion to clamp the cable between the outer sidewall and an inner sidewall of the base portion.
Abstract:
A mounting apparatus includes a shockproof member and a fixing member. The shockproof member includes a first block plate and a sleeve extending from the first block plate. The sleeve defines a first through hole thereon extending through the first block plate. The fixing member includes a second block plate, a mounting post extending from the second block plate to extend through the first through hole, a pin, and a contact post. The mounting post includes two raised portions fixed on the mounting post. Each of the two raised portions defines a pin hole. The contact post defines a second through hole thereon. The contact post is pivotably secured to the mounting post by the pin running through the pin holes and the second through hole.
Abstract:
A heat dissipating system includes a chassis, a motherboard mounted in the chassis, a number of connectors mounted on the motherboard in parallel to form a passage between every two adjacent connectors, and a heat dissipating element mounted to the chassis and aligned with the passages. Each of the connectors includes a socket and an inserting portion. The socket defines a slot. The inserting portion includes a main body and a protrusion extending from the main body towards the slot. A cross-section of the protrusion is trapezoidal-shaped. A side surface of the protrusion is inclined to form an airflow guiding structure.
Abstract:
An electronic device enclosure includes a wall defining a slot therein, and a number of spaced bent plates formed on the wall bestriding the slot. Every two adjacent bent plates bound an opening in communication with the slot. The slot can allow more airflow to pass therethrough, and the number of bent plates can guide more airflow slantingly flowing towards the wall of the electronic device enclosure into or out the electronic device enclosure through the openings.
Abstract:
A desoldering device is configured for desoldering a multi-pin electronic element from a circuit board. The desoldering device includes an iron and an attachment. The attachment is attached to the iron. The attachment includes a plate. A number of through holes are defined in the plate to allow pins of the multi-pin element to extend therethrough. Heat is capable of being transmitted from the iron the plate to melt soldered tins around the pins of the multi-pin element.
Abstract:
A fan is used to be fixed on an enclosure to dissipate heat from the enclosure. The fan includes a body, a magnetic fixing element mounted on the body, a power connector connected to the body; and a universal serial bus (USB) connector connected to the power connector. The body is fixed on the enclosure under magnetic force of the fixing element. The power connector and the USB connector are selectively connected to a motherboard to receive a voltage to power the body of the fan, to dissipate heat from the enclosure after the motherboard is powered on.
Abstract:
An environmental testing device includes a humidity control module, a temperature control module; and an air circulation module. The air circulation module includes an enclosure and a fan received in the enclosure. Two pairs of airflow openings are defined in the enclosure and form different airflow passages that allow air to flow along different directions in the environmental testing device.
Abstract:
A connector assembly includes a first connector and a second connector. The second connector includes first and second sub-connectors. The first sub-connector includes a first sidewall on which a locking portion is formed. The second sub-connector includes a second sidewall on which a receiving portion is formed to engagably receiving the locking portion thereby combining the first and second sub-connectors together.