MULTI-CHIP STACKED DEVICES
    3.
    发明申请

    公开(公告)号:US20210217729A1

    公开(公告)日:2021-07-15

    申请号:US16741319

    申请日:2020-01-13

    Applicant: XILINX, INC.

    Abstract: Examples described herein generally relate to multi-chip devices having stacked chips. In an example, a multi-chip device includes a chip stack that includes chips. One or more chips each includes a selection circuit and a broken via pillar that includes first and second continuous portions. The first continuous portion includes a through substrate via and a first metal line. The second continuous portion includes a second metal line. The first and second metal lines are disposed within dielectric layers disposed on a side of the semiconductor substrate of the respective chip. The first and second continuous portions are aligned in a direction normal to the side of the semiconductor substrate. An input node of the selection circuit is connected to one of the first or second metal line. An output node of the selection circuit is connected to the other of the first or second metal line.

    ADAPTIVE WRITE SCHEME FOR MEMORY DEVICES

    公开(公告)号:US20250061926A1

    公开(公告)日:2025-02-20

    申请号:US18235739

    申请日:2023-08-18

    Applicant: XILINX, INC.

    Abstract: Memory driver circuitry for driving a memory cell or cells of a memory device includes first driver path circuitry and selection circuitry. The first driver path circuitry includes driver circuitry that outputs a first signal and selection circuitry that receives the first signal and a second signal, and outputs a first selected signal. The first selected signal is a selected one of the first signal and the second signal. The selection circuitry of the memory driver circuitry receives a third signal and a fourth signal, and outputs a bias voltage signal to header circuitry of a memory cell. The bias voltage signal is a selected one of the third signal and the fourth signal. The third signal corresponds to the first selected signal.

    THIN OXIDE LOW VOLTAGE TO HIGH VOLTAGE LEVEL SHIFTERS

    公开(公告)号:US20250047285A1

    公开(公告)日:2025-02-06

    申请号:US18229152

    申请日:2023-08-01

    Applicant: XILINX, INC.

    Abstract: A level shifter may include a first transistor stack including at least four transistors arranged from a first voltage source to ground, including second and third transistors coupled with bias voltage source, and a fourth transistor coupled with an input to receive an input signal at a second voltage or ground. The level shifter may include a second transistor stack comprising at least four transistors arranged from the first voltage source to ground, including second and third transistors coupled with the bias voltage source, and a fourth transistor to receive an inverse of the input signal. A first transistor of the first transistor stack is cross-coupled with a first transistor of the second transistor stack. A level shifter may include a first output coupled with the second transistor stack between the second and third transistors to provide a first output signal at the first voltage or ground.

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