公开(公告)号：US20140252642A1

公开(公告)日：2014-09-11

申请号：US14198542

申请日：2014-03-05

Applicant: XINTEC INC.

Inventor： Bai-Yao LOU ,  Shih-Kuang CHEN ,  Sheng-Yuan LEE

IPC: H01L23/48 ,  H01L21/78

CPC classification number: H01L23/48 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An embodiment of the invention provides a chip package which includes: a semiconductor substrate; a device region formed in the semiconductor substrate; at least a conducting pad disposed over a surface of the semiconductor substrate; a protection plate disposed over the surface of the semiconductor substrate; and a spacer layer disposed between the surface of the semiconductor substrate and the protection plate, wherein the protection plate and the spacer layer surround a cavity over the device region, the spacer layer has an outer side surface away from the cavity, and the outer side surface of the spacer layer is not a cutting surface.

Abstract translation: 本发明的实施例提供一种芯片封装，其包括：半导体衬底; 形成在所述半导体衬底中的器件区域; 至少一个设置在所述半导体衬底的表面上的导电焊盘; 设置在所述半导体衬底的表面上的保护板; 以及设置在所述半导体衬底的表面和所述保护板之间的间隔层，其中所述保护板和所述间隔层围绕所述器件区域的空腔，所述间隔层具有远离所述腔的外侧表面，并且所述外侧 间隔层的表面不是切割面。