公开(公告)号：US20130307137A1

公开(公告)日：2013-11-21

申请号：US13898300

申请日：2013-05-20

Applicant: XINTEC INC.

Inventor： Po-Shen LIN ,  Tsang-Yu LIU ,  Yen-Shih HO ,  Chih-Wei HO ,  Yu-Min LIANG

IPC: H01L23/498 ,  H01L21/78

CPC classification number: H01L23/498 ,  B81B7/0077 ,  H01L21/78 ,  H01L24/94 ,  H01L27/14618 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00

Abstract: Embodiments of the present invention provide a chip package including: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate; a dielectric layer disposed on the first surface; and a conducting pad structure disposed in the dielectric layer and electrically connected to the device region; a cover substrate disposed between the chip and the cover substrate, wherein the spacer layer, a cavity is created an surrounded by the chip and the cover substrate on the device region, and the spacer layer is in direct contact with the chip without any adhesion glue disposed between the chip and the spacer layer.

Abstract translation: 本发明的实施例提供了一种芯片封装，包括：具有第一表面和第二表面的半导体衬底; 形成在所述半导体衬底中的器件区域; 设置在所述第一表面上的电介质层; 以及导电焊盘结构，其设置在所述电介质层中并电连接到所述器件区域; 设置在所述芯片和所述盖基板之间的覆盖基板，其中所述间隔层，空腔由所述芯片和所述器件区域上的覆盖基板所围绕，并且所述间隔层与所述芯片直接接触而没有任何粘合胶 设置在芯片和间隔层之间。