公开(公告)号：US09238365B1

公开(公告)日：2016-01-19

申请号：US14454186

申请日：2014-08-07

Applicant: Xerox Corporation

Inventor： Peter J. Nystrom ,  Gary D. Redding ,  Mark A. Cellura ,  Jon G. Judge ,  Chad D. Freitag ,  Samuel V. Schultz ,  Chad J. Slenes

IPC: B41J2/14 ,  B41J2/16 ,  H05K1/02

CPC classification number: H05K1/028 ,  B41J2/14233

Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Abstract translation: 柔性电路板提供围绕柔性电路板中的开口的电隔离材料岛，以保持通过柔性电路板的电绝缘层的通路的流体完整性。 电隔离的岛环绕通过电绝缘材料的通道的出口，并且将通道延伸穿过柔性电路板的导电层。 因此，柔性电路板中通过通道和电隔离岛的流体不受电流的影响。

公开(公告)号：US20160039205A1

公开(公告)日：2016-02-11

申请号：US14454186

申请日：2014-08-07

Applicant: Xerox Corporation

Inventor： Peter J. Nystrom ,  Gary D. Redding ,  Mark A. Cellura ,  Jon G. Judge ,  Chad D. Freitag ,  Samuel V. Schultz ,  Chad J. Slenes

IPC: B41J2/14 ,  H05K1/02

CPC classification number: H05K1/028 ,  B41J2/14233

Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

Abstract translation: 柔性电路板提供围绕柔性电路板中的开口的电隔离材料岛，以保持通过柔性电路板的电绝缘层的通路的流体完整性。 电隔离的岛环绕通过电绝缘材料的通道的出口，并且将通道延伸穿过柔性电路板的导电层。 因此，柔性电路板中通过通道和电隔离岛的流体不受电流的影响。

公开(公告)号：US10377133B2

公开(公告)日：2019-08-13

申请号：US15605706

申请日：2017-05-25

Applicant: XEROX CORPORATION

Inventor： Chad D. Freitag ,  Chanthy Luy ,  Samuel V. Schultz ,  Garry A. Jones

IPC: B41J2/14 ,  B41J2/16 ,  B32B7/12 ,  B41N1/24 ,  B32B3/18

Abstract: A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

公开(公告)号：US09682589B2

公开(公告)日：2017-06-20

申请号：US14599920

申请日：2015-01-19

Applicant: XEROX CORPORATION

Inventor： Chad D. Freitag ,  Chanthy Luy ,  Samuel V. Schultz ,  Garry A. Jones

IPC: B41J2/01 ,  B41N1/24 ,  B41J2/16 ,  B32B7/12 ,  B41J2/14 ,  B32B3/18

CPC classification number: B41N1/24 ,  B32B3/18 ,  B32B7/12 ,  B32B2255/00 ,  B32B2307/202 ,  B32B2457/08 ,  B41J2/14 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362

Abstract: An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.