公开(公告)号：US08637013B2

公开(公告)日：2014-01-28

申请号：US13426392

申请日：2012-03-21

Applicant: Yang Liu ,  Pan Zheng ,  Guo-Yun Chen ,  Xincheng Zheng ,  Xi Cheng ,  Steve Kunkel

Inventor： Yang Liu ,  Pan Zheng ,  Guo-Yun Chen ,  Xincheng Zheng ,  Xi Cheng ,  Steve Kunkel

IPC: A61K39/395 ,  A61K39/00 ,  A61K38/16

CPC classification number: C07K16/18 ,  A61K31/351 ,  A61K38/177 ,  A61K45/06 ,  A61K2039/505 ,  C07K14/70596 ,  C07K16/2803 ,  C07K16/2896 ,  C07K2319/30 ,  A61K2300/00

Abstract: The present technology provides methods and compositions for the treatment of tissue-damage related immune dysregulation by administering a composition comprising one or more of CD24; CD24 fragments, variants and derivatives, CD24Fc fusion proteins; HMBG1-binding proteins, binding proteins to HMBG1 Box B; antagonists of HMGB1, polyclonal, monoclonal, recombinant, chimeric, humanized scFv antibodies and antibody fragments to HMGB1 or fragments of HMGB1 and antibodies that bind and suppress the activity of HMGB1 Box B; Siglec 10 agonists such as anti-Siglec 10 antibodies; and combinations thereof to a patient.

Abstract translation: 本技术提供了通过施用包含一种或多种CD24的组合物来治疗组织损伤相关免疫失调调节的方法和组合物; CD24片段，变体和衍生物，CD24Fc融合蛋白; HMBG1结合蛋白，HMBG1盒B结合蛋白; HMGB1的多肽，单克隆，重组，嵌合，人源化scFv抗体和HMGB1抗体片段或HMGB1片段的抗体以及结合并抑制HMGB1盒B活性的抗体的拮抗剂; Siglec 10激动剂如抗Siglec 10抗体; 及其组合。

公开(公告)号：US20240014182A1

公开(公告)日：2024-01-11

申请号：US17419854

申请日：2021-05-12

Applicant: Xi Cheng

Inventor： Xi Cheng

IPC: H01L25/075 ,  H01L33/20

CPC classification number: H01L25/0753 ,  H01L33/20

Abstract: The present application discloses a backlight module and a display device. The backlight module includes a substrate, a plurality of LED chips, and a sealant layer. The plurality of LED chips are arranged on the substrate at intervals, and the sealant layer is arranged on the substrate and covers the plurality of LED chips; the sealant layer is provided with a plurality of recesses on a side away from the LED chips, and the plurality of recesses is arranged above the plurality of LED chips in a one-to-one correspondence to the plurality of LED chips, so that light directly above the LED chips is opened to surroundings, and side light emission of the LED chips is increased, thereby increasing brightness of an area between adjacent ones of the LED chips, thus reducing a probability of dark shadows occurring.