公开(公告)号：US20200006186A1

公开(公告)日：2020-01-02

申请号：US16024670

申请日：2018-06-29

Applicant: Xilinx, Inc.

Inventor： Hong-Tsz Pan ,  Jonathan Chang ,  Nui Chong ,  Henley Liu ,  Gamal Refai-Ahmed ,  Suresh Ramalingam

IPC: H01L23/367 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/528

Abstract: A method and apparatus are provided that includes an integrated circuit die having an in-chip heat sink, along with an electronic device and a chip package having the same, and methods for fabricating the same. In one example, an integrated circuit die has an in-chip heat sink that separates a high heat generating integrated circuit from another integrated circuit disposed within the die. The in-chip heat sink provides a highly conductive heat transfer path from interior portions of the die to at least one exposed die surface.