公开(公告)号：US11476556B1

公开(公告)日：2022-10-18

申请号：US17102149

申请日：2020-11-23

Applicant: XILINX, INC.

Inventor： Mohsen H. Mardi ,  Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Volker Aue

IPC: H01Q1/00 ,  H01Q1/02 ,  F28F1/42 ,  F28F1/00 ,  H01Q1/42

Abstract: A heat exchanger and an antenna assembly having the same are described herein that enable a compact antenna design with good thermal management. In one example, a heat exchanger is provided that includes tube-shaped body. A main cooling volume is formed between the top and bottom surfaces proximate to the outside wall. The main cooling volume has an inlet formed through the top surface and an outlet formed through the bottom surface. A return volume is formed adjacent the inside diameter wall and is circumscribed by the main cooling volume. The return volume has an outlet formed through the top surface and an inlet formed through the bottom surface. One or more exterior fins are coupled to an exterior side of the outside wall. A plurality of fins extend into the main cooling volume. A plurality of inner fins extend into a passage from the inside diameter wall.

公开(公告)号：US11246211B1

公开(公告)日：2022-02-08

申请号：US17188795

申请日：2021-03-01

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Nagadeven Karunakaran ,  Hoa Do ,  Suresh Ramalingam

IPC: H05K1/02

Abstract: Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB.

公开(公告)号：US10720377B2

公开(公告)日：2020-07-21

申请号：US16186178

申请日：2018-11-09

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Ho Hyung Lee ,  Hui-Wen Lin ,  Henley Liu ,  Suresh Ramalingam

IPC: H01L29/40 ,  H01L23/40 ,  H01L23/48 ,  H01L23/00 ,  H01L23/427

Abstract: Examples described herein provide for an electronic device apparatus with multiple thermally conductive paths for heat dissipation. In an example, an electronic device apparatus includes a package comprising a die attached to a package substrate. The electronic device apparatus further includes a ring stiffener disposed around the die and on the package substrate, a heat sink disposed on the package, and a wedge disposed between the heat sink and the ring stiffener.

公开(公告)号：US10043730B2

公开(公告)日：2018-08-07

申请号：US14867349

申请日：2015-09-28

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Tien-Yu Lee ,  Ferdinand F. Fernandez ,  Suresh Ramalingam ,  Ivor G. Barber ,  Inderjit Singh ,  Nael Zohni

IPC: H01L23/10 ,  H01L23/367 ,  H01L25/065 ,  H01L23/373 ,  H01L25/00 ,  H01L23/16 ,  H01L25/18 ,  H01L23/04 ,  H01L23/473 ,  H01L21/48 ,  H01L23/00 ,  H01L23/40

Abstract: A method and apparatus are provided which improve heat transfer between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes a first IC die, a package substrate, a lid and a stiffener. The first IC die is coupled to the package substrate. The stiffener is coupled to the package substrate and circumscribes the first IC die. The lid has a first surface and a second surface. The second surface faces away from the first surface and towards the first IC die. The second surface of the lid is conductively coupled to the IC die, while the lid is mechanically decoupled from the stiffener.

公开(公告)号：US20180358280A1

公开(公告)日：2018-12-13

申请号：US15617774

申请日：2017-06-08

Applicant: Xilinx, Inc.

Inventor： Jaspreet Singh Gandhi ,  Henley Liu ,  Tien-Yu Lee ,  Gamal Refai-Ahmed ,  Myongseob Kim ,  Ferdinand F. Fernandez ,  Ivor G. Barber ,  Suresh Ramalingam

IPC: H01L23/367 ,  H01L23/10 ,  H01L23/055 ,  H01L25/00 ,  H01L25/065 ,  H01L21/48 ,  H01L23/00

Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a lid with recessed areas in the inner surfaces of the lid. The recessed areas (e.g., trenches) provide receptacles for accepting a portion of a thermal interface material (TIM) that may be forced out when the lid is positioned on the TIM above one or more integrated circuit (IC) dies during fabrication of the IC package. In this manner, the TIM bond line thickness (BLT) between the lid and the IC die(s) may be reduced for decreased thermal resistance, but sufficient interfacial adhesion is provided for the IC package with such a lid to avoid TIM delamination.

公开(公告)号：US10147664B2

公开(公告)日：2018-12-04

申请号：US15495720

申请日：2017-04-24

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Daniel Elftmann ,  Brian D. Philofsky ,  Anthony Torza

IPC: H01L23/10 ,  H01L23/34 ,  H01L23/367 ,  H05K1/18 ,  H01L23/433 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

Abstract: Chip packages and electronic devices are provided that include a heat sink flexibly interfaced with a die for enhanced temperature control. In one example, a solid state electronic assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate and a heat sink mounted over the first IC die. The heat sink includes a thermally conductive plate and a first thermal carrier. The first thermal carrier has a first end mechanically fixed to the conductive plate. The first thermal carrier has a second end cantilevered from the conductive plate. The second end is in conductive contact with a top surface of the first IC die.

公开(公告)号：US20180308783A1

公开(公告)日：2018-10-25

申请号：US15495720

申请日：2017-04-24

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Daniel Elftmann ,  Brian D. Philofsky ,  Anthony Torza

IPC: H01L23/367 ,  H05K1/18 ,  H01L23/433 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/433 ,  H01L23/4338 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32221 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K1/181 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/0665 ,  H01L2924/01006

Abstract: Chip packages and electronic devices are provided that include a heat sink flexibly interfaced with a die for enhanced temperature control. In one example, a solid state electronic assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate and a heat sink mounted over the first IC die. The heat sink includes a thermally conductive plate and a first thermal carrier. The first thermal carrier has a first end mechanically fixed to the conductive plate. The first thermal carrier has a second end cantilevered from the conductive plate. The second end is in conductive contact with a top surface of the first IC die.

公开(公告)号：US09812374B1

公开(公告)日：2017-11-07

申请号：US15466495

申请日：2017-03-22

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Brian D. Philofsky

IPC: H01L23/12 ,  H01L21/00 ,  H05K7/20 ,  H01L23/367 ,  H01L23/427 ,  H01L25/065 ,  H01L23/373 ,  H01L21/48

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L23/10 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/292 ,  H01L2224/29224 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: Methods and apparatus are described for heat management in an integrated circuit (IC) package using a device with a textured surface having multiple grooves in an otherwise relatively flat surface. The textured surface of the heat management device is designed, in conjunction with a thermal interface material (TIM), to push gas bubbles out of the flat areas such that the gas bubbles are trapped in the grooves or driven out of the interface between the device and the TIM altogether. The area of the grooves is small relative to the ungrooved areas (i.e., the flat areas), such that when the gas bubbles are trapped in the grooved areas, the ungrooved areas work even better for heat transfer. With the area of the regions for the flat portions being substantially greater than the area of the regions for the grooves, the textured heat management device is designed to lower thermal resistance, increase thermal conductivity, and increase heat transfer from one or more IC dies to a heat sink assembly in an IC package.

公开(公告)号：US11769710B2

公开(公告)日：2023-09-26

申请号：US16833034

申请日：2020-03-27

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Ken Chang ,  Mayank Raj ,  Chuan Xie ,  Yohan Frans

IPC: H01L23/473 ,  H01L25/16 ,  H01L23/367 ,  H01L23/40

CPC classification number: H01L23/473 ,  H01L23/3675 ,  H01L25/167 ,  H01L2023/4062

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

公开(公告)号：US11373929B1

公开(公告)日：2022-06-28

申请号：US16780305

申请日：2020-02-03

Applicant: XILINX, INC.

Inventor： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Suresh Ramalingam ,  Hoa Lap Do ,  Anthony Torza ,  Brian Philofsky ,  Arun Kumar Varadarajan Rajagopal

IPC: H01L23/473 ,  H01L23/467 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/427

Abstract: A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.