公开(公告)号：US08411420B2

公开(公告)日：2013-04-02

申请号：US12914988

申请日：2010-10-28

申请人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

发明人： Meng Fu ,  Chun-Chi Chen ,  Bang-Jie Xie

IPC分类号： H05K7/12

CPC分类号： F16M13/00 ,  F16M2200/08 ,  G06F1/1632 ,  H04R5/02

摘要： An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.

摘要翻译： 电子设备组件包括电子设备和固定电子设备的支架。 托架包括在其中限定第一接收槽的第一支撑座和在其中限定第二接收槽的第二支撑座。 根据两种可选布置中的任一种，第一支撑座可分离地附接到第二支撑座。 在第一种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第一方向的第一宽度的第一接收室。 在第二种布置中，第一接收槽和第二接收槽协作地限定具有用于将电子设备保持在第二方向的第二宽度的第二接收室。

公开(公告)号：US08422206B2

公开(公告)日：2013-04-16

申请号：US12914990

申请日：2010-10-28

申请人： Meng Fu ,  Bang-Jie Xie ,  Chun-Chi Chen

发明人： Meng Fu ,  Bang-Jie Xie ,  Chun-Chi Chen

IPC分类号： H05K7/16

CPC分类号： F16M13/00 ,  F16M11/105 ,  F16M2200/08

摘要： A consumer electronic product assembly includes a consumer electronic product and a bracket holding the consumer electronic product. The bracket includes a supporting seat, a holding member and a connecting bar. The holding member holds the consumer electronic product. Opposite ends of the connecting bar hinge on the holding member and the supporting seat, respectively. The connecting bar is rotatable with respect to the supporting seat, and the holding member is rotatable with respect to the connecting bar, whereby the consumer electronic product held by the holding member can be adjusted to various positions with respect to the supporting seat.

摘要翻译： 一种消费电子产品组件包括消费电子产品和一个保持消费电子产品的支架。 支架包括支撑座，保持构件和连接杆。 持有人持有消费电子产品。 连接杆的相对端分别在保持构件和支撑座上铰接。 连接杆相对于支撑座可旋转，并且保持构件可相对于连接杆旋转，由此保持构件保持的消费电子产品可以相对于支撑座调节到各种位置。

公开(公告)号：US09138840B2

公开(公告)日：2015-09-22

申请号：US13650499

申请日：2012-10-12

申请人： Qiao-Long Chen ,  Meng Fu ,  Zi-Fu Yang ,  Chun-Chi Chen

发明人： Qiao-Long Chen ,  Meng Fu ,  Zi-Fu Yang ,  Chun-Chi Chen

IPC分类号： B23P15/26 ,  B23P11/00 ,  H01L23/367 ,  H01L21/48 ,  F28F3/04 ,  F28F3/06

CPC分类号： B23P15/26 ,  B23P11/00 ,  B23P2700/10 ,  F28F3/048 ,  F28F3/06 ,  F28F2275/122 ,  H01L21/4878 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49908 ,  H01L2924/00

摘要： An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.

摘要翻译： 用于制造散热器的示例性方法包括以下步骤：提供具有在其上形成的多个间隔开的突起的基部; 提供多个翅片并弯曲每个翅片的远端以形成连接端; 将两个相邻突起之间的每个翅片相应地安装，并将每个翅片的连接端连接到基座; 并且使每个突起变形以按压两个相邻翅片的连接端。

公开(公告)号：US08199508B2

公开(公告)日：2012-06-12

申请号：US12503021

申请日：2009-07-14

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  H05K5/00 ,  H01L23/10 ,  F28F7/00

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

摘要翻译： 散热装置散发由安装在顶面印刷电路板上的发热电子元件产生的热量。 印刷电路板限定多个第一通孔。 散热装置包括位于印刷电路板顶侧的散热器。 散热器分别限定与第一通孔相对应的多个第二通孔。 第一散热器位于散热器上方，并且多个第二散热器位于印刷电路板的底侧。 多个热管延伸穿过散热器的第二通孔和印刷电路板的第一通孔，以将第一和第二散热器热连接到散热器。

公开(公告)号：US08002019B2

公开(公告)日：2011-08-23

申请号：US12051853

申请日：2008-03-20

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof.

摘要翻译： 散热装置包括基座，位于基座上的翅片组，第一热管和第二热管。 翅片组包括布置在第一鳍片组上的第一鳍片组，第二鳍片组和布置在第二鳍片组上的第三鳍片组。 第一热管包括夹在基部和第一翅片组之间的蒸发部分，夹在第一翅片组和第二翅片组之间的冷凝部分和将蒸发部分和冷凝部分互连的连接部分。 第二热管包括夹在基座和第一翅片组之间的蒸发部分，位于第二翅片组和第三翅片组之间的冷凝部分和将蒸发部分和其冷凝部分互连的连接部分。

公开(公告)号：US07969728B2

公开(公告)日：2011-06-28

申请号：US12399027

申请日：2009-03-06

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.

摘要翻译： 散热装置包括具有限定多个通道之间的多个翅片的散热器。 通道在散热器的前侧和后侧具有入口和出口。 两个调节构件安装在散热器的两个侧面。 风扇位于散热器通道的入口处，用于向散热器提供气流。 引导构件定位在散热器的通道的出口处，用于将气流引导到散热装置周围的电子部件。 引导构件与调节构件接合并且可相对于调节构件垂直移动，从而沿着散热器的高度调节引导构件的高度。

公开(公告)号：US07866376B2

公开(公告)日：2011-01-11

申请号：US11926701

申请日：2007-10-29

申请人： Lei Jiang ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Lei Jiang ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： F28D15/0233 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, including a first transferring portion thermally engaging with the base and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe includes an evaporation portion thermally engaging with the base and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.

摘要翻译： 散热装置包括用于接触电子设备的基座，与基座热接触的翅片组，第一热管和连接基座和翅片组的第二热管。 翅片组具有比基部大的底部和与其底部分离的上部。 第一热管具有与翅片组的底部热接触的平坦顶面，包括与基部热接合的第一传递部分和从第一传递部分延伸并突出超出基部的第二传递部分。 第二热管包括与基座热接合的蒸发部分和从蒸发部分延伸并与翅片组的上部接合的冷凝部分。

公开(公告)号：US07746640B2

公开(公告)日：2010-06-29

申请号：US11777034

申请日：2007-07-12

申请人： Lei Cao ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Lei Cao ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.

摘要翻译： 散热装置包括用于接触电子设备的基座，位于基座上的翅片组和第一热接合在基座中的第二热管。 第一热管包括第一传送部分和从第一传送部分的两个相对的自由端延伸的两个第二传送部分。 第二热管具有第一和第二传送部。 第二热管的第一传送部分位于第一热管的第一传送部分附近并且位于第一传送部分和第一热管的第二传​​送部分之一之间，第二传热部分的第二传热部分 管相邻于第一热管的第二转移部分之一。

公开(公告)号：US07597134B2

公开(公告)日：2009-10-06

申请号：US11683373

申请日：2007-03-07

申请人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

发明人： Xu-Xin Min ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing portion (14). The evaporating portions (12) are closely connected with each other. A flat bottom surface (125) of the evaporating portions (12) of the heat pipes (10) directly engages with an electronic component. A flat top surface (120) of the evaporating portions (12) of the heat pipes (10) directly engages with a bottom surface of the fins (20). The condensing portions (14) of the heat pipes (10) extend through the fins (20).

摘要翻译： 散热装置包括至少两个热管（10）和与热管（10）热连接的多个翅片（20）。 每个热管（10）包括平坦的蒸发部分（12）和冷凝部分（14）。 蒸发部分（12）彼此紧密连接。 热管（10）的蒸发部分（12）的平坦的底面（125）直接与电子部件接合。 热管（10）的蒸发部分（12）的平坦顶表面（120）直接与散热片（20）的底表面接合。 热管（10）的冷凝部分（14）延伸穿过翅片（20）。

公开(公告)号：US20070263358A1

公开(公告)日：2007-11-15

申请号：US11308847

申请日：2006-05-15

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/467 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.

摘要翻译： 散热装置包括与中央处理单元接触的主散热器（10）和附接在与中央处理单元相邻的发热电子元件上的二次散热器（20）。 主散热器包括设置在基座中间的基座（12）和散热部分（14）。 二次散热器包括基板（22）和布置在基板上的多个翅片组件（24）。 底座被放置在基板上，翅片组件布置在散热部分周围。 主散热器部分地叠置在具有紧凑结构的二次散热器上。 散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。