公开(公告)号：US20090096365A1

公开(公告)日：2009-04-16

申请号：US12250775

申请日：2008-10-14

Applicant: YAW-MING A. TSAI ,  MATTHEW STAINER

Inventor： YAW-MING A. TSAI ,  MATTHEW STAINER

IPC: H01J1/63 ,  H01L29/04 ,  H01L21/84

CPC classification number: H01L27/3246 ,  H01L51/56

Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon; and a bank structure defining pixel areas over the electrode structures. The bank structure is removed from and not in contact with the electrode structures by a distance of at least 0.1 microns.

Abstract translation: 提供了一种用于有机电子设备的背板。 该背板具有其上具有多个电极结构的TFT基板; 以及限定电极结构上的像素区域的堤结构。 堤结构从电极结构移除并不与电极结构接触至少0.1微米的距离。

公开(公告)号：US20090098680A1

公开(公告)日：2009-04-16

申请号：US12250788

申请日：2008-10-14

Applicant: YAW-MING A. TSAI ,  MATTHEW STAINER

Inventor： YAW-MING A. TSAI ,  MATTHEW STAINER

IPC: H01L51/10

CPC classification number: H01L27/3246 ,  H01L51/0004 ,  H01L51/0005 ,  H01L51/56 ,  H01L2251/558

Abstract: There is provided a backplane for an organic electronic device. The backplane has a TFT substrate having a multiplicity of electrode structures thereon; a bank structure defining pixel areas over the electrode structures; and a thin layer of insulative inorganic material between the electrode structures and the bank structures. The bank structure is removed from and not in contact with the electrode structures by a distance of at least 0.1 microns.

Abstract translation: 提供了一种用于有机电子设备的背板。 该背板具有其上具有多个电极结构的TFT基板; 定义电极结构上的像素区域的堤坝结构; 以及在电极结构和堤岸结构之间的绝缘无机材料层。 堤结构从电极结构移除并不与电极结构接触至少0.1微米的距离。

公开(公告)号：US20080173200A1

公开(公告)日：2008-07-24

申请号：US11972291

申请日：2008-01-10

Applicant: CHARLES DOUGLAS MACPHERSON ,  DENNIS DAMON WALKER ,  MATTHEW STAINER ,  CHRISTOPHER TODD KNUDSON ,  GANG YU

Inventor： CHARLES DOUGLAS MACPHERSON ,  DENNIS DAMON WALKER ,  MATTHEW STAINER ,  CHRISTOPHER TODD KNUDSON ,  GANG YU

IPC: B41L1/02

CPC classification number: H01L51/56 ,  H01L27/3211 ,  H01L27/3246 ,  H01L51/0005 ,  H05K3/1241 ,  Y10T428/24008

Abstract: An electronic device includes an array. In one embodiment, a process for forming an electronic device includes the array, which includes electronic components, can include printing one or more layers as a series of segments onto a workpiece. In one embodiment, a process includes printing a layer onto the workpiece and at least one exposed portion of the chuck. In still another embodiment, a printing head is greater than 0.5 mm from the workpiece. In a further embodiment, “hybrid” printing can be used to help form a thicker layer having a relatively thinner width. In a further embodiment, processes can be used to reduce the likelihood of a stitching defect, nonuniformity of a layer across an array, or a combination thereof. A printing apparatus can be modified to achieve more flexibility in liquid compositions, temperatures or other conditions used in printing a layer.

Abstract translation: 电子设备包括阵列。 在一个实施例中，用于形成电子设备的方法包括包括电子部件的阵列，可以包括将一个或多个层作为一系列片段印刷到工件上。 在一个实施例中，一种方法包括将层印刷到工件和卡盘的至少一个暴露部分上。 在另一个实施例中，打印头距离工件大于0.5mm。 在另一个实施例中，可以使用“混合”印刷来帮助形成具有相对较薄宽度的较厚层。 在另一实施例中，可以使用过程来减少缝合缺陷的可能性，跨阵列的层的不均匀性或其组合。 可以修改打印设备以在液体组合物，温度或印刷层中使用的其它条件下实现更大的灵活性。

公开(公告)号：US20070278501A1

公开(公告)日：2007-12-06

申请号：US11840367

申请日：2007-08-17

Applicant: CHARLES MACPHERSON ,  GORDANA SRDANOV ,  MATTHEW STAINER ,  GANG YU

Inventor： CHARLES MACPHERSON ,  GORDANA SRDANOV ,  MATTHEW STAINER ,  GANG YU

IPC: H01L31/12

CPC classification number: H01L51/0007 ,  H01L27/3211 ,  H01L51/0005 ,  H01L51/0037 ,  H01L51/0039 ,  H01L51/0052 ,  H01L51/56

Abstract: An electronic device made by a process that includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

Abstract translation: 一种通过包括在基底上形成第一层并将第一液体组合物放置在第一层的第一部分上的方法制造的电子器件。 第一液体组合物包括至少第一客体材料和第一液体介质。 第一液体组合物与第一层接触并且大量的第一客体材料与第一层混合。 电子器件包括衬底和覆盖衬底的连续的第一层。 连续层包括电子部件所在的第一部分和没有电子部件所在的第二部分。 第一部分为至少30nm厚，并且包括第一客体材料，并且第二部分不超过40nm厚。