公开(公告)号：US20120008284A1

公开(公告)日：2012-01-12

申请号：US12982813

申请日：2010-12-30

申请人： YU-CHING LIU ,  CHI-AN YU ,  XI-HANG LI ,  BING LIU ,  ZHI-BING LI ,  JIE-PENG KANG ,  JING-BIN LIANG ,  HAI-GUI HUANG

发明人： YU-CHING LIU ,  CHI-AN YU ,  XI-HANG LI ,  BING LIU ,  ZHI-BING LI ,  JIE-PENG KANG ,  JING-BIN LIANG ,  HAI-GUI HUANG

IPC分类号： H05K7/20

CPC分类号： H05K13/0486 ,  B23K1/018 ,  B23K3/00 ,  B23K3/08 ,  H05K7/20136

摘要： A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

摘要翻译： 一种用于电路板组件的修理装置包括用于电路板组件与待修复表面相对的表面的冷却装置。 冷却装置限定用于接收电路板组件的室。 电路板组件设置在室内以在电路板组件和室的底部之间限定热交换空间。 还提供了修复电路板组件的方法。

公开(公告)号：US20120218853A1

公开(公告)日：2012-08-30

申请号：US13207454

申请日：2011-08-11

申请人： YU-CHING LIU ,  FU-CHI YANG ,  CHI-AN YU ,  XI-HANG LI ,  BING LIU ,  JING-BIN LIANG ,  HAI-GUI HUANG ,  XUE-BING BAO

发明人： YU-CHING LIU ,  FU-CHI YANG ,  CHI-AN YU ,  XI-HANG LI ,  BING LIU ,  JING-BIN LIANG ,  HAI-GUI HUANG ,  XUE-BING BAO

IPC分类号： B01F11/00

CPC分类号： B01F11/0031 ,  B01F9/0014 ,  B01F9/10 ,  B01F11/0008

摘要： A solder paste mixer includes a housing, a vibration mechanism, a rotating mechanism, and a fixture for fixing a solder paste jar. The housing defines a receiving space, and the vibration mechanism and the rotating mechanism are retained within the receiving space. The fixture can be vibrated by the vibration mechanism and rotated by the rotating mechanism.

摘要翻译： 焊膏混合器包括壳体，振动机构，旋转机构和用于固定焊膏罐的固定装置。 壳体限定接收空间，并且振动机构和旋转机构保持在接收空间内。 夹具可以通过振动机构振动并由旋转机构旋转。

公开(公告)号：US20110299248A1

公开(公告)日：2011-12-08

申请号：US12949783

申请日：2010-11-19

申请人： YU-CHING LIU ,  CHI-AN YU ,  XI-HANG LI ,  BING LIU ,  BO XU ,  JIE-PENG KANG

发明人： YU-CHING LIU ,  CHI-AN YU ,  XI-HANG LI ,  BING LIU ,  BO XU ,  JIE-PENG KANG

IPC分类号： H05K7/20

CPC分类号： H05K7/20436 ,  H05K7/20445 ,  Y10T29/49002 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49352 ,  Y10T29/53113 ,  Y10T29/53274

摘要： A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.

摘要翻译： 用于冷却电子部件的冷却装置包括基板，电源和冷却模块。 冷却模块包括冷却片和导热基座。 冷却片包括热表面和冷却表面。 导热基座位于冷却片的冷却面的上方，构成为将印刷电路板上的电子部件支撑在电子部件与冷却面之间传递热量。 当冷却片通电时，冷却表面处于恒定的低温状态。 由于冷却表面和导热基底之间的热传递，来自电子部件的热量可以从导热基底连续传递到冷却表面。