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    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号：US20120250220A1

    公开(公告)日：2012-10-04

    申请号：US13491624

    申请日：2012-06-08

    申请人： Yasuharu YAMASHITA ,  Kenichi OKAJIMA ,  Hideaki TANAKA ,  Naoto MURANISHI ,  Daiki FUKUNAGA ,  Nagato OMORI

    发明人： Yasuharu YAMASHITA ,  Kenichi OKAJIMA ,  Hideaki TANAKA ,  Naoto MURANISHI ,  Daiki FUKUNAGA ,  Nagato OMORI

    IPC分类号： H01G4/12

    CPC分类号： H01G4/232 ,  H01G4/005 ,  H01G4/01 ,  H01G4/228 ,  H01G4/30

    摘要： A multilayer ceramic electronic component that is small, that has high electrical strength, and that is resistant to separation between ceramic layers includes a ceramic sintered body having a substantially rectangular parallelepiped shape and a plurality of first and second internal electrodes. The plurality of first and second internal electrodes are alternately arranged so as to face each other. The first and second internal electrodes are parallel or substantially parallel to first and second major surfaces. The first and second internal electrodes are exposed to at least one of the fifth and sixth surfaces and are not exposed to the third or fourth surface. No bends exist in any of the ends of each of the first and second internal electrodes adjacent to the third and fourth surfaces.

    摘要翻译： 小型，具有高的电气强度并且耐陶瓷层分离的多层陶瓷电子元件包括具有大致长方体形状的陶瓷烧结体和多个第一和第二内部电极。 多个第一和第二内部电极交替地布置成彼此面对。 第一和第二内部电极平行或基本平行于第一和第二主表面。 第一和第二内部电极暴露于第五和第六表面中的至少一个，并且不暴露于第三或第四表面。 在与第三和第四表面相邻的第一和第二内部电极中的每一个的任何端部中不存在弯曲。

    MONOLITHIC CERAMIC CAPACITOR
    2.
    发明申请
    MONOLITHIC CERAMIC CAPACITOR 有权
    单相陶瓷电容器

    公开(公告)号：US20120250217A1

    公开(公告)日：2012-10-04

    申请号：US13491626

    申请日：2012-06-08

    申请人： Daiki FUKUNAGA ,  Kenichi OKAJIMA ,  Yasuharu YAMASHITA ,  Naoto MURANISHI ,  Hideaki TANAKA

    发明人： Daiki FUKUNAGA ,  Kenichi OKAJIMA ,  Yasuharu YAMASHITA ,  Naoto MURANISHI ,  Hideaki TANAKA

    IPC分类号： H01G4/30

    CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12

    摘要： A monolithic ceramic capacitor includes a ceramic sintered body including a plurality of stacked ceramic layers, and first and second inner electrodes alternately arranged inside the ceramic sintered body to oppose each other in a stacking direction of the ceramic layers with the ceramic layers interposed between the adjacent first and second inner electrodes. Among the ceramic layers, a number N of the ceramic layers disposed between the first inner electrodes and the second inner electrodes is at least 232. A proportion of volume occupied by the first and second inner electrodes in the ceramic sintered body is at least about 0.37. A size of each of side gap portions is about 40 μm or less.

    摘要翻译： 一种叠层陶瓷电容器包括：陶瓷烧结体，其包括多个层叠的陶瓷层，以及第一和第二内部电极，其交替地布置在所述陶瓷烧结体的内部，以在所述陶瓷层的堆叠方向上彼此相对， 第一和第二内部电极。 在陶瓷层中，设置在第一内部电极和第二内部电极之间的数量N个陶瓷层至少为232.陶瓷烧结体中第一和第二内部电极占据的体积的比例为至少约0.37 。 每个侧部间隙部分的尺寸为约40μm或更小。

    MANUFACTURING METHOD FOR MONOLITHIC CERAMIC ELECTRONIC COMPONENT
    4.
    发明申请
    MANUFACTURING METHOD FOR MONOLITHIC CERAMIC ELECTRONIC COMPONENT 有权
    单片陶瓷电子元件的制造方法

    公开(公告)号：US20120233828A1

    公开(公告)日：2012-09-20

    申请号：US13418464

    申请日：2012-03-13

    申请人： Togo MATSUI ,  Minoru DOOKA ,  Hiroyoshi TAKASHIMA ,  Kenichi OKAJIMA

    发明人： Togo MATSUI ,  Minoru DOOKA ,  Hiroyoshi TAKASHIMA ,  Kenichi OKAJIMA

    IPC分类号： H01G4/12 ,  H01G4/30

    CPC分类号： H01G4/30 ,  H01G4/002 ,  H01G4/12 ,  H01G13/00 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/5157

    摘要： In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.

    摘要翻译： 在单块陶瓷电子部件的制造方法中，通过使用涂布板将陶瓷膏施加到在切割母体块之后获得的沿行和列方向排列的多个绿色芯片中的每一个的侧面。 在涂布工序中，通过使绿色芯片和涂布板沿着侧面延伸的方向相对移动，同时将绿色芯片与涂布板分离，将陶瓷浆料转移到侧面， 陶瓷浆料连接绿色芯片和应用板。