公开(公告)号：US07220319B2

公开(公告)日：2007-05-22

申请号：US10413136

申请日：2003-04-15

申请人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

发明人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

IPC分类号： H01L21/00 ,  C23C16/00

CPC分类号： B25B11/002 ,  Y10T279/23

摘要： This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

摘要翻译： 本申请公开了一种ESC阶段的结构，其中夹持电极被中间层和覆盖层夹持。 调节层和覆盖层在电介质板和夹持电极之间具有热膨胀系数。 本申请还公开了一种ESC台的结构，其中夹持电极被夹持在与夹持电极相反的内部应力的调节层和覆盖层。 本申请进一步公开了一种用于在基板保持在高于室温的温度下进行基板上的处理的基板处理装置，其包括在该过程期间保持基板的静电夹持台。

公开(公告)号：USRE42175E1

公开(公告)日：2011-03-01

申请号：US12470231

申请日：2009-05-21

申请人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

发明人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

IPC分类号： H01L21/00 ,  C23C16/00 ,  C23C14/00

CPC分类号： B25B11/002 ,  Y10T279/23

摘要： This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

摘要翻译： 本申请公开了一种ESC阶段的结构，其中夹持电极被中间层和覆盖层夹持。 调节层和覆盖层在电介质板和夹持电极之间具有热膨胀系数。 本申请还公开了一种ESC台的结构，其中夹持电极被夹持在与夹持电极相反的内部应力的调节层和覆盖层。 本申请进一步公开了一种用于在基板保持在高于室温的温度下进行基板上的处理的基板处理装置，其包括在该过程期间保持基板的静电夹持台。

公开(公告)号：US06535371B1

公开(公告)日：2003-03-18

申请号：US09299807

申请日：1999-04-26

申请人： Takashi Kayamoto ,  Toshihiko Hanamachi ,  Tadashi Inokuchi ,  Ryusuke Adachi

发明人： Takashi Kayamoto ,  Toshihiko Hanamachi ,  Tadashi Inokuchi ,  Ryusuke Adachi

IPC分类号： H02H2300

CPC分类号： H01L21/67103 ,  H01L21/6833 ,  H01L21/68757 ,  H05B3/143

摘要： A combination of a ceramic layer essentially consisting of magnesia ceramic material and a metallic layer is proposed for a layered assembly for use in applications such as electrostatic chucks which are subjected to thermal stress. A combination of magnesia ceramic material and ferritic stainless steel is preferred because of the similarities of the thermal expansion coefficients of these materials. When a larger difference in the thermal expansion coefficients exists between the selected combination of materials, a damper layer having an intermediate thermal expansion coefficient may be used so as to accommodate the difference in the thermal expansion of the two layers.

摘要翻译： 提出了一种基本上由氧化镁陶瓷材料和金属层组成的陶瓷层的组合用于分层组件，用于诸如受到热应力的静电卡盘的应用。 由于这些材料的热膨胀系数的相似性，因此优选氧化镁陶瓷材料和铁素体不锈钢的组合。 当选择的材料组合之间存在较大的热膨胀系数差时，可以使用具有中间热膨胀系数的阻尼层，以适应两层热膨胀的差异。