公开(公告)号：USRE42175E1

公开(公告)日：2011-03-01

申请号：US12470231

申请日：2009-05-21

申请人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

发明人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

IPC分类号： H01L21/00 ,  C23C16/00 ,  C23C14/00

CPC分类号： B25B11/002 ,  Y10T279/23

摘要： This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

摘要翻译： 本申请公开了一种ESC阶段的结构，其中夹持电极被中间层和覆盖层夹持。 调节层和覆盖层在电介质板和夹持电极之间具有热膨胀系数。 本申请还公开了一种ESC台的结构，其中夹持电极被夹持在与夹持电极相反的内部应力的调节层和覆盖层。 本申请进一步公开了一种用于在基板保持在高于室温的温度下进行基板上的处理的基板处理装置，其包括在该过程期间保持基板的静电夹持台。

公开(公告)号：US07220319B2

公开(公告)日：2007-05-22

申请号：US10413136

申请日：2003-04-15

申请人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

发明人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda ,  Toshihiro Tachikawa ,  Tadashi Inokuchi ,  Takashi Kayamoto

IPC分类号： H01L21/00 ,  C23C16/00

CPC分类号： B25B11/002 ,  Y10T279/23

摘要： This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

摘要翻译： 本申请公开了一种ESC阶段的结构，其中夹持电极被中间层和覆盖层夹持。 调节层和覆盖层在电介质板和夹持电极之间具有热膨胀系数。 本申请还公开了一种ESC台的结构，其中夹持电极被夹持在与夹持电极相反的内部应力的调节层和覆盖层。 本申请进一步公开了一种用于在基板保持在高于室温的温度下进行基板上的处理的基板处理装置，其包括在该过程期间保持基板的静电夹持台。

公开(公告)号：US07976716B2

公开(公告)日：2011-07-12

申请号：US12392385

申请日：2009-02-25

申请人： Yasumi Sago ,  Masayoshi Ikeda ,  Kazuaki Kaneko ,  Takuji Okada

发明人： Yasumi Sago ,  Masayoshi Ikeda ,  Kazuaki Kaneko ,  Takuji Okada

IPC分类号： B44C1/22

CPC分类号： H01L21/67017 ,  H01L21/67109

摘要： A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.

摘要翻译： 使用热交换器有效地均匀地将要控制的部分冷却或加热到规定温度的方法，然后连续进行稳定的处理。 热交换器通过在两个板之间布置分隔壁而构成，以形成流体通道和平行于通道的翅片，或者在两个板的每一个上倾斜规定的角度，以使得该通道与与该通道接触的构件 板被冷却或加热流体流过通道。

公开(公告)号：US07513063B2

公开(公告)日：2009-04-07

申请号：US10375349

申请日：2003-02-28

申请人： Yasumi Sago ,  Masayoshi Ikeda ,  Kazuaki Kaneko ,  Takuji Okada

发明人： Yasumi Sago ,  Masayoshi Ikeda ,  Kazuaki Kaneko ,  Takuji Okada

IPC分类号： F26B17/00

CPC分类号： H01L21/67017 ,  H01L21/67109

摘要： A heat exchanger efficiently and uniformly cools or heats portions to be controlled to a prescribed temperature, and then provides a surface processing apparatus which makes it possible to continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.

摘要翻译： 热交换器将要控制的部分有效地均匀地冷却或加热到规定温度，然后提供能够连续进行稳定加工的表面处理装置。 热交换器通过在两个板之间布置分隔壁而构成，以形成流体通道和平行于通道的翅片，或者在两个板的每一个上倾斜规定的角度，以使得该通道与与该通道接触的构件 板被冷却或加热流体流过通道。

公开(公告)号：US07175737B2

公开(公告)日：2007-02-13

申请号：US10413137

申请日：2003-04-15

申请人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda

发明人： Yasumi Sago ,  Kazuaki Kaneko ,  Takuji Okada ,  Masayoshi Ikeda

IPC分类号： C23F1/00

CPC分类号： H01L21/67103 ,  B23Q3/154 ,  H01J37/32082 ,  H01L21/6831 ,  Y10T279/23

摘要： This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses optimum total thickness of the ESC stage, optimum volume ratio of composite which the moderation layer is made of, and an optimum range of the thermal expansion coefficient of the composite. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

摘要翻译： 本申请公开了一种ESC阶段的结构，其中夹持电极被中间层和覆盖层夹持。 调节层和覆盖层在电介质板和夹持电极之间具有热膨胀系数。 本申请还公开了ESC级的最佳总厚度，由适当层组成的复合材料的最佳体积比，以及复合材料的热膨胀系数的最佳范围。 本申请进一步公开了一种用于在基板保持在高于室温的温度下进行基板上的处理的基板处理装置，其包括在该过程期间保持基板的静电夹持台。

公开(公告)号：US20110253037A1

公开(公告)日：2011-10-20

申请号：US13093906

申请日：2011-04-26

申请人： Koji Tsunekawa ,  Yoshinori Nagamine ,  Naoyuki Suzuki ,  Takuji Okada ,  Shinichi Inaba

发明人： Koji Tsunekawa ,  Yoshinori Nagamine ,  Naoyuki Suzuki ,  Takuji Okada ,  Shinichi Inaba

IPC分类号： F27D11/12 ,  H01L21/00 ,  B05C11/00 ,  C23C14/56 ,  B05C9/14

CPC分类号： H01L21/67109 ,  C23C14/541 ,  G11C11/16 ,  H01L21/67115 ,  H01L21/67748 ,  H01L21/68742

摘要： The vacuum heating and cooling apparatus can rapidly heat and cool only the substrate after film-forming treatment while maintaining high vacuum. The temperature rise of members in the chamber with time caused by accumulation of heat is suppressed, and the variation of temperature between substrates is decreased. In an embodiment, the heating and cooling apparatus for heating and cooling a substrate in a vacuum, includes: a vacuum chamber; a radiation energy source positioned at the vacuum chamber on an atmosphere side for emitting a heating light; an incidence part for causing the heating light from the radiation energy source to enter the vacuum chamber; a substrate-holding member for holding the substrate; and a substrate-transfer mechanism for transferring the substrate held by the substrate-holding member in a heating state to a heating position proximal to the radiation energy source, and transferring the substrate and the substrate-holding member in a non-heating state to a non-heating position distant from the radiation energy source, wherein the substrate-holding member has a plate shape for placing the substrate thereon and has an outer shape larger than that of the incidence part for causing the heating light to enter the vacuum chamber.

摘要翻译： 真空加热和冷却装置可以在保持高真空度的情况下在成膜处理之后快速地加热和冷却基板。 由于积聚而导致室内部件的温度升高受到抑制，基板间的温度变化也降低。 在一个实施例中，用于在真空中加热和冷却基板的加热和冷却装置包括：真空室; 辐射能源，其位于气氛侧的真空室处，用于发射加热光; 用于使来自辐射能源的加热光进入真空室的入射部分; 用于保持所述基板的基板保持部件; 以及基板转印机构，用于将由基板保持部件保持的基板以加热状态转印到靠近所述辐射能量源的加热位置，并将所述基板和所述基板保持部件以非加热状态转印到 远离辐射能源的非加热位置，其中基板保持构件具有用于将基板放置在其上的板形状，并且具有比用于使加热光进入真空室的入射部分大的外形。

公开(公告)号：US4929501A

公开(公告)日：1990-05-29

申请号：US233125

申请日：1988-08-17

申请人： Takuji Okada ,  Kunio Murakami

发明人： Takuji Okada ,  Kunio Murakami

IPC分类号： B41M5/382 ,  B41M5/40 ,  B41M5/41

CPC分类号： B41M5/41 ,  Y10S428/91 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/31725 ,  Y10T428/31739

摘要： A thermal transfer medium which has a heat meltable or heatsublimable ink layer on one side of a stretched polyamide film which mainly consists of polytetramethylenediapamide and has a melting point of at least 270.degree. C. The film shows good heat resistance and nonsticking properties.

公开(公告)号：US4305865A

公开(公告)日：1981-12-15

申请号：US155186

申请日：1980-06-02

申请人： Takuji Okada ,  Teijiro Arai ,  Yoshinori Ichikawa ,  Kikuo Tanaka

发明人： Takuji Okada ,  Teijiro Arai ,  Yoshinori Ichikawa ,  Kikuo Tanaka

IPC分类号： C08L7/00 ,  C08L21/00 ,  C08L23/00 ,  C08L51/00 ,  C08L51/02 ,  C08L77/00 ,  C08L101/00 ,  C08K3/08 ,  C08K7/14

CPC分类号： C08L77/00

摘要： A polyamide composition comprises (a) 50 to 99 wt. % of a polyamide; and (b) 50 to 1 wt. % of a modified polyolefin which is modified with 0.001 to 10 mole % of an adduct component selected from alicyclic carboxylic acids or functional derivatives thereof which has a cis-form double bond in the ring, which can be substituted with a nonmodified polyolefin at a ratio of 1 to 90 wt. parts per 100 wt. parts of said modified polyolefin.

摘要翻译： 聚酰胺组合物包含（a）50-99重量％ ％的聚酰胺; 和（b）50至1wt。 ％的改性聚烯烃，其用0.001至10摩尔％的选自脂环族羧酸或其在环中具有顺式形式双键的其功能衍生物的加合物组分改性，其可以以不同比例的非改性聚烯烃 为1〜90重量％ 每100重量份 部分所述改性聚烯烃。