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1.发明授权Method and apparatus of pattern inspection and semiconductor inspection system using the same 有权图案检查方法和装置以及使用其的半导体检查系统公开(公告)号：US08115169B2
公开(公告)日：2012-02-14
申请号：US12388968
申请日：2009-02-19
CPC分类号： G06T7/0006 , G06T2207/30148 , H01J2237/221 , H01J2237/2817
摘要： A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers.
摘要翻译： 例如，可以在扫描型电子显微镜系统中设置图案检查装置。 当在SEM图像中包含多层图案时，该装置通过使用与图案相对应的多个层的设计数据，根据每层分离图案。 因此，该装置可以仅使用要检查的目标层的图案，不同层的图案检查或层之间的位置偏移的检测来实现检查。
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公开(公告)号：US07978904B2
公开(公告)日：2011-07-12
申请号：US11834218
申请日：2007-08-06
CPC分类号： G06T7/0004 , G06T7/001
摘要： There is provided a pattern inspection apparatus that is capable of detecting a defect accurately and efficiently to inspect a pattern of a semiconductor device. The pattern inspection apparatus includes: a contour extraction means for extracting contour data of a pattern from a captured image of the semiconductor device; a non-linear part extraction means for extracting a non-linear part from the contour data; an angular part extraction means for extracting an angular part of a pattern from design data of the semiconductor device; and a defect detection section that compares a position of the non-linear part extracted by the non-linear part extraction section with a position of the angular part extracted by the angular part extraction section so as to detect a position of a defective part of a pattern.
摘要翻译： 提供了能够精确有效地检测缺陷以检查半导体器件的图案的图案检查装置。 图案检查装置包括：轮廓提取装置，用于从半导体装置的拍摄图像中提取图案的轮廓数据; 非线性部分提取装置，用于从轮廓数据中提取非线性部分; 角部分提取装置，用于从半导体器件的设计数据提取图案的角部; 以及缺陷检测部，其将由非线性部分提取部提取的非线性部的位置与由角部提取部提取的角部的位置进行比较，以检测不均匀部分的位置 模式。
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3.发明申请Method and apparatus of pattern inspection and semiconductor inspection system using the same 有权图案检查方法和装置以及使用其的半导体检查系统公开(公告)号：US20070023653A1
公开(公告)日：2007-02-01
申请号：US11453229
申请日：2006-06-15
IPC分类号： G21K7/00
CPC分类号： G06T7/0006 , G06T2207/30148 , H01J2237/221 , H01J2237/2817
摘要： A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers.
摘要翻译： 例如，可以在扫描型电子显微镜系统中设置图案检查装置。 当在SEM图像中包含多层图案时，该装置通过使用与图案相对应的多个层的设计数据来分离根据每一层的图案。 因此，该装置可以仅使用要检查的目标层的图案，不同层的图案检查或层之间的位置偏移的检测来实现检查。
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4.发明授权公开(公告)号：US08577124B2
公开(公告)日：2013-11-05
申请号：US13344409
申请日：2012-01-05
CPC分类号： G06T7/0006 , G06T2207/30148 , H01J2237/221 , H01J2237/2817
摘要： A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers.
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5.发明授权Method and apparatus of pattern inspection and semiconductor inspection system using the same 有权图案检查方法和装置以及使用其的半导体检查系统公开(公告)号：US07507961B2
公开(公告)日：2009-03-24
申请号：US11453229
申请日：2006-06-15
CPC分类号： G06T7/0006 , G06T2207/30148 , H01J2237/221 , H01J2237/2817
摘要： A pattern inspection apparatus can be provided, for example, in a scanning electron microscope system. When patterns of a plurality of layers are included in a SEM image, the apparatus separates the patterns according to each layer by using design data of the plurality of layers corresponding to the patterns. Consequently, the apparatus can realize inspection with use of only the pattern of a target layer to be inspected, pattern inspection differently for different layers, or detection of a positional offset between the layers.
摘要翻译： 例如，可以在扫描型电子显微镜系统中设置图案检查装置。 当在SEM图像中包含多层图案时，该装置通过使用与图案相对应的多个层的设计数据，根据每层分离图案。 因此，该装置可以仅使用要检查的目标层的图案，不同层的图案检查或层之间的位置偏移的检测来实现检查。
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6.发明申请SAMPLE DIMENSION INSPECTING/MEASURING METHOD AND SAMPLE DIMENSION INSPECTING/MEASURING APPARATUS 有权样本尺寸检查/测量方法和样品尺寸检查/测量装置公开(公告)号：US20110158543A1
公开(公告)日：2011-06-30
申请号：US13041894
申请日：2011-03-07
IPC分类号： G06K9/00
CPC分类号： G01B15/04 , G03F1/86 , G06T7/001 , G06T7/13 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/24592 , H01J2237/2817
摘要： One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.
摘要翻译： 本发明的主要目的之一是提供一种用于以与边缘的方向无关的方式以相同的精度恒定地检测二维图案的边缘的位置的样本尺寸测量方法和样本尺寸测量装置。 根据本发明，为了实现上述目的，提出了相对于检查对象图案的图案边缘的方向取决于电子束的扫描方向的二次电子的信号波形的变化。 建议当根据要测量的图案的方向改变电子束的扫描方向时，校正扫描方向和扫描位置的误差。 在该结构中，与电子束的扫描方向无关，可以获得足够的边缘检测精度。
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7.发明授权Pattern matching apparatus and semiconductor inspection system using the same 有权模式匹配装置和半导体检测系统采用相同的方式公开(公告)号：US07991218B2
公开(公告)日：2011-08-02
申请号：US11588418
申请日：2006-10-27
IPC分类号： G06K9/62
CPC分类号： G06T7/001 , G06T7/74 , G06T2207/30148
摘要： Solving means is configured of a signal input interface, a data calculation unit, and a signal output interface. The signal input interface allows image data which is obtained by photographing hole patterns, and CAD data which corresponds to hole patterns included in the image data, to be inputted. The data calculation unit includes: CAD hole-pattern central-position detection means which detects central positions respectively of hole patterns included in the CAD data from the CAD data, and which generates data which represents, with an image, the central positions of the respective hole patterns; pattern extraction means which extracts pattern data from the image data; image hole-pattern central-position detection means which detects central positions of the respective hole patterns in the image data from the pattern data, and which generates data which represents, with an image, the central positions of these hole patterns detected from the image data; and collation process means which detects positional data in the image data corresponding to that in the CAD data through a process of collating the CAD hole-pattern central-position data with the image hole-pattern central-position data. The signal output interface outputs the positional data outputted from the data calculation unit.
摘要翻译： 解码装置由信号输入接口，数据计算单元和信号输出接口构成。 信号输入接口允许输入通过拍摄孔图案获得的图像数据和与图像数据中包括的孔图案对应的CAD数据。 数据计算单元包括：CAD孔图形中心位置检测装置，其检测来自CAD数据的包括在CAD数据中的孔图案的中心位置，并且生成用图像表示相应的中心位置的数据 孔图案 图案提取装置，从图像数据中提取图案数据; 图像孔图形中心位置检测装置，其从图案数据检测图像数据中的各个孔图案的中心位置，并且生成用图像表示从图像数据检测到的这些孔图案的中心位置的数据 ; 以及对照处理装置，其通过将CAD孔图案中心位置数据与图像孔图形中心位置数据进行对照的处理来检测与CAD数据中的数据相对应的图像数据中的位置数据。 信号输出接口输出从数据计算单元输出的位置数据。
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8.发明申请Pattern matching apparatus and semiconductor inspection system using the same 有权模式匹配装置和半导体检测系统采用相同的方式公开(公告)号：US20070098248A1
公开(公告)日：2007-05-03
申请号：US11588418
申请日：2006-10-27
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T7/74 , G06T2207/30148
摘要： Solving means is configured of a signal input interface, a data calculation unit, and a signal output interface. The signal input interface allows image data which is obtained by photographing hole patterns, and CAD data which corresponds to hole patterns included in the image data, to be inputted. The data calculation unit includes: CAD hole-pattern central-position detection means which detects central positions respectively of hole patterns included in the CAD data from the CAD data, and which generates data which represents, with an image, the central positions of the respective hole patterns; pattern extraction means which extracts pattern data from the image data; image hole-pattern central-position detection means which detects central positions of the respective hole patterns in the image data from the pattern data, and which generates data which represents, with an image, the central positions of these hole patterns detected from the image data; and collation process means which detects positional data in the image data corresponding to that in the CAD data through a process of collating the CAD hole-pattern central-position data with the image hole-pattern central-position data. The signal output interface outputs the positional data outputted from the data calculation unit.
摘要翻译： 解码装置由信号输入接口，数据计算单元和信号输出接口构成。 信号输入接口允许输入通过拍摄孔图案获得的图像数据和与图像数据中包括的孔图案对应的CAD数据。 数据计算单元包括：CAD孔图形中心位置检测装置，其检测来自CAD数据的包括在CAD数据中的孔图案的中心位置，并且生成用图像表示相应的中心位置的数据 孔图案 图案提取装置，从图像数据中提取图案数据; 图像孔图形中心位置检测装置，其从图案数据检测图像数据中的各个孔图案的中心位置，并且生成用图像表示从图像数据检测到的这些孔图案的中心位置的数据 ; 以及对照处理装置，其通过将CAD孔图案中心位置数据与图像孔图形中心位置数据进行对照的处理来检测与CAD数据中的数据相对应的图像数据中的位置数据。 信号输出接口输出从数据计算单元输出的位置数据。
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9.发明授权Sample dimension inspecting/measuring method and sample dimension inspecting/measuring apparatus 有权样品尺寸检测/测量方法和样品尺寸检测/测量仪器公开(公告)号：US08338804B2
公开(公告)日：2012-12-25
申请号：US13041894
申请日：2011-03-07
CPC分类号： G01B15/04 , G03F1/86 , G06T7/001 , G06T7/13 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/24592 , H01J2237/2817
摘要： One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.
摘要翻译： 本发明的主要目的之一是提供一种用于以与边缘的方向无关的方式以相同的精度恒定地检测二维图案的边缘的位置的样本尺寸测量方法和样本尺寸测量装置。 根据本发明，为了实现上述目的，提出了相对于检查对象图案的图案边缘的方向取决于电子束的扫描方向的二次电子的信号波形的变化。 建议当根据要测量的图案的方向改变电子束的扫描方向时，校正扫描方向和扫描位置的误差。 在该结构中，与电子束的扫描方向无关，可以获得足够的边缘检测精度。
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10.发明授权Sample dimension inspecting/measuring method and sample dimension inspecting/measuring apparatus 有权样品尺寸检测/测量方法和样品尺寸检测/测量仪器公开(公告)号：US07923703B2
公开(公告)日：2011-04-12
申请号：US12279564
申请日：2007-02-09
CPC分类号： G01B15/04 , G03F1/86 , G06T7/001 , G06T7/13 , G06T2207/10061 , G06T2207/30148 , H01J37/222 , H01J37/28 , H01J2237/24592 , H01J2237/2817
摘要： One of principal objects of the present invention is to provide a sample dimension measuring method for detecting the position of an edge of a two-dimensional pattern constantly with the same accuracy irrespective of the direction of the edge and a sample dimension measuring apparatus. According to this invention, to accomplish the above object, it is proposed to correct the change of a signal waveform of secondary electrons which depends on the direction of scanning of an electron beam relative to the direction of a pattern edge of an inspection objective pattern. It is proposed that when changing the scanning direction of the electron beam in compliance with the direction of a pattern to be measured, errors in the scanning direction and the scanning position are corrected. In this configuration, a sufficient accuracy of edge detection can be obtained irrespective of the scanning direction of the electron beam.
摘要翻译： 本发明的主要目的之一是提供一种用于以与边缘的方向无关的方式以相同的精度恒定地检测二维图案的边缘的位置的样本尺寸测量方法和样本尺寸测量装置。 根据本发明，为了实现上述目的，提出了相对于检查对象图案的图案边缘的方向取决于电子束的扫描方向的二次电子的信号波形的变化。 建议当根据要测量的图案的方向改变电子束的扫描方向时，校正扫描方向和扫描位置的误差。 在该结构中，与电子束的扫描方向无关，可以获得足够的边缘检测精度。
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