公开(公告)号：US12119510B2

公开(公告)日：2024-10-15

申请号：US17387304

申请日：2021-07-28

申请人： Yazaki Corporation

发明人： Hidehiko Shimizu ,  Keitaroh Nozawa ,  Shuhei Urakami ,  Shinji Kawai

IPC分类号： H01M50/284 ,  H01M10/0525 ,  H01M50/209 ,  H01M50/507 ,  H05K1/02

CPC分类号： H01M50/284 ,  H01M10/0525 ,  H01M50/209 ,  H01M50/507 ,  H05K1/0277 ,  H05K2201/10037

摘要： A battery connection module includes a plurality of bus bars provided on a battery stack in which a plurality of battery packs are assembled, and attached to electrodes of the battery packs, a flexible printed wiring board provided on the battery stack, and a first electronic component electrically connected to the flexible printed wiring board. The flexible printed wiring board includes a side surface portion which extends outward from above the battery stack and is bent so as to be fixed to a side surface of the battery stack, and the first electronic component is provided on the side surface portion.

公开(公告)号：US11483924B2

公开(公告)日：2022-10-25

申请号：US17318111

申请日：2021-05-12

申请人： Yazaki Corporation

发明人： Keitaroh Nozawa ,  Hidehiko Shimizu ,  Shinji Kawai

IPC分类号： H05K1/02

摘要： A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.