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公开(公告)号：US20100165054A1
公开(公告)日：2010-07-01
申请号：US12344706
申请日：2008-12-29
CPC分类号： B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49
摘要： A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata.
摘要翻译： 鳍状加热器堆叠包括构造成支撑并形成流体加热器元件的第一层，其响应于重复的电激活和停用以产生流体的重复循环和第一层上的第二层，以保护流体加热器元件免受不利影响 流体喷射和与流体接触的重复循环。 第一层包括具有前表面的基底和支撑在前表面上的加热器基底。 加热器基体具有相对的前表面大致垂直延伸的相对的侧表面，以及使大致平行于前表面延伸的侧表面相互连接的端面，使得加热器基底以直立或倒立的翅片形状设置在 具有流体加热器元件的基底形成加热基底的相对面对的侧表面。
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公开(公告)号：US08366245B2
公开(公告)日：2013-02-05
申请号：US12344706
申请日：2008-12-29
IPC分类号： B41J2/05
CPC分类号： B41J2/1412 , B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1639 , B41J2/1642 , B41J2/1645 , B41J2/1646 , Y10T29/49
摘要： A fin-shaped heater stack includes first strata configured to support and form fluid heater elements responsive to repetitive electrical activation and deactivation to produce repetitive cycles of ejection of a fluid, and second strata on the first strata to protect the fluid heater elements from adverse effects of the repetitive cycles of fluid ejection and of contact with the fluid. The first strata include a substrate having a front surface, and heater substrata supported on the front surface. The heater substrata have opposite facing side surfaces which extend approximately perpendicular to the front surface and an end surface interconnecting the side surfaces which extends approximately parallel to the front surface such that the heater substrata is provided in either an upright or inverted fin-shaped configuration on the substrate with the fluid heater elements forming the opposite facing side surfaces of the heat substrata.
摘要翻译： 鳍状加热器堆叠包括构造成支撑并形成流体加热器元件的第一层，其响应于重复的电激活和停用以产生流体的重复循环和第一层上的第二层，以保护流体加热器元件免受不利影响 流体喷射和与流体接触的重复循环。 第一层包括具有前表面的基底和支撑在前表面上的加热器基底。 加热器基体具有相对的前表面大致垂直延伸的相对的侧表面，以及使大致平行于前表面延伸的侧表面相互连接的端面，使得加热器基底以直立或倒立的翅片形状设置在 具有流体加热器元件的基底形成加热基底的相对面对的侧表面。
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3.发明申请Heater Stack In A Micro-Fluid Ejection Device And Method For Forming Floating Electrical Heater Element In The Heater Stack 有权微流体喷射装置中的加热器堆叠和在加热器堆叠中形成浮动电加热器元件的方法公开(公告)号：US20100165056A1
公开(公告)日：2010-07-01
申请号：US12345788
申请日：2008-12-30
IPC分类号： B41J2/14 , H01L21/3213
CPC分类号： B41J2/1412 , B41J2/1601 , B41J2/1629 , B41J2/1631
摘要： A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.
摘要翻译： 一种用于形成浮动加热元件的方法包括处理硅衬底以形成具有在周边边缘部分的衬底上具有加热器元件的加热器堆叠，通过在其上沉积和图案化一层光致抗蚀剂或硬掩模来对加热器堆叠进行处理以基本上掩盖 加热器堆叠并通过光致抗蚀剂或硬掩模形成沟槽，暴露沿着加热器元件的周边边缘部分延伸的衬底的表面区域，并且通过顺序地除去光致抗蚀剂和部分来处理掩模加热器堆叠和暴露的衬底表面区域 在基板的暴露的表面区域，并且位于加热器元件的下面，以便在底板上形成一个凹槽，该底板使加热器元件沿其周缘部分开口，并且能够填充流体，从而产生 浮动加热元件。
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4.发明授权Heater stack in a micro-fluid ejection device and method for forming floating electrical heater element in the heater stack 有权微流体喷射装置中的加热器堆叠和用于在加热器堆叠中形成浮动电加热器元件的方法公开(公告)号：US08070265B2
公开(公告)日：2011-12-06
申请号：US12345788
申请日：2008-12-30
IPC分类号： B41J2/14 , B41J2/04 , H01L21/3213
CPC分类号： B41J2/1412 , B41J2/1601 , B41J2/1629 , B41J2/1631
摘要： A method for forming a floating heater element includes processing a silicon substrate to form a heater stack having the heater element on the substrate with peripheral edge portions, processing the heater stack by depositing and patterning a layer of photoresist or hard mask thereon to substantially mask the heater stack and form a trench through the photoresist or hard mask exposing a surface area of the substrate extending along the peripheral edge portions of the heater element, and processing the masked heater stack and exposed surface area of the substrate by sequentially removing the photoresist and portions of the substrate at the exposed surface area and that underlie the heater element so as to create a well in the substrate undercutting the heater element and open along the peripheral edge portions thereof, the well being capable of filling with a fluid so as to produce the floating heater element.
摘要翻译： 一种用于形成浮动加热元件的方法包括处理硅衬底以形成具有在周边边缘部分的衬底上具有加热器元件的加热器堆叠，通过在其上沉积和图案化一层光致抗蚀剂或硬掩模来对加热器堆叠进行处理以基本上掩盖 加热器堆叠并通过光致抗蚀剂或硬掩模形成沟槽，暴露沿着加热器元件的周边边缘部分延伸的衬底的表面区域，并且通过顺序地除去光致抗蚀剂和部分来处理掩模加热器堆叠和暴露的衬底表面区域 在基板的暴露的表面区域，并且位于加热器元件的下面，以便在底板上形成一个凹槽，该底板使加热器元件沿其周缘部分开口，并且能够填充流体，从而产生 浮动加热元件。
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公开(公告)号：US20080115359A1
公开(公告)日：2008-05-22
申请号：US11561993
申请日：2006-11-21
申请人： Yimin Guan , Carl Edmond Sullivan
发明人： Yimin Guan , Carl Edmond Sullivan
CPC分类号： B41J2/14129 , B41J2/1404 , B41J2002/14387 , B41J2202/03 , Y10T29/49401
摘要： A thin film heater for a micro-fluid ejection head and methods for making the thin film heater and for making micro-fluid ejection heads containing the thin film heater. In one embodiment, a thin film heater comprises a tantalum-aluminum-nitride thin film material having a nano-crystalline structure consisting essentially of AlN, TaN, and TaAl alloys. A sheet resistance of the thin film heater ranges from about 100 to about 600 ohms per square. The thin film heater has a thickness ranging from about 100 to about 800 Angstroms and exhibits improved aluminum/silicon diffusion barrier properties.
摘要翻译： 用于微流体喷射头的薄膜加热器和用于制造薄膜加热器和用于制造含有薄膜加热器的微流体喷射头的方法。 在一个实施例中，薄膜加热器包括具有主要由AlN，TaN和TaAl合金组成的纳米晶体结构的钽 - 氮化铝薄膜材料。 薄膜加热器的薄层电阻为约100至约600欧姆/平方。 薄膜加热器具有约100至约800埃的厚度，并且具有改善的铝/硅扩散阻挡性能。
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6.发明申请Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embedded Conductive Material 审中-公开具有嵌入导电材料的聚合物层的微流体喷射装置公开(公告)号：US20070296767A1
公开(公告)日：2007-12-27
申请号：US11426647
申请日：2006-06-27
IPC分类号： B41J2/05
CPC分类号： B41J2/14072 , B41J2202/03
摘要： Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.
摘要翻译： 微流体喷射装置，用于制造微流体喷射装置的方法以及用于减小用于微流体喷射头的基底的尺寸的方法。 一个这样的微流体喷射装置具有邻近基底的聚合物层和嵌入聚合物层中的至少一个导电层。 聚合物层包含至少两层聚合材料。
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7.发明授权Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters 失效微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头公开(公告)号：US07673972B2
公开(公告)日：2010-03-09
申请号：US11683572
申请日：2007-03-08
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2202/03 , B41J2202/11 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
摘要翻译： 微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。 一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。 薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。 每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。
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8.发明授权Micro-fluid ejection devices with a polymeric layer having an embedded conductive material 失效具有聚合物层的微流体喷射装置具有嵌入的导电材料公开(公告)号：US08642249B2
公开(公告)日：2014-02-04
申请号：US12842329
申请日：2010-07-23
IPC分类号： B41J2/16
CPC分类号： B41J2/14072 , B41J2202/03
摘要： Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.
摘要翻译： 微流体喷射装置，用于制造微流体喷射装置的方法以及用于减小用于微流体喷射头的基底的尺寸的方法。 一个这样的微流体喷射装置具有邻近基底的聚合物层和嵌入聚合物层中的至少一个导电层。 聚合物层包含至少两层聚合材料。
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9.发明申请MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBEDDED CONDUCTIVE MATERIAL 失效具有嵌入式导电材料的聚合物层的微流体喷射装置公开(公告)号：US20100285411A1
公开(公告)日：2010-11-11
申请号：US12842329
申请日：2010-07-23
IPC分类号： G03F7/20
CPC分类号： B41J2/14072 , B41J2202/03
摘要： Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.
摘要翻译： 微流体喷射装置，用于制造微流体喷射装置的方法以及用于减小用于微流体喷射头的基底的尺寸的方法。 一个这样的微流体喷射装置具有邻近基底的聚合物层和嵌入聚合物层中的至少一个导电层。 聚合物层包含至少两层聚合材料。
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10.发明申请Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejection Heads, and Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters 失效微流体喷射装置，制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头公开(公告)号：US20080165227A1
公开(公告)日：2008-07-10
申请号：US11683572
申请日：2007-03-08
IPC分类号： B41J2/05
CPC分类号： B41J2/14129 , B41J2202/03 , B41J2202/11 , Y10T29/49401
摘要： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
摘要翻译： 微流体喷射装置，用于制造微流体喷射头的方法和微流体喷射头，包括微流体喷射头。 一个这种微流体喷射头具有与基底相邻的相对较高的电阻薄膜加热器。 薄膜材料包括硅，金属和碳（SiMC，其中M是金属）。 每个薄膜加热器的薄层电阻范围为约100至约600欧姆/平方，厚度范围为约100至约800埃。
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