公开(公告)号：US20090284628A1

公开(公告)日：2009-11-19

申请号：US12210534

申请日：2008-09-15

Applicant: Ying-Cheng WU ,  Te-Chun CHOU

Inventor： Ying-Cheng WU ,  Te-Chun CHOU

IPC: H04N5/335 ,  H01L31/00

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014

Abstract: An image sensor package includes an image sensor chip, a sidewall, an encapsulation glass, conductive material, and a plurality of solder balls. The image sensor chip comprises a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area. The sidewall is located on the non-photosensitive are and defines a plurality of first through holes aligned with and corresponding to the bonding pads. The encapsulation glass is located on the sidewall. A plurality of solder balls are formed on the encapsulation glass aligned with the bonding pads, respectively. The encapsulation glass defines a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball. The image sensor package further comprises a conductive material through which the first and second through holes penetrate.

Abstract translation: 图像传感器封装包括图像传感器芯片，侧壁，封装玻璃，导电材料和多个焊球。 图像传感器芯片包括感光区域，环绕感光区域的非感光区域和形成在非感光区域上的多个接合焊盘。 侧壁位于非感光体上，并且限定与接合焊盘对准并对应于接合焊盘的多个第一通孔。 封装玻璃位于侧壁上。 分别在与焊盘对准的封装玻璃上形成多个焊球。 封装玻璃限定多个第二通孔，每个通孔对应于焊盘和相应的焊球。 图像传感器封装还包括导电材料，第一和第二通孔穿过该导电材料。