利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

49 条记录 (耗时 0.025 秒)

    Integrated touch-down pad and touch-down sensor
    2.
    发明授权
    Integrated touch-down pad and touch-down sensor 有权
    集成的触摸板和触摸屏传感器

    公开(公告)号：US08335053B2

    公开(公告)日：2012-12-18

    申请号：US12914883

    申请日：2010-10-28

    申请人： Yingjian Chen ,  David J. Seagle ,  Samuel W. Yuan

    发明人： Yingjian Chen ,  David J. Seagle ,  Samuel W. Yuan

    IPC分类号： G11B21/02

    CPC分类号： G11B5/607 ,  G11B5/6076

    摘要： In one general embodiment, a magnetic head includes a touch-down pad, comprising at least one shielding element positioned between a leading edge of a main magnetic pole and a trailing edge of a lower return pole; an embedded contact sensor (ECS) in an electrically isolating layer, the ECS positioned near an ABS side of the magnetic head and between the leading edge of the main magnetic pole and the trailing edge of the lower return pole; and a first thermal fly-height control (TFC) element positioned away from the ABS side of the magnetic head. Additional systems and methods are also presented.

    摘要翻译： 在一个一般实施例中，磁头包括一个触控板，包括位于主磁极的前缘和下回极的后缘之间的至少一个屏蔽元件; 位于电绝缘层中的嵌入式接触传感器（ECS），ECS位于磁头的ABS侧附近，并且位于主磁极的前缘和下返回极的后缘之间; 以及远离磁头的ABS侧定位的第一热飞跃高度控制（TFC）元件。 还介绍了其他系统和方法。

    INTEGRATED TOUCH-DOWN PAD AND TOUCH-DOWN SENSOR
    3.
    发明申请
    INTEGRATED TOUCH-DOWN PAD AND TOUCH-DOWN SENSOR 有权
    集成的触摸屏和触摸传感器

    公开(公告)号：US20120105999A1

    公开(公告)日：2012-05-03

    申请号：US12914883

    申请日：2010-10-28

    申请人： Yingjian Chen ,  David J. Seagle ,  Samuel W. Yuan

    发明人： Yingjian Chen ,  David J. Seagle ,  Samuel W. Yuan

    IPC分类号： G11B21/02

    CPC分类号： G11B5/607 ,  G11B5/6076

    摘要： In one general embodiment, a magnetic head includes a touch-down pad, comprising at least one shielding element positioned between a leading edge of a main magnetic pole and a trailing edge of a lower return pole; an embedded contact sensor (ECS) in an electrically isolating layer, the ECS positioned near an ABS side of the magnetic head and between the leading edge of the main magnetic pole and the trailing edge of the lower return pole; and a first thermal fly-height control (TFC) element positioned away from the ABS side of the magnetic head. Additional systems and methods are also presented.

    摘要翻译： 在一个一般实施例中，磁头包括一个触控板，包括位于主磁极的前缘和下回极的后缘之间的至少一个屏蔽元件; 位于电绝缘层中的嵌入式接触传感器（ECS），ECS位于磁头的ABS侧附近，并且位于主磁极的前缘和下返回极的后缘之间; 以及远离磁头的ABS侧定位的第一热飞跃高度控制（TFC）元件。 还介绍了其他系统和方法。

    Stitched pole write element with a T-shaped pole tip portion
    4.
    发明授权
    Stitched pole write element with a T-shaped pole tip portion 有权
    带有T形极端部分的针脚写入元件

    公开(公告)号：US07116517B1

    公开(公告)日：2006-10-03

    申请号：US10323128

    申请日：2002-12-18

    申请人： Qing He ,  Hirohiko Kamimura ,  Shuhei Otani ,  Yugang Wang ,  David J. Seagle

    发明人： Qing He ,  Hirohiko Kamimura ,  Shuhei Otani ,  Yugang Wang ,  David J. Seagle

    IPC分类号： G11B5/147

    CPC分类号： G11B5/3116 ,  G11B5/3113 ,  G11B5/3133

    摘要： A T-shaped pole tip portion of an upper pole of a write element for a magnetic disk drive is provided. One end of the pole tip portion, constituting the bottom of the “T,” forms a narrow nose segment at an air bearing surface, while a wing segment at the opposite end of the pole tip portion constitutes the cross-bar top of the “T.” A transition segment extends between the nose segment and the wing segment. A yoke portion of the upper pole includes a surface that is parallel to the air bearing surface and recessed therefrom by a P3R depth. The transition segment does not widen significantly until after the P3R depth, accordingly, the wing segment is recessed from the air bearing surface by more than the P3R depth.

    摘要翻译： 提供了用于磁盘驱动器的写入元件的上极的T形极尖部分。 构成“T”底部的极端部的一端在空气轴承面形成窄的鼻部，而在极尖部的另一端的翼部构成“ T.“ 过渡段在鼻段和翼段之间延伸。 上极的轭部包括平行于空气轴承表面并且通过P 3 R深度从其中凹入的表面。 在P 3 R深度之后，过渡段不会显着扩大，因此翼段从空气轴承表面凹陷多于P 3 R深度。

    Write head architecture for improved manufacturability
    5.
    发明授权
    Write head architecture for improved manufacturability 失效
    写头架构，提高可制造性

    公开(公告)号：US06798616B1

    公开(公告)日：2004-09-28

    申请号：US09902873

    申请日：2001-07-10

    申请人： David J. Seagle ,  Qing He ,  Lien-Chang Wang ,  Ming Zhao

    发明人： David J. Seagle ,  Qing He ,  Lien-Chang Wang ,  Ming Zhao

    IPC分类号： G11B539

    CPC分类号： G11B5/127 ,  G11B5/3903

    摘要： A disk drive write head having in consecutive layers a bottom pole, a write gap layer, a first insulation layer, a coil, a second insulation layer having an insulation layer boundary, and a top pole on the second insulation layer. The top pole includes a main body portion and a nose portion and has a flare line at the location where the nose portion expands to become the main body portion. The top pole further includes a curved contour portion having a contour boundary, a tip which terminates in an air bearing surface, and a flat portion on the top surface of the nose extending between the tip and the contour boundary. The insulation layer boundary is recessed from the air bearing surface such that the top pole contour boundary lies substantially close to the flare line, thus producing a top pole top surface which is substantially flat.

    摘要翻译： 具有连续层的底磁极，写间隙层，第一绝缘层，线圈，具有绝缘层边界的第二绝缘层和第二绝缘层上的顶极的磁盘驱动器写入头。 顶杆包括主体部分和鼻部部分，并且在鼻部部分膨胀成为主体部分的位置处具有火炬线。 顶杆还包括具有轮廓边界的弯曲轮廓部分，终止于空气轴承表面的尖端以及在尖端和轮廓边界之间延伸的鼻部顶表面上的平坦部分。 绝缘层边界从空气轴承表面凹入，使得顶极轮廓边界基本上靠近火炬线，从而产生基本平坦的顶极顶面。

    Verification of a fabrication process used to form read elements in magnetic heads
    6.
    发明授权
    Verification of a fabrication process used to form read elements in magnetic heads 有权
    用于在磁头中形成读取元件的制造工艺的验证

    公开(公告)号：US07919967B2

    公开(公告)日：2011-04-05

    申请号：US11965502

    申请日：2007-12-27

    申请人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    发明人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    IPC分类号： G01R31/08 ,  G01R27/08

    CPC分类号： G01R31/2884 ,  G01R33/1207 ,  G11B5/127

    摘要： Test methods and components are disclosed for testing the quality of a fabrication process used to form read elements in magnetic heads. A wafer is populated with one or more test components along with magnetic heads. The test components are formed by the same or similar fabrication processes as the read elements, but do not include a conductive MR sensor between the test leads. By measuring the resistance of the test components, the formation of parasitic shunts can be identified in the test components, which may indicate the formation of parasitic shunts in the read elements. Thus, the quality of the fabrication process in forming read elements in magnetic head may be determined.

    摘要翻译： 公开了用于测试用于在磁头中形成读取元件的制造工艺的质量的测试方法和部件。 晶片与磁头一起安装有一个或多个测试部件。 测试部件通过与读取元件相同或相似的制造工艺形成，但不包括测试引线之间的导电MR传感器。 通过测量测试部件的电阻，可以在测试部件中识别寄生分流器的形成，这可以指示在读取元件中形成寄生分流。 因此，可以确定在磁头中形成读取元件的制造工艺的质量。

    Test components fabricated with large area sensors used for determining the resistance of an MR sensor
    7.
    发明授权
    Test components fabricated with large area sensors used for determining the resistance of an MR sensor 有权
    用大面积传感器制造的测试部件用于确定MR传感器的电阻

    公开(公告)号：US07855553B2

    公开(公告)日：2010-12-21

    申请号：US11965587

    申请日：2007-12-27

    申请人： Robert S. Beach ,  Mary K. Gutberlet ,  David J. Seagle

    发明人： Robert S. Beach ,  Mary K. Gutberlet ,  David J. Seagle

    IPC分类号： G01R33/12

    CPC分类号： G11B20/1816 ,  G11B5/3166 ,  G11B5/3173 ,  G11B5/3193 ,  G11B5/3903 ,  G11B2220/2516

    摘要： Test methods and components are disclosed for testing resistances of magnetoresistance (MR) sensors in read elements. Test components are fabricated on a wafer with a first test lead, a test MR sensor, and a second test lead. The test leads and test MR sensor are fabricated with similar processes as first shields, MR sensors, and second shields of read elements on tie wafer. However, the test MR sensor is fabricated with an area that is larger than areas of the MR sensors in the read elements. The larger area of the test MR sensor causes the resistance of the test MR sensor to be insignificant compared to the lead resistance. Thus, a resistance measurement of the test component represents the lead resistance of a read element. An accurate resistance measurement of an MR sensor in a read element may then be determined by subtracting the lead resistance.

    摘要翻译： 公开了用于测试读取元件中的磁阻（MR）传感器的电阻的测试方法和组件。 在具有第一测试导线，测试MR传感器和第二测试导线的晶片上制造测试部件。 测试引线和测试MR传感器采用与晶片上的读取元件的第一屏蔽，MR传感器和第二屏蔽类似的工艺制造。 然而，测试MR传感器的制造面积大于读取元件中MR传感器的面积。 测试MR传感器的较大面积导致测试MR传感器的电阻与引线电阻相比不显着。 因此，测试部件的电阻测量表示读取元件的引线电阻。 然后可以通过减去引线电阻来确定读取元件中的MR传感器的精确电阻测量。

    Electrical lapping guides made from tunneling magnetoresistive (TMR) material
    8.
    发明授权
    Electrical lapping guides made from tunneling magnetoresistive (TMR) material 失效
    由隧道磁阻（TMR）材料制成的电气研磨导轨

    公开(公告)号：US07564110B2

    公开(公告)日：2009-07-21

    申请号：US11379321

    申请日：2006-04-19

    申请人： Robert S. Beach ,  Daniele Mauri ,  David J. Seagle ,  Jila Tabib

    发明人： Robert S. Beach ,  Daniele Mauri ,  David J. Seagle ,  Jila Tabib

    IPC分类号： H01L29/82

    CPC分类号： G11B5/3173 ,  B82Y10/00 ,  B82Y25/00 ,  G11B5/3169 ,  G11B5/3906 ,  G11B5/3909 ,  H01L43/12

    摘要： Tunneling magnetoresistive (TMR) electrical lapping guides (ELG) are disclosed for use in wafer fabrication of magnetic sensing devices, such as magnetic recording heads using TMR read elements. A TMR ELG includes a TMR stack comprising a first conductive layer, a barrier layer, and a second conductive layer of TMR material. The TMR ELG also includes a first lead and a second lead that connect to conductive pads used for applying a sense current to the TMR ELG in a current in plane (CIP) fashion. The first lead contacts one side of the TMR stack so that the first lead contacts both the first conductive layer and the second conductive layer of the TMR stack. The second lead contacts the other side of the TMR stack so that the second lead contacts both the first conductive layer and the second conductive layer of the TMR stack.

    摘要翻译： 公开了隧道磁阻（TMR）电研磨引导件（ELG），用于磁感测装置的晶片制造，例如使用TMR读取元件的磁记录头。 TMR ELG包括TMR堆叠，其包括第一导电层，阻挡层和TMR材料的第二导电层。 TMR ELG还包括连接到用于以当前平面（CIP）方式向TMR ELG施加感测电流的导电焊盘的第一引线和第二引线。 第一引线接触TMR堆叠的一侧，使得第一引线接触TMR堆叠的第一导电层和第二导电层。 第二引线接触TMR堆叠的另一侧，使得第二引线接触TMR堆叠的第一导电层和第二导电层。

    VERIFICATION OF A FABRICATION PROCESS USED TO FORM READ ELEMENTS IN MAGNETIC HEADS
    10.
    发明申请
    VERIFICATION OF A FABRICATION PROCESS USED TO FORM READ ELEMENTS IN MAGNETIC HEADS 有权
    用于形成读取磁头元件的制造工艺的验证

    公开(公告)号：US20090168214A1

    公开(公告)日：2009-07-02

    申请号：US11965502

    申请日：2007-12-27

    申请人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    发明人： Satoru Araki ,  Robert S. Beach ,  David J. Seagle

    IPC分类号： G11B27/36

    CPC分类号： G01R31/2884 ,  G01R33/1207 ,  G11B5/127

    摘要： Test methods and components are disclosed for testing the quality of a fabrication process used to form read elements in magnetic heads. A wafer is populated with one or more test components along with magnetic heads. The test components are formed by the same or similar fabrication processes as the read elements, but do not include a conductive MR sensor between the test leads. By measuring the resistance of the test components, the formation of parasitic shunts can be identified in the test components, which may indicate the formation of parasitic shunts in the read elements. Thus, the quality of the fabrication process in forming read elements in magnetic head may be determined.

    摘要翻译： 公开了用于测试用于在磁头中形成读取元件的制造工艺的质量的测试方法和部件。 晶片与磁头一起安装有一个或多个测试部件。 测试部件通过与读取元件相同或相似的制造工艺形成，但不包括测试引线之间的导电MR传感器。 通过测量测试部件的电阻，可以在测试部件中识别寄生分流器的形成，这可以指示在读取元件中形成寄生分流。 因此，可以确定在磁头中形成读取元件的制造工艺的质量。