公开(公告)号：US20060182541A1

公开(公告)日：2006-08-17

申请号：US11391640

申请日：2006-03-29

申请人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

发明人： Yoshiaki Kobayashi ,  Shigeru Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

IPC分类号： H01L21/677

CPC分类号： H01L21/67775 ,  H01L21/6735 ,  H01L21/67772

摘要： When a conventional semiconductor container opening/closing apparatus opens a lid of a semiconductor container, foreign particles enter into the container from outside through a gap between the container and a wall surface of the container opening/closing apparatus and adhere to a wafer in the container. An apparatus is provided to reduce the number of foreign particles adhering to the wafer by preventing foreign particles from entering into the container at the time of opening the container by the opening/closing apparatus. To achieve this, a velocity-differential pressure ratio obtained by dividing the maximum velocity at the time of opening the lid of the container in a vertical direction to an opening of the container, by the differential pressure between the inside pressure and the outside pressure of said semiconductor manufacturing apparatus, is set to be 0.06 ((m/s) Pa) or less.

摘要翻译： 当传统的半导体容器打开/关闭装置打开半导体容器的盖子时，异物通过容器和容器打开/关闭装置的壁表面之间的间隙从外部进入容器，并且粘附到容器中的晶片 。 提供了一种装置，用于通过打开/关闭装置打开容器时防止异物进入容器，从而减少附着在晶片上的异物的数量。 为了实现这一点，通过将容器的盖子在垂直方向上打开时的最大速度除以容器的开口之间的内压和外部压力之间的压差来获得的速度差压比 所述半导体制造装置设定为0.06（（m / s）Pa）以下。

公开(公告)号：US20060278612A1

公开(公告)日：2006-12-14

申请号：US11448032

申请日：2006-06-07

申请人： Kenji Tokunaga ,  Kazuhiko Kawai ,  Sakae Terakado

发明人： Kenji Tokunaga ,  Kazuhiko Kawai ,  Sakae Terakado

IPC分类号： C03C25/68 ,  B44C1/22 ,  C23F1/00 ,  H01L21/302

CPC分类号： H01L21/67167 ,  H01L21/02057 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/67017 ,  H01L21/6735

摘要： To provide a semiconductor integrated circuit device having improved reliability. An EFEM unit upstream of a plasma processing unit is equipped with a chemical filer for alkali removal. In the plasma processing unit, a semiconductor wafer is subjected to plasma processing with a gas containing fluorine. The resulting semiconductor wafer is put in a carrier via a transfer chamber, load lock chamber and EFEM chamber. During this operation, the concentration of amines in the EFEM chamber is adjusted to be lower than that of amines in a clean room outside the chamber by a chemical filter.

摘要翻译： 提供具有提高的可靠性的半导体集成电路器件。 在等离子体处理单元上游的EFEM单元配备有用于除碱的化学清洁器。 在等离子体处理单元中，用含氟气体对半导体晶片进行等离子体处理。 所得到的半导体晶片通过传送室，负载锁定室和EFEM室放入载体中。 在该操作中，通过化学过滤器将EFEM室中的胺浓度调节至低于室外洁净室的胺浓度。

公开(公告)号：US06867153B2

公开(公告)日：2005-03-15

申请号：US10764563

申请日：2004-01-27

申请人： Kenji Tokunaga

发明人： Kenji Tokunaga

IPC分类号： H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68 ,  B65B31/00 ,  F26B21/00

CPC分类号： H01L21/67017 ,  H01L21/67772 ,  H01L21/68

摘要： A FOUP having semiconductor wafers received therein is transferred to a loading port and then the door of the FOUP is fixed and removed by a FIMS door and then the semiconductor wafers are taken out of the shell of the FOUP and then a predetermined manufacturing processing is performed to the semiconductor wafers. After performing the manufacturing processing, the semiconductor wafers are returned into the shell and the FIMS door is returned to a closed position and the shell is retracted about 50 mm to 65 mm to form a gap between the FIMS door and the shell. Then, purge gas is introduced from a gas introduction pipe arranged above the loading port on the left and right sides in a slanting forward direction of the FIMS door into the shell to replace the atmosphere in the shell with the purge gas.

摘要翻译： 将其中容纳有半导体晶片的FOUP转移到装载端口，然后通过FIMS门固定和移除FOUP的门，然后将半导体晶片从FOUP的外壳中取出，然后执行预定的制造处理 到半导体晶片。 在执行制造处理之后，将半导体晶片返回到外壳中，并且FIMS门返回到关闭位置，并且壳缩回约50mm至65mm以在FIMS门和外壳之间形成间隙。 然后，将吹扫气体从布置在装载口上方的气体导入管引入到FIMS门的向前倾斜方向的左侧和右侧进入壳体中，以用吹扫气体代替壳体中的气氛。

公开(公告)号：US06473996B1

公开(公告)日：2002-11-05

申请号：US09697174

申请日：2000-10-27

申请人： Kenji Tokunaga

发明人： Kenji Tokunaga

IPC分类号： F26B504

CPC分类号： H01L21/67259 ,  H01L21/67775 ,  H01L21/68 ,  Y10S414/137 ,  Y10S414/14

摘要： In a load port mechanism of a substrate treatment unit, protuberances are provided on a sealing surface formed along a door with which a wafer carrier is to dock, or on a sealing surface formed around the door of the wafer carrier. The wafer carrier door is faced with the load port door with the protuberances therebetween, thereby separating the sealing surface of the substrate treatment unit from the sealing surface of the wafer carrier by only a predetermined distance. Thus, there is formed a channel along which clean air flows from the inside of the substrate treatment unit to the outside thereof. The load port structure and the wafer carrier structure improve the reliability of opening/closing action of the wafer carrier and prevent entry of extraneous particles into the treatment unit with sufficient reliability, and enable high-yield production of integrated circuits.

摘要翻译： 在基板处理单元的负载端口机构中，在沿着与晶片载体对接的门形成的密封面上或在形成于晶片载体的门周围的密封面上设置突起。 晶片承载门面对负载端口门，其间具有突起，从而将基板处理单元的密封表面与晶片承载件的密封表面分开预定距离。 因此，形成有清洁空气从基板处理单元的内部流向其外部的通道。 负载端口结构和晶片载体结构提高了晶片载体的打开/关闭动作的可靠性，并且防止了外来颗粒以足够的可靠性进入处理单元，并且能够实现集成电路的高产量生产。

公开(公告)号：US4738736A

公开(公告)日：1988-04-19

申请号：US870745

申请日：1986-06-04

申请人： Koichi Takeuchi ,  Megumi Yamanaka ,  Masayoshi Kubo ,  Hideaki Katayama ,  Kenji Tokunaga

发明人： Koichi Takeuchi ,  Megumi Yamanaka ,  Masayoshi Kubo ,  Hideaki Katayama ,  Kenji Tokunaga

IPC分类号： B26D3/16 ,  B29C53/80 ,  B29C69/00 ,  B29D29/00 ,  B29D29/10 ,  B65H81/00

CPC分类号： B29D29/10 ,  B26D3/16 ,  B29C53/80 ,  B29C69/002 ,  B29D29/00

摘要： A method of and an apparatus for molding a belt for transmitting power, comprise mounting a cylindrical unvulcanized rubber sheet on a mandrel, selecting a necessary mandrel of a plurality of mandrels on which unvulcanized rubber sheets are mounted, moving the mandrel to a cord layer forming unit, winding a cord on the cylindrical unvulcanized rubber sheet mounted on the mandrel, moving the cord wound mandrel to a laminated body forming and cutting unit, winding an unvulcanized rubber sheet on the cord wound mandrel to form a laminated body, cutting the laminated body, moving the cut laminated body to an unvulcanized rubber sheet mounting unit, and taking out the belt.

摘要翻译： 一种用于模制用于传递动力的带的方法和装置，包括将圆柱形未硫化橡胶片安装在心轴上，选择其上安装有未硫化橡胶片的多个心轴的必需心轴，将心轴移动到形成 单元，将绳索缠绕在安装在心轴上的圆筒形未硫化橡胶片上，将帘线缠绕心轴移动到层叠体成形和切割单元，将未硫化橡胶片卷绕在缠绕心轴的芯线上以形成层叠体， 将切割的层压体移动到未硫化橡胶片安装单元，并取出带。

公开(公告)号：US4649780A

公开(公告)日：1987-03-17

申请号：US754865

申请日：1985-07-12

申请人： Koichi Takeuchi ,  Megumi Yamanaka ,  Hisanobu Inada ,  Masayoshi Kubo ,  Hideaki Katayama ,  Kenji Tokunaga ,  Yoshinori Miyamoto

发明人： Koichi Takeuchi ,  Megumi Yamanaka ,  Hisanobu Inada ,  Masayoshi Kubo ,  Hideaki Katayama ,  Kenji Tokunaga ,  Yoshinori Miyamoto

IPC分类号： B26D3/06 ,  B26D3/16 ,  B29D29/00 ,  B23B5/00

CPC分类号： B26D3/16 ,  B26D3/06 ,  B29D29/00 ,  Y10T82/16032 ,  Y10T82/16819 ,  Y10T82/16901 ,  Y10T83/0207 ,  Y10T83/0304 ,  Y10T83/853

摘要： A cutting device for use in cutting a cylindrical material around a mandrel into annular bodies of the desired width. This device has a first moving table to move in the axial direction of the mandrel, a second moving table to move on the first moving table in the radial direction of the mandrel, a cutter support carrying a first cutter adjustable in position in the radial direction of the mandrel and/or a second cutter adjustable in the axial direction of the mandrel, and a control unit with a device for detecting the position of each moving table, a device for receiving output signals from the detecting device and comparing the position with position data set beforehand and a driving circuit to move each moving table according to output signals from the comparing device.

摘要翻译： 一种用于将心轴周围的圆柱形材料切割成所需宽度的环形体的切割装置。 该装置具有沿着心轴的轴向移动的第一移动台，在心轴的径向方向上在第一移动台上移动的第二移动台，承载第一切割器的切割器支撑件，该第一切割器可在径向方向上位置调节 的心轴和/或可在心轴的轴向方向上调节的第二切割器，以及具有用于检测每个移动台的位置的装置的控制单元，用于从检测装置接收输出信号并将位置与位置进行比较的装置 预先设定的数据和根据来自比较装置的输出信号移动每个移动台的驱动电路。

公开(公告)号：US20080107517A1

公开(公告)日：2008-05-08

申请号：US11960804

申请日：2007-12-20

申请人： Yoshiaki KOYAYASHI ,  Shigen Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

发明人： Yoshiaki KOYAYASHI ,  Shigen Kobayashi ,  Kenji Tokunaga ,  Koji Kato ,  Teruo Minami

IPC分类号： B65H1/00

CPC分类号： H01L21/67775 ,  H01L21/6735 ,  H01L21/67772

摘要： A method is provided of manufacturing semiconductor devices formed on a semiconductor wafer, including placing the wafer in a semiconductor container and conveying the container to a semiconductor manufacturing apparatus. An opening of the container is opposed to an opening of the apparatus such that an opener of the apparatus holds a lid of the opening the container. A key of the opener is inserted to a latch groove of the lid, and the key is rotated to contact a latch of the lid. The openings are connected such that a velocity differential pressure ratio obtained by dividing the maximum velocity when the opener holding the lid horizontally moves away from the opening of the container, by the differential pressure between the inside pressure and the outside pressure of the apparatus, is set to be 0.06 ((m/s)/Pa) or less, and then the wafer is processed.

摘要翻译： 提供一种制造形成在半导体晶片上的半导体器件的方法，包括将晶片放置在半导体容器中并将容器输送到半导体制造装置。 容器的开口与装置的开口相对，使得装置的开启器保持容器的开口盖。 开启器的钥匙被插入到盖的闩锁槽中，并且钥匙被旋转以接触盖的闩锁。 这些开口被连接成使得通过将保持盖的开启器水平地移动离开容器的开口的最大速度获得的速度差压比通过内部压力和设备的外部压力之间的压差来实现， 设定为0.06（（m / s）/ Pa）以下，然后处理晶片。

公开(公告)号：US07077173B2

公开(公告)日：2006-07-18

申请号：US10191802

申请日：2002-07-10

申请人： Kenji Tokunaga

发明人： Kenji Tokunaga

IPC分类号： B65B1/04

CPC分类号： H01L21/67379 ,  H01L21/67017 ,  H01L21/67389 ,  H01L21/67393 ,  Y10S414/137 ,  Y10S414/139

摘要： When atmosphere inside a wafer carrier is replaced by introducing a gas into the wafer carrier from a gas inlet provided to the wafer carrier that can accommodate wafers. At the same time, the atmosphere inside the wafer carrier is sucked to make an inside pressure negative relative to an outside pressure.

公开(公告)号：US06282902B1

公开(公告)日：2001-09-04

申请号：US09343273

申请日：1999-06-30

申请人： Tsutomu Okusawa ,  Kazuhito Koyama ,  Masahiko Yamagishi ,  Shigeo Hatamiya ,  Taiko Ajiro ,  Megumi Sunou ,  Yukio Ishigaki ,  Kenji Tokunaga

发明人： Tsutomu Okusawa ,  Kazuhito Koyama ,  Masahiko Yamagishi ,  Shigeo Hatamiya ,  Taiko Ajiro ,  Megumi Sunou ,  Yukio Ishigaki ,  Kenji Tokunaga

IPC分类号： F01K734

CPC分类号： B01B1/005 ,  C01B3/38 ,  F01K3/247 ,  F02G2254/11 ,  F23G5/0276 ,  F23G5/46 ,  F23G2202/106 ,  F23G2206/10 ,  F23J15/08 ,  Y02E20/12

摘要： A waste-to-energy incineration system, in which the amount and heat value of exhaust gas largely changes in long and short periods, comprises an incinerator for burning waste, a boiler in the incinerator for generating steam with exhaust heat generated by the incinerator, a superheater for superheating steam generated in the boiler, a steam turbine driven by steam superheated by the superheater, a generator driven by the steam turbine, a fuel reformer for reforming source fuel, and a combustor burning fuel gas reformed by the fuel reformer and at least a part of exhaust gas led from the incinerator which is able to stably decompose generated dioxin in waste incineration exhaust gas.

摘要翻译： 一种废物能量焚烧系统，其中废气的量和热值在短时间内大幅度变化，包括用于燃烧废物的焚烧炉，焚烧炉中的用于产生由焚烧炉产生的废热的蒸汽的锅炉， 用于过热锅炉中产生的蒸汽的过热器，由过热器过热的蒸汽驱动的蒸汽轮机，由蒸汽轮机驱动的发电机，用于重整源燃料的燃料重整器，以及燃烧器燃烧由燃料重整器重整的燃料气体 从焚烧炉引出的废气的至少一部分能够稳定地分解废弃焚烧废气中产生的二恶英。

公开(公告)号：US5127470A

公开(公告)日：1992-07-07

申请号：US565683

申请日：1990-08-09

申请人： Yoshiaki Inaba ,  Kenji Tokunaga ,  Akihiro Shimizu ,  Tetsuzo Kuribayashi

发明人： Yoshiaki Inaba ,  Kenji Tokunaga ,  Akihiro Shimizu ,  Tetsuzo Kuribayashi

IPC分类号： F02C6/18 ,  F01K3/00 ,  F01K23/10 ,  F02G5/02 ,  F24V30/00 ,  F28D20/00

CPC分类号： F01K23/10 ,  F01K3/00 ,  F28D20/003 ,  Y02E60/142 ,  Y10S165/909

摘要： An apparatus for heat recovery from an exhaust gas with waste heat from a heat machinery unit, which comprises a pair of first and second chemical heat-storing units, each comprising a vessel containing a reactant material capable of releasing a reaction-susceptible material upon heating with an exhaust gas and emitting the heat of reaction upon combination with the reaction-susceptible material and a heat exchanger piping provided in the vessel and through which a heat transfer medium is passed. The high temperature gas from the heat machinery unit is applied to the vessel in one of the first and second chemical heat-storing units, thereby resulting in a reaction for leasing the reaction-susceptible material. A further reaction to combine the heat-susceptible material in the vessel in the other of the first or second chemical heat-storing units, and is passed the heat transfer medium through the heat exchanger piping in the vessel in the other of the first or second chemical heat-storing unit for continuously providing a high heat recovery efficiency.

摘要翻译： 一种用于从具有来自热机械单元的废热排出的废气进行热回收的装置，其包括一对第一和第二化学储热单元，每个第一和第二化学储热单元包括容纳含有能够在加热时释放反应敏感材料的反应物料的容器 与废气结合并且与反应敏感材料组合并发出反应热，以及设置在容器中的热交换器管道，并且传热介质通过该热交换器管道。 来自热机械单元的高温气体被施加到第一和第二化学储热单元之一中的容器中，从而导致用于租赁反应敏感材料的反应。 在第一或第二化学储热单元中的另一个中将容器中的热敏材料组合的另一反应，并且使传热介质通过容器中的热交换器管道中的第一或第二化学蓄热单元中的另一个 化学蓄热单元，用于连续提供高热回收效率。