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公开(公告)号：US4828135A
公开(公告)日：1989-05-09
申请号：US83471
申请日：1987-08-10
IPC分类号： B65D17/34
CPC分类号： B65D17/16
摘要： A can comprising a barrel, an upper lid and a lower lid bonded to the barrel. Both the upper and lower lids comprise a gas liquid impermeable barrier layer, preferably aluminum foil, and resin layers heat fused to both sides thereof. Another resin layer is bonded to the exterior of the lids, with the upper lids having a tab and score to be perforated by the tab built into the resin layer. According to the invention, the yield strength of the top lid is made greater than that of the lower lid to prevent breaking of the score if the can is dropped. The differential strength may be accomplished by making the barrier layer of the top lid greater than that of the bottom lid.
摘要翻译： 一种罐，其包括结合到筒的筒，上盖和下盖。 上盖和下盖均包括气液不可渗透的阻挡层，优选铝箔，以及热熔合到其两侧的树脂层。 另一树脂层结合到盖的外部，上盖具有凸片，刻痕被内置于树脂层中的凸片穿孔。 根据本发明，使得顶盖的屈服强度大于下盖的屈服强度，以防止如果罐掉落则打破分数。 差分强度可以通过使顶盖的阻挡层大于底盖的阻挡层来实现。
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公开(公告)号：US4784284A
公开(公告)日：1988-11-15
申请号：US32125
申请日：1987-03-30
CPC分类号： B65D17/165
摘要： A cover for a can comprising a multi-layer base of aluminum foil between heat-fusible resin layers and an overlying laminated resin layer. The outer resin layer has an inner section and a surrounding outer section separated by a gap through which the multi-layer base is exposed. The gap is smooth and continuous, that is, does not have a point, so that the inner section can be leveraged into the multi-layer base and the stress is uniformly distributed over a wide area of the multi-layer base.
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公开(公告)号：US6071759A
公开(公告)日：2000-06-06
申请号：US893687
申请日：1997-07-11
IPC分类号： H01L21/00 , H01L21/58 , H01L23/495 , H01L21/44
CPC分类号： H01L24/83 , H01L21/67103 , H01L21/67144 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L2224/32245 , H01L2224/83192 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01065 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/15747
摘要： In a hardening temperature profile of a paste material for fixing a lead-frame to a semiconductor chip, a heating temperature from a first sub-zone to a third sub-zone is set to 150.degree. C. and a heating temperature from a fourth sub-zone to a sixth sub-zone is set to a maximum value of 230.degree. C. at a first heating step of a chip fixing step. Then, in the hardening temperature profile, a heating temperature of a seventh sub-zone is set to 180.degree. C. having a drop width from the sixth sub-zone of 50 degrees and a heating temperature of an eighth sub-zone is set to 130.degree. C. having a drop width from the seventh sub-zone of 50 degrees at a second heating step of the chip fixing step.
摘要翻译： 在用于将引线框架固定到半导体芯片的糊状材料的硬化温度分布中，从第一子区域到第三子区域的加热温度设定为150℃，加热温度从第四子层 在第一加热步骤的芯片固定步骤中将第一子区域设置为最大值230℃。 然后，在硬化温度曲线中，将第七子区域的加热温度设定为180℃，具有从第五子区域的下落宽度为50度，将第八子区域的加热温度设定为 130℃，在芯片固定步骤的第二加热步骤中具有从第五子区域50度的下降宽度。
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公开(公告)号：USD266253S
公开(公告)日：1982-09-21
申请号：US109616
申请日：1980-01-04
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公开(公告)号：USD266254S
公开(公告)日：1982-09-21
申请号：US109617
申请日：1980-01-04
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