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1.发明授权Etchant, method for roughening copper surface and method for producing printed wiring board 失效蚀刻铜表面粗糙化方法及印刷电路板的制造方法公开(公告)号：US07189336B2
公开(公告)日：2007-03-13
申请号：US10393874
申请日：2003-03-21
IPC分类号： C23F1/34
CPC分类号： H05K3/383 , C23F1/18 , H05K3/4611 , H05K2203/0796 , H05K2203/124
摘要： An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.
摘要翻译： 一种蚀刻剂和一种使铜表面粗糙化的方法，每个铜表面能够允许具有耐酸性的粗糙表面的铜，并且允许铜导电图案和外层材料在制造印刷线路板中彼此牢固地结合以简化 制造业。 蚀刻剂可以含有一种含氧酸如硫酸，过氧化物如过氧化氢和辅助成分如唑和氯。 唑可以包括苯并三唑（BTA）。 氯可以是氯化钠（NaCl）的形式。 蚀刻剂允许铜表面以针状方式粗糙化。
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2.发明授权公开(公告)号：US06544436B2
公开(公告)日：2003-04-08
申请号：US08901700
申请日：1997-07-28
IPC分类号： C09K1306
CPC分类号： H05K3/383 , C23F1/18 , H05K3/4611 , H05K2203/0796 , H05K2203/124
摘要： An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.
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公开(公告)号：US06902626B2
公开(公告)日：2005-06-07
申请号：US10696486
申请日：2003-10-29
IPC分类号： H05K3/06 , A62C2/00 , A62D1/00 , B41N3/03 , C23F1/14 , C23F1/18 , C23G1/00 , H05K3/38 , H05K3/46
CPC分类号： B41N3/03 , C23F1/18 , H05K3/383 , H05K3/4611 , H05K2203/0796 , H05K2203/124
摘要： A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.
摘要翻译： 能够提供具有粗糙表面的铜的铜表面的粗糙化的液体蚀刻剂和粗糙化方法在短时间内与氯离子无关地增加耐酸性，从而确保铜导电图案和外层之间的牢固粘合 在制造印刷电路板期间的材料，导致制造被高度简化。 液体蚀刻剂包括含有氧酸如硫酸和过氧化氢如过氧化氢的主要成分。 此外，液体蚀刻剂包括含有四唑的辅助成分，例如5-氨基四唑等，或1,2,3,4-唑。 液体蚀刻剂允许铜表面以针状方式粗糙化。
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公开(公告)号：US06666987B1
公开(公告)日：2003-12-23
申请号：US09327800
申请日：1999-06-08
IPC分类号： C09K1306
CPC分类号： B41N3/03 , C23F1/18 , H05K3/383 , H05K3/4611 , H05K2203/0796 , H05K2203/124
摘要： A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.
摘要翻译： 能够提供具有粗糙表面的铜的铜表面的粗糙化的液体蚀刻剂和粗糙化方法在短时间内与氯离子无关地增加耐酸性，从而确保铜导电图案和外层之间的牢固粘合 在制造印刷电路板期间的材料，导致制造被高度简化。 液体蚀刻剂包括含有氧酸如硫酸和过氧化氢如过氧化氢的主要成分。 此外，液体蚀刻剂包括含有四唑的辅助成分，例如5-氨基四唑等，或1,2,3,4-唑。 液体蚀刻剂允许铜表面以针状方式粗糙化。
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5.发明授权
公开(公告)号：US4407652A
公开(公告)日：1983-10-04
申请号：US326049
申请日：1981-11-30
CPC分类号： F27B7/2025
摘要： Disclosed is an apparatus for calcining raw materials in the form of powder or particles. The gases entrain the particles to spiral upward in the calcining furnace. In an upper throttle chamber the relatively coarse particles which have not been completely calcined are separated from the gas flow and returned into the calcining zone to be calcined again. This pattern of material flow is repeated several times. The calcining efficiency can be improved, so that the furnace can be made small in size. The uniformly calcined particles are discharged from the top of the furnace and introduced into one or more cyclone separators through an outlet duct including a 180.degree. bend section.
摘要翻译： 公开了一种以粉末或颗粒形式煅烧原料的设备。 气体在煅烧炉中夹带颗粒向上螺旋。 在上节流室中，尚未完全煅烧的相对较粗的颗粒与气流分离并返回煅烧区再次煅烧。 这种材料流动模式重复几次。 可以提高煅烧效率，使炉子的尺寸变小。 均匀煅烧的颗粒从炉顶排出并通过包括180°弯曲部分的出口管道引入一个或多个旋风分离器。
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