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公开(公告)号：US20050072527A1
公开(公告)日：2005-04-07
申请号：US10972579
申请日：2004-10-26
IPC分类号： H01L21/304 , B24B37/30 , B24B37/32 , C23F1/00
摘要： A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
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公开(公告)号：US07897007B2
公开(公告)日：2011-03-01
申请号：US12136424
申请日：2008-06-10
IPC分类号： B24B41/06 , B24B37/04 , H01L21/304
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置具有基板保持体，基板保持面朝向研磨面，并且将基板保持在基板保持侧，并且保持环固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当基板的抛光实现时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
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公开(公告)号：US20080047667A1
公开(公告)日：2008-02-28
申请号：US11907590
申请日：2007-10-15
IPC分类号： B24B57/00
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
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公开(公告)号：US20080299880A1
公开(公告)日：2008-12-04
申请号：US12136424
申请日：2008-06-10
IPC分类号： B24B41/06
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置具有基板保持体，基板保持面朝向研磨面，并且将基板保持在基板保持侧，并且保持环固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当基板的抛光实现时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
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公开(公告)号：US20080066862A1
公开(公告)日：2008-03-20
申请号：US11979019
申请日：2007-10-30
IPC分类号： C23F1/00
摘要： A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置具有基板保持体，基板保持面朝向研磨面，并且将基板保持在基板保持侧，并且保持环固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当基板的抛光实现时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
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公开(公告)号：US06890402B2
公开(公告)日：2005-05-10
申请号：US09917732
申请日：2001-07-31
IPC分类号： H01L21/304 , B24B37/30 , B24B37/32 , B24B37/04 , B24B41/06
摘要： A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.
摘要翻译： 基板保持装置包括：基板保持体，其具有面向抛光表面的基板保持侧，并且将基板保持在基板保持侧;以及保持环，其固定地固定到基板保持体。 保持环被布置成围绕由基板保持器主体保持的基板的外周，使得当进行基板的抛光时，保持环与基板的径向外侧的抛光表面接合。 衬底保持器主体设置有具有内表面和外表面的膜。 内表面与衬底保持器主体的表面配合以限定施加流体压力的流体压力室。 外表面与由基板保持体保持的基板接合。
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公开(公告)号：USD634719S1
公开(公告)日：2011-03-22
申请号：US29356450
申请日：2010-02-25
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公开(公告)号：US07850509B2
公开(公告)日：2010-12-14
申请号：US12285936
申请日：2008-10-16
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
摘要翻译： 本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于接触弹性垫的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。
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公开(公告)号：US07491117B2
公开(公告)日：2009-02-17
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
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公开(公告)号：USD633452S1
公开(公告)日：2011-03-01
申请号：US29356456
申请日：2010-02-25
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