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7 条记录 (耗时 0.014 秒)

    Package unit
    1.
    发明申请
    Package unit 有权
    包装单元

    公开(公告)号：US20080036074A1

    公开(公告)日：2008-02-14

    申请号：US11889079

    申请日：2007-08-09

    申请人： Yoshihisa Iwakiri

    发明人： Yoshihisa Iwakiri

    IPC分类号： H01L23/10

    CPC分类号： H01L23/36 ,  H01L23/04 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/15311 ,  H01L2924/16195

    摘要： This invention relates to a package unit including a semiconductor package that houses a semiconductor chip, and a heat sink attached thereto. A peripheral wall section that surrounds a thermal junction member is provided on a stiffener. More preferably, a tip end section of the peripheral wall section is allowed to fit into a slit provided on the heat sink. The peripheral wall section may be provided on a heat spreader instead. It is possible to prevent the thermal junction member from falling outside without incurring addition of new components or new occupancy of the area on a system substrate.

    摘要翻译： 本发明涉及包含半导体封装的封装单元，该半导体封装容纳半导体芯片，以及附着于其上的散热片。 围绕热接合构件的周壁部分设置在加强件上。 更优选地，允许周壁部分的末端部分装配到设置在散热器上的狭缝中。 周壁部分可以设置在散热器上。 可以防止热接合部件脱落而不会在系统基板上引起新部件的添加或新的占用。

    Cooling device for accommodated printed circuit board in a chassis
    3.
    发明授权
    Cooling device for accommodated printed circuit board in a chassis 有权
    用于机箱内容纳印刷电路板的冷却装置

    公开(公告)号：US07864523B2

    公开(公告)日：2011-01-04

    申请号：US12412593

    申请日：2009-03-27

    申请人： Yoshihisa Iwakiri

    发明人： Yoshihisa Iwakiri

    IPC分类号： H05K7/20 ,  G06F1/20

    CPC分类号： H05K7/20727

    摘要： A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space, a fan occupying the third space outside a predetermined space that produces an air flow from the first space toward the second space by rotation of a rotor blade, wherein the predetermined space is ensured between the printed circuit board and the fan in the third space and an air duct member that occupies the predetermined space to form a flow passage of the air flow from an intake port to an exhaust port on the printed circuit board, wherein the intake port is opened to the second space and the exhaust port is opened to the first space.

    摘要翻译： 冷却装置包括分隔第一空间，第二空间和夹在第一空间和第二空间之间的第三空间的底盘，容纳在从第一空间延伸到第二空间的底盘中的横向移动的印刷电路板 第三空间，风扇，其占据由预定空间外部的第三空间，其通过转子叶片的旋转产生从第一空间朝向第二空间的空气流，其中确保印刷电路板和风扇之间的预定空间 第三空间和空气管道构件，其占据预定空间以形成空气流从印刷电路板上的进气口到排气口的流路，其中进气口向第二空间开口，排气口为 开到第一个空间。

    Package unit
    7.
    发明授权
    Package unit 有权
    包装单元

    公开(公告)号：US07800218B2

    公开(公告)日：2010-09-21

    申请号：US11889079

    申请日：2007-08-09

    申请人： Yoshihisa Iwakiri

    发明人： Yoshihisa Iwakiri

    IPC分类号： H01L23/10 ,  H01L23/34

    CPC分类号： H01L23/36 ,  H01L23/04 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/15311 ,  H01L2924/16195

    摘要： This invention relates to a package unit including a semiconductor package that houses a semiconductor chip, and a heat sink attached thereto. A peripheral wall section that surrounds a thermal junction member is provided on a stiffener. More preferably, a tip end section of the peripheral wall section is allowed to fit into a slit provided on the heat sink. The peripheral wall section may be provided on a heat spreader instead. It is possible to prevent the thermal junction member from falling outside without incurring addition of new components or new occupancy of the area on a system substrate.

    摘要翻译： 本发明涉及包含半导体封装的封装单元，该半导体封装容纳半导体芯片，以及附着于其上的散热片。 围绕热接合构件的周壁部分设置在加强件上。 更优选地，允许周壁部分的末端部分装配到设置在散热器上的狭缝中。 周壁部分可以设置在散热器上。 可以防止热接合部件脱落而不会在系统基板上引起新部件的添加或新的占用。