公开(公告)号：US06321448B1

公开(公告)日：2001-11-27

申请号：US09621557

申请日：2000-07-21

申请人： Yoshinobu Makino ,  Kiyoshi Yamada ,  Katsunori Minami ,  Masahiro Yamada ,  Kazunori Hamada

发明人： Yoshinobu Makino ,  Kiyoshi Yamada ,  Katsunori Minami ,  Masahiro Yamada ,  Kazunori Hamada

IPC分类号： B23P1500

CPC分类号： F01D9/044 ,  B23K26/38 ,  B23K2101/001 ,  B23P15/006 ,  Y10T29/49323 ,  Y10T29/49826 ,  Y10T29/49996

摘要： In a method of manufacturing a turbine nozzle having a nozzle blade body, a flat plate is prepared. A first support plate for supporting an inner ring side of the turbine nozzle is blanked from the flat plate by using laser beam cutting. A second support plate for supporting an outer ring side of the turbine nozzle is blanked from the flat plate by using laser beam cutting. Each of the first and second support plates in bent so as to form each of the first and second support plates as a ring member. While controlling laser beam based on a program, by the laser beam, the ring-formed first and second support plates are drilled so as to form holes therethrough. At that time, each of the holes has a three-dimensional blade profile, and the three-dimensional blade profile corresponds to a three-dimensional profile of the nozzle blade body. After that, the nozzle blade body is inserted into the holes of the first and second support platen so as to weld the nozzle blade body thereto by using a laser beam. On the other hand, a diaphragm inner ring and a diaphragm outer ring are prepared and the first and second support plates are welded into the diaphragm inner and outer rings, respectively so as to manufacture the turbine nozzle.

摘要翻译： 在制造具有喷嘴刀体的涡轮喷嘴的方法中，制备平板。 用于支撑涡轮喷嘴的内环侧的第一支撑板通过使用激光束切割从平板冲切。 用于支撑涡轮喷嘴的外环侧的第二支撑板通过使用激光束切割从平板冲切。 所述第一支撑板和所述第二支撑板中的每一个被弯曲以形成所述第一和第二支撑板中的每一个作为环形构件。 在通过激光束控制基于程序的激光束的同时，钻出环形的第一和第二支撑板以形成穿过其中的孔。 此时，每个孔具有三维叶片轮廓，并且三维叶片轮廓对应于喷嘴叶片体的三维轮廓。 之后，将喷嘴刀体插入到第一和第二支撑压板的孔中，以便通过使用激光束将喷嘴刀体焊接到其上。 另一方面，制备隔膜内圈和隔膜外圈，分别将第一和第二支撑板焊接到隔膜内外圈中，以制造涡轮喷嘴。

公开(公告)号：US5672549A

公开(公告)日：1997-09-30

申请号：US681348

申请日：1996-07-22

申请人： Katsunori Minami ,  Hideo Ito

发明人： Katsunori Minami ,  Hideo Ito

IPC分类号： B29C45/00 ,  B29C45/14 ,  B29C45/74 ,  H01L21/56 ,  H01L21/60

CPC分类号： B29C45/14655 ,  B29C45/00 ,  B29C45/14565 ,  B29C45/74 ,  H01L21/565 ,  H01L2924/0002

摘要： In a method of producing a resin-encapsulated semiconductor device, a lead frame having an semiconductor element bonded thereto and wire-bonded thereto is set as an insert into an injection mold. An epoxy resin molding compound is injected into the mold by an injection molding. In this method, an injection pressure of the injection molding machine is gradually increased in such a manner that a maximum pressure of 30 kg/cm.sup.2 to 300 kg/cm.sup.2 is achieved at the time when 80% to 95% of a total amount of the epoxy resin molding compound to be injected is injected into the mold. Subsequently, the remaining epoxy resin molding compound is injected into the mold at an injection pressure of 20 kg/cm.sup.2 to 100 kg/cm.sup.2. A heating cylinder of the injection molding machine is divided into a plurality of zones which are controlled in the temperature independently. The zone nearest to a nozzle of the heating cylinder is controlled to 65.degree. C.-110.degree. C. while that zone nearest to a hopper of the heating cylinder is controlled to the ordinary temperature to 50.degree. C.

摘要翻译： 在制造树脂封装的半导体器件的方法中，将具有结合到其上并与其导线接合的半导体元件的引线框架设置为注入模具中的插入件。 通过注射成型将环氧树脂模塑料注入模具中。 在该方法中，注射成型机的注射压力逐渐增加，使得当达到最大压力为30kg / cm 3至300kg / cm 2时，其总量为80％至95％ 要注入的环氧树脂模塑料注入模具中。 随后，以20kg / cm 2至100kg / cm 2的注射压力将剩余的环氧树脂模塑料注入模具中。 注射成型机的加热筒被分成多个控制在独立温度的区域。 将最靠近加热缸喷嘴的区域控制在65℃-110℃，而最靠近加热缸料斗的区域控制在常温至50℃。