摘要:
The present invention is a command or data transfer between two integrated circuit devices (hereafter LSIs) wherein an LSI issuing a command or data (issuing side LSI) outputs a strobe signal, which indicates that a valid command or data was transmitted, to the LSI which receives the command or data (receiving side LSI), and the receiving side LSI outputs a signal, which notifies that the command processing completed (command ready signal), to the issuing side LSI. The issuing side LSI comprises a counter where a value to indicate the number of commands which the receiving side LSI can simultaneously process or simultaneously receive is loaded at initialization, wherein the counter is decremented when a command or data is issued, the counter is incremented when the ready signal is received, and issuing a command or data is inhibited when the counter becomes “0”. Therefore the issuing side LSI can issue a command or data to the receiving side LSI without confirming a busy signal from the receiving side LSI.
摘要:
The present invention is a command or data transfer between two integrated circuit devices (hereafter LSIs) wherein an LSI issuing a command or data (issuing side LSI) outputs a strobe signal, which indicates that a valid command or data was transmitted, to the LSI which receives the command or data (receiving side LSI), and the receiving side LSI outputs a signal, which notifies that the command processing completed (command ready signal), to the issuing side LSI. The issuing side LSI comprises a counter where a value to indicate the number of commands which the receiving side LSI can simultaneously process or simultaneously receive is loaded at initialization, wherein the counter is decremented when a command or data is issued, the counter is incremented when the ready signal is received, and issuing a command or data is inhibited when the counter becomes “0”. Therefore the issuing side LSI can issue a command or data to the receiving side LSI without confirming a busy signal from the receiving side LSI.
摘要:
The present invention is a command or data transfer between two integrated circuit devices (hereafter LSIS) wherein an LSI issuing a command or data (issuing side LSI) outputs a strobe signal, which indicates that a valid command or data was transmitted, to the LSI which receives the command or data (receiving side LSI), and the receiving side LSI outputs a signal, which notifies that the command processing completed (command ready signal), to the issuing side LSI. The issuing side LSI comprises a counter where a value to indicate the number of commands which the receiving side LSI can simultaneously process or simultaneously receive is loaded at initialization, wherein the counter is decremented when a command or data is issued, the counter is incremented when the ready signal is received, and issuing a command or data is inhibited when the counter becomes “0”. Therefore the issuing side LSI can issue a command or data to the receiving side LSI without confirming a busy signal from the receiving side LSI.
摘要:
An In—Sn alloy of 85 to 52% In provides advantages that dispersion of an operating temperature can be sufficiently eliminated, and that a high yield can be ensured by adequate ductility, but has a defect which is fatal to a DC fuse, or in which troubles due to long-term DC application such as long-term DC application breakage occurs. In view of this fact, when an alloy type thermal fuse in which an In—Sn alloy is used as a fuse element is used under DC application, stability under long-term DC application that is a condition severer than that under AC application is imposed on the alloy type thermal fuse, whereby the fuse can be rationally used. An AC electronic/electrical appliance is protected against overheating by an AC-only alloy type thermal fuse in which a fuse element is made of an In—Sn alloy, and which has a predetermined operating temperature, and a DC electronic/electrical appliance is protected against overheating of a same temperature by a DC alloy type thermal fuse in which the alloy composition of a fuse element is different from that of the AC-only alloy type thermal fuse.
摘要:
A semiconductor integrated circuit including a debugging support unit and a buffer memory for temporarily storing trace data, the debugging support unit comprising a break detection member that detects a break signal externally inputted and a break determining member that determines whether the break signal requests to shift to break processing after outputting all the trace data stored in the buffer memory or the break signal requests to shift to the break processing with immediately suspending trace data outputting.
摘要:
An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In-Sn alloy is used, the operation stability to a heat cycle can be satisfactorily assured, and, even when the amount of In is large, a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. The fuse element has an alloy composition in which 0.1 to 7 weight parts of one, or two or more metals selected from the group consisting of Ag, Au, Cu, Ni, Pd, Pt, and Sb are added to 100 weight parts of an alloy of 52 to 85% In and a balance Sn.
摘要:
A direct memory access control system supplies the respective status signals indicating timings of the read data effective state or writable state between the input/output interface and memory interface, both interfaces maintain the read data effective state and writable state of the input/output memory and synchronous memory under control until the later timing comes up. Consequently, it is possible to match the read data effective timing and writable timing of the synchronous memory and input/output memory, thus making possible flyby transfer of data between both memories.
摘要:
A current measurement unit measuring power supply currents each consumed in a plurality of circuit blocks of which at least one of the circuit blocks includes a processor, and outputting the measurement result as the power supply current values. A selection unit selecting at least one of the power supply current values according to selection information. A trace buffer sequentially holding the power supply current values being selected by the selection unit together with execution information of the processor, and sequentially outputting the held information. By selecting the power supply current values of the circuit blocks required for debugging according to the selection information, the number of external terminals of a semiconductor integrated circuit required for the debugging which includes tracing the power supply current values may be reduced. As a result, a chip size of the semiconductor integrated circuit with a debug function may be reduced.
摘要:
The invention relates to an alloy type thermal fuse and a wire member for a thermal fuse element, and provides an alloy type thermal fuse in which a fuse element does not contain a harmful metal, the operating temperature is about 150° C., the dispersion of the operating temperature can be sufficiently suppressed, and the operation stability to a heat cycle can be satisfactorily assured. The thermal fuse has an alloy composition of 30 to 70% Sn, 0.3 to 20% Sb, and a balance Bi.
摘要:
An alloy type thermal fuse is provided in which, although a fuse element essentially comprising an In—Sn alloy is used, shear breakage at the melting point or lower can be prevented from occurring even under long-term DC application, the operation stability to a heat cycle can be satisfactorily assured, and a process of drawing to the fuse element at a high yield can be ensured, and which has an operating temperature belonging to the range of 120 to 150° C. As a metal element for preventing long-term DC breakage which prevents the fuse element from being broken under long-term DC application, Cu is added to an In—Sn composition of 52 to 85% In and a balance Sn.