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公开(公告)号：US4948413A
公开(公告)日：1990-08-14
申请号：US195731
申请日：1988-05-16
申请人： Yoshio Maekawa , Osamu Yagyu , Hironori Mizuno , Minoru Okumura , Shigeru Isoda , Kaoru Yagi
发明人： Yoshio Maekawa , Osamu Yagyu , Hironori Mizuno , Minoru Okumura , Shigeru Isoda , Kaoru Yagi
摘要： A mixture of 2-piperidone and an N-acyllactam compound for use as a soil amending agent which is provided in a molar ratio of 2-piperidone to N-acyllactam compound in the range from 0.1:1 to 10:1 is effective in the promotion of plant growth.
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公开(公告)号：US5888053A
公开(公告)日：1999-03-30
申请号：US598651
申请日：1996-02-08
申请人： Makoto Kobayashi , Masakazu Yamamoto , Yoshio Miyake , Koji Isemoto , Kaoru Yagi , Keita Uwai , Yoshiaki Miyazaki , Katsuji Iijima , Junya Kawabata
发明人： Makoto Kobayashi , Masakazu Yamamoto , Yoshio Miyake , Koji Isemoto , Kaoru Yagi , Keita Uwai , Yoshiaki Miyazaki , Katsuji Iijima , Junya Kawabata
CPC分类号： F04D1/06 , F04D29/4266 , F04D29/445
摘要： A pump having an improved fluid passage has an inner casing which houses at least one impeller and an outer casing which houses the inner casing. The pump also has a communicating pipe disposed outside of the outer casing for guiding a main flow of a fluid being handled from a space defined in the outer casing into another space defined in the outer casing.
摘要翻译： 具有改进的流体通道的泵具有容纳至少一个叶轮的内壳和容纳内壳的外壳。 泵还具有设置在外壳外部的连通管，用于将被处理流体的主流从限定在外壳中的空间引导到限定在外壳中的另一空间。
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公开(公告)号：US08562727B2
公开(公告)日：2013-10-22
申请号：US13319194
申请日：2010-05-07
申请人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
发明人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , H01L2224/85464 , H05K3/244
摘要： Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
摘要翻译： 公开了一种化学镀钯溶液，其可以形成对电子部件等具有优异的焊接性质的镀层，并且具有优异的引线接合性能。 化学镀钯溶液包括钯化合物，胺化合物，无机硫化合物和还原剂，其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂，以及 其中钯化合物，胺化合物，无机硫化合物，次磷酸化合物，甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔 分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。 无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。
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公开(公告)号：US20120118196A1
公开(公告)日：2012-05-17
申请号：US13319194
申请日：2010-05-07
申请人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
发明人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
IPC分类号： C09D1/00
CPC分类号： C23C18/44 , H01L2224/85464 , H05K3/244
摘要： Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
摘要翻译： 公开了一种化学镀钯溶液，其可以形成对电子部件等具有优异的焊接性质的镀层，并且具有优异的引线接合性能。 化学镀钯溶液包括钯化合物，胺化合物，无机硫化合物和还原剂，其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂，以及 其中钯化合物，胺化合物，无机硫化合物，次磷酸化合物，甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔 分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。 无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。
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公开(公告)号：US06350105B1
公开(公告)日：2002-02-26
申请号：US09402617
申请日：1999-10-25
申请人： Makoto Kobayashi , Masakazu Yamamoto , Yoshio Miyake , Kaoru Yagi , Keita Uwai , Yoshiaki Miyazaki , Katsuji Iijima
发明人： Makoto Kobayashi , Masakazu Yamamoto , Yoshio Miyake , Kaoru Yagi , Keita Uwai , Yoshiaki Miyazaki , Katsuji Iijima
IPC分类号： F04B4906
CPC分类号： F04D15/0066
摘要： A fluid machinery for generating a pressure by rotating an impeller with a motor has a frequency converter (F) for supplying electric power to the motor, a detector for detecting a frequency and a current value, and a program for specifying in advance the relationship between the frequency and the current value. A frequency and a current value in an actual operation are compared with the specified program, and the frequency generated by the frequency converter (F) is varied so that an operating point of the fluid machinery approaches the specified program.
摘要翻译： 用于通过用电动机旋转叶轮产生压力的流体机械具有用于向电动机供电的变频器（F），用于检测频率和电流值的检测器，以及用于预先指定 频率和当前值。 将实际操作中的频率和当前值与指定的程序进行比较，并且变频器（F）产生的频率被改变，使得流体机械的操作点接近指定的程序。
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