专利检索 ap:("Yoshitaka Tsunashima" OR "Katsuya Okumura" OR "Shigeru Yonemoto") AND inv:"Shigeru Yonemoto" 第 1 页

1.

发明授权
Apparatus for supporting semiconductor wafers and semiconductor wafer processing method using supporting apparatus 失效
标题翻译：用于支撑半导体晶片的装置和使用支撑装置的半导体晶片处理方法

公开(公告)号：US06133121A

公开(公告)日：2000-10-17

申请号：US950913

申请日：1997-10-15

申请人： Yoshitaka Tsunashima , Katsuya Okumura , Shigeru Yonemoto

发明人： Yoshitaka Tsunashima , Katsuya Okumura , Shigeru Yonemoto

IPC分类号： C23C16/458 , H01L21/31 , H01L21/324 , H01L21/673 , C23C16/00

CPC分类号： H01L21/67303 , C23C16/4583 , H01L21/67306 , H01L21/67309

摘要： A plurality of rods are arranged between first and second plates. A plurality of support members formed of heat-resistant strings, for example, SiC are stretched between the rods and wafers are supported by the support members. The wafers are separated from the rods while they are supported on the support members.

摘要翻译： 多个杆布置在第一和第二板之间。由耐热线圈例如SiC形成的多个支撑构件在杆之间拉伸，并且晶片由支撑构件支撑。当晶片被支撑在支撑构件上时，晶片与棒分离。