公开(公告)号：US06366310B1

公开(公告)日：2002-04-02

申请号：US09029097

申请日：1998-03-17

申请人： Yoshiyuki Nagai ,  Ryoji Inutsuka ,  Kunio Ohe ,  Hideo Sakon ,  Koichi Yabuki ,  Kazuhiro Murata

发明人： Yoshiyuki Nagai ,  Ryoji Inutsuka ,  Kunio Ohe ,  Hideo Sakon ,  Koichi Yabuki ,  Kazuhiro Murata

IPC分类号： H04N718

CPC分类号： H05K13/0812

摘要： An electronic parts mounting apparatus for divisionally recognizing an electronic part (2) even when the apparatus is arranged in such that the relative positional relation between a recognition camera (4) and a nozzle (1) cannot be varied. The electronic part (2) is vacuum-clamped by a nozzle (1), the posture of the nozzle (1) or the posture of the electronic part (2) is changed a plurality of times by a rotary driving member (3), and a part of the electronic part (2) imaged by the recognition camera (4) every time the posture of the electronic part (2) is changed, whereby the part is recognized. Thus, the recognition of the contour of the electronic part (2) becomes possible, and the electronic part can be mounted accurately on a circuit board by making a positional correction on the basis of the amount of deviation obtained.

摘要翻译： 即使当设备被布置成使得识别照相机（4）和喷嘴（1）之间的相对位置关系不能改变时，也用于分辨识别电子部件（2）的电子部件安装设备。 电子部件（2）由喷嘴（1）进行真空夹紧，喷嘴（1）的姿势或电子部件（2）的姿势由旋转驱动部件（3）多次改变， 以及每当电子部件（2）的姿势改变时由识别照相机（4）成像的电子部件（2）的一部分，从而识别该部件。 因此，可以对电子部件（2）的轮廓的识别成为可能，并且通过基于获得的偏差量进行位置校正，可以将电子部件精确地安装在电路板上。

公开(公告)号：US06390281B1

公开(公告)日：2002-05-21

申请号：US09367577

申请日：1999-12-02

申请人： Yoshiyuki Nagai ,  Ryoji Inutsuka ,  Koichi Yabuki ,  Kunio Oe ,  Hideo Sakon

发明人： Yoshiyuki Nagai ,  Ryoji Inutsuka ,  Koichi Yabuki ,  Kunio Oe ,  Hideo Sakon

IPC分类号： H05K330

CPC分类号： H05K13/086 ,  Y10T29/53178 ,  Y10T29/53261 ,  Y10T29/53313 ,  Y10T29/53374

摘要： A method and device for feeding an electronic component are provided by which extensive shutdown of the electronic component mounting device due to lack of components is prevented, thereby enhancing the operation rate. The device has a feeder section designating unit (32) for designating a desired one of feeder sections (22), and a feeder section controller (31) for forcibly moving the feeder section which is currently feeding electronic components to a retracted position when the other feeder section has been designated by the feeder section designating unit (32) and for moving the designated feeder section which has been in a standby state to a predetermined component feeding position, by which a long-time pause of the electronic component mounting device caused by exhaustion of components is prevented and the operation rate is enhanced.

摘要翻译： 提供一种用于馈送电子部件的方法和装置，其中防止了由于缺少部件而导致的电子部件安装装置的大量关闭，从而提高了操作率。 该装置具有用于指定期望的馈送部分（22）的馈送部分指定单元（32）和用于当另一个馈电部分（31）被强制移动馈送部分时，该馈送部分控制器当前将电子部件馈送到缩回位置 馈线部分由馈线部分指定单元（32）指定，并将处于待机状态的指定馈线部分移动到预定的分量馈送位置，由此，电子部件安装装置的长时间暂停由 防止了部件的耗尽，并且提高了操作速度。

公开(公告)号：US06230398B1

公开(公告)日：2001-05-15

申请号：US08929724

申请日：1997-09-15

申请人： Kazuhiro Murata ,  Ryoji Inutsuka ,  Koichi Yabuki

发明人： Kazuhiro Murata ,  Ryoji Inutsuka ,  Koichi Yabuki

IPC分类号： H05K330

CPC分类号： H05K13/0413 ,  H05K13/0815 ,  Y10T29/4913 ,  Y10T29/53191

摘要： The invention provides an electronic parts mounting machine and an electronic parts packaging method wherein even when a system does not include driving means, such as an XY robot, for driving a mounting head, there is no possibility of causing a decrease in measurement accuracy or a need to allocate a larger space for the installation and movement of a test unit of a lead misalignment tester. When a lead misalignment test is conducted on each lead of an electronic part, a suction nozzle is rotated and, at the same time, the test unit is moved such that the test point of the test unit scans each lead of the electronic part sucked by the suction nozzle while said test point crosses said lead.

摘要翻译： 本发明提供一种电子零件安装机和电子零件包装方法，其中即使系统不包括用于驱动安装头的XY机器人等驱动装置，也不可能导致测量精度的降低或 需要为导线未对准测试仪的测试单元的安装和移动分配更大的空间。 当在电子部件的每个引线上进行引线未对准测试时，吸嘴旋转，并且同时使测试单元移动，使得测试单元的测试点扫描被吸附的电子部件的每个引线 所述吸嘴在所述测试点穿过所述引线时。

公开(公告)号：US06705004B1

公开(公告)日：2004-03-16

申请号：US09937915

申请日：2001-10-01

申请人： Koichi Yabuki ,  Yoshiyuki Nagai ,  Keiji Hanada

发明人： Koichi Yabuki ,  Yoshiyuki Nagai ,  Keiji Hanada

IPC分类号： H05K330

CPC分类号： H05K13/0452 ,  H05K13/0413 ,  H05K13/0815 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53178

摘要： During the process of transporting an electronic component (18) to a substrate (10) after a suction nozzle (7) has picked up the component (18), the component (18) being supplied from a component supply unit (1), the amount of offset of the component (18) with respect to the suction nozzle (7) is calculated. The feasibility of mounting the component (18) held by the suction nozzle (7) onto the substrate (10) without hindrance is determined from the amount of offset. If the result of the determination is positive, the component (18) is mounted onto the substrate (10).

摘要翻译： 在吸嘴（7）拾起部件（18）之后将电子部件（18）运送到基板（10）的过程中，从部件供应单元（1）提供部件（18）， 计算组件（18）相对于吸嘴（7）的偏移量。 根据偏移量确定将由吸嘴（7）保持的部件（18）无阻碍地安装到基板（10）上的可行性。 如果确定结果为正，则将组件（18）安装到基板（10）上。