摘要:
An integrated circuit (“IC”) connector includes a card detection contact terminal which is provided substantially at a central part of a housing unit and between a first grounding contact terminal and a second grounding contact terminal, and first and second contact terminals located so as to face each other along a direction of mounting and demounting of a first IC card, the first contact terminals provided adjacent to and both sides of the card detection contact terminal, the second contact terminals provided adjacent to both sides of the card detection contact terminal.
摘要:
An IC connector includes a card detection contact terminal which is provided substantially at a central part of a housing unit and between a first grounding contact terminal and a second grounding contact terminal, and first and second contact terminals located so as to face each other along a direction of mounting and demounting of a first IC card, the first contact terminals provided adjacent to and both sides of the card detection contact terminal, the second contact terminals provided adjacent to and both sides of the card detection contact terminal.
摘要:
A composite type card connector of the present invention includes a connector body, a cover member, first contact members for a small card, second contact members for a large card, and a switching operation mechanism having a movable plate and a operating plate, such that a card-mounting section in the connector body is switched to another one by the switching operation mechanism so that two kinds of cards different in thickness and/or width can be commonly inserted into the same composite type card connector.
摘要:
A card insertion slot in the card connector through which two types of cards, large and small cards, can be selectively installed in a card accommodation space include first and second guideways in corresponding to the sizes of the cards. The card connector includes first and second contacts, a lock bracket configured to detect the width of the large card, an actuator configured to be rotatable, and a partition member including a partition plate configured to be movable. When the large card is inserted into the card connector, the lock bracket is moved from the first position to the second position. When the large card is further fed into the card connector, the actuator is rotated from the first position to the second position, and the partition plate is moved from the first position to the second position.
摘要:
A card insertion slot in the card connector through which two types of cards, large and small cards, can be selectively installed in a card accommodation space include first and second guideways in corresponding to the sizes of the cards. The card connector includes first and second contacts, a lock bracket configured to detect the width of the large card, an actuator configured to be rotatable, and a partition member including a partition plate configured to be movable. When the large card is inserted into the card connector, the lock bracket is moved from the first position to the second position. When the large card is further fed into the card connector, the actuator is rotated from the first position to the second position, and the partition plate is moved from the first position to the second position.
摘要:
In an exemplary embodiment, an internal combustion engine, in which a valve is opened and closed when a piston reciprocates in a cylinder, has a configuration to perform repeatedly the following combined strokes: an intake stroke→a compression stroke→a combustion stroke→an exhaust stroke in a four-cycle internal combustion engine are combined with an intake and compression stroke→a combustion and exhaust stroke in a two-cycle internal combustion engine. The internal combustion engine can reduce pumping loss in a six-cycle internal combustion engine and increase the output.
摘要:
A counter base for checkout includes a basket placing table on one side thereof to be freely raised and lowered. A driving unit can drive to raise and lower the basket placing table. A first detecting unit detects that a shopping cart enters an access area closer to the basket placing table than a predetermined range. A second detecting unit detects presence or absence of the shopping cart stopped along one side of the counter base. A control unit controls to drive, when the first detecting unit detects entrance of the shopping cart into the access area, the driving unit to move the basket placing table to a lowered position and, thereafter, controls to drive, when the second detecting unit does not detect the shopping cart stopped along the counter base, the driving unit to return the basket placing table to a raised position.
摘要:
A counter base for checkout includes a basket placing table on one side thereof to be freely raised and lowered. A driving unit can drive to raise and lower the basket placing table. A first detecting unit detects that a shopping cart enters an access area closer to the basket placing table than a predetermined range. A second detecting unit detects presence or absence of the shopping cart stopped along one side of the counter base. A control unit controls to drive, when the first detecting unit detects entrance of the shopping cart into the access area, the driving unit to move the basket placing table to a lowered position and, thereafter, controls to drive, when the second detecting unit does not detect the shopping cart stopped along the counter base, the driving unit to return the basket placing table to a raised position.
摘要:
The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180° C. and 220° C. and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.