公开(公告)号：US20100328961A1

公开(公告)日：2010-12-30

申请号：US12703279

申请日：2010-02-10

申请人： You-Jin KWON ,  Won-Il Kim ,  Hyun-Gu Kang ,  Seung-Ryeol Ryu ,  Sang-Geun Bae ,  Seung-Sik Hong

发明人： You-Jin KWON ,  Won-Il Kim ,  Hyun-Gu Kang ,  Seung-Ryeol Ryu ,  Sang-Geun Bae ,  Seung-Sik Hong

IPC分类号： F21V17/00 ,  F21V19/00 ,  H01J9/24

CPC分类号： F21V19/001 ,  F21V19/045 ,  F21Y2115/10 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10598 ,  H01L2924/00014

摘要： A light-emitting module includes a printed circuit board (PCB), a fastening member, and a light-emitting package. The PCB has a power-supplying pad to provide electrical power. The fastening member is disposed on the PCB and has a package-receiving hole exposing the power-supplying pad. The light-emitting package is received by the package-receiving hole such that the light-emitting package is electrically connected to the power-supplying pad and detachably coupled with the fastening member. Therefore, the light-emitting package may be easily combined with the PCB, and the light-emitting package may be replaced when desired.

摘要翻译： 发光模块包括印刷电路板（PCB），紧固构件和发光封装。 PCB具有供电电源以提供电力。 紧固构件设置在PCB上并且具有暴露供电垫的封装容纳孔。 发光封装由封装容纳孔接收，使得发光封装电连接到供电焊盘并且可拆卸地与紧固构件连接。 因此，发光封装可以容易地与PCB组合，并且如果需要，可以更换发光封装。