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    LED PACKAGE
    4.
    发明申请
    LED PACKAGE 有权
    LED封装

    公开(公告)号：US20100072499A1

    公开(公告)日：2010-03-25

    申请号：US12443293

    申请日：2007-09-27

    申请人： You Jin Kwon ,  Jung Hu Seo ,  Byoung Ki Pyo ,  Kang Hyun Cho

    发明人： You Jin Kwon ,  Jung Hu Seo ,  Byoung Ki Pyo ,  Kang Hyun Cho

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

    摘要： The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.

    摘要翻译： 本发明的目的是提供一种LED封装，其具有能够精确地限制含有荧光体的树脂在其上支撑LED芯片的部件上被点缀的区域的装置。 为此，根据本发明的LED封装包括具有安装在其中的LED芯片的内部空间的封装体，所述内部空间朝向发光方向开放; 安装到所述封装主体的内部空间以支撑所述LED芯片的芯片支撑构件; 通过将含有荧光体的树脂点到LED芯片上形成的荧光体树脂构件; 以及区域限制装置，其设置在所述芯片支撑构件上并且限定形成有所述荧光体树脂构件的区域。

    Light emitting device and driving circuit thereof
    5.
    发明授权
    Light emitting device and driving circuit thereof 有权
    发光装置及其驱动电路

    公开(公告)号：US08513899B2

    公开(公告)日：2013-08-20

    申请号：US12550912

    申请日：2009-08-31

    申请人： Hyun Gu Kang ,  Sang Min Lee ,  Yoon Seok Lee ,  Won Il Kim ,  You Jin Kwon

    发明人： Hyun Gu Kang ,  Sang Min Lee ,  Yoon Seok Lee ,  Won Il Kim ,  You Jin Kwon

    IPC分类号： H05B37/02

    CPC分类号： H05B33/0809

    摘要： A light emitting device comprises a first light emitting unit and a second light emitting unit connected in series with each other, and a PTF unit connected in parallel with the first light emitting unit and in series with the second light emitting unit. Each of the first light emitting unit and second light emitting unit comprises at least one LED. The PTF unit allows the second light emitting unit to be operated before operation of the first light emitting unit upon application of an AC voltage source. The light emitting device reduces total harmonic distortion and flickering, and improves power factor and optical efficiency. A driving circuit of the light emitting device is also disclosed.

    摘要翻译： 发光装置包括彼此串联连接的第一发光单元和第二发光单元，以及与第一发光单元并联并与第二发光单元串联的PTF单元。 第一发光单元和第二发光单元中的每一个包括至少一个LED。 在施加AC电压源时，PTF单元允许第二发光单元在第一发光单元的操作之前被操作。 发光装置降低总谐波失真和闪烁，提高功率因数和光效。 还公开了发光器件的驱动电路。

    Multi-light emitting diode package
    6.
    发明授权
    Multi-light emitting diode package 有权
    多发光二极管封装

    公开(公告)号：US07960744B2

    公开(公告)日：2011-06-14

    申请号：US12164456

    申请日：2008-06-30

    申请人： Jung Hoo Seo ,  Do Hyung Kim ,  Byoung Ki Pyo ,  You Jin Kwon ,  Ju Yong Shim

    发明人： Jung Hoo Seo ,  Do Hyung Kim ,  Byoung Ki Pyo ,  You Jin Kwon ,  Ju Yong Shim

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/504 ,  H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

    摘要翻译： 多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构 到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。 另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构 芯片和覆盖主LED芯片的至少一部分的荧光体。

    Multi-light emitting diode package
    7.
    发明授权
    Multi-light emitting diode package 有权
    多发光二极管封装

    公开(公告)号：US08860049B2

    公开(公告)日：2014-10-14

    申请号：US13090862

    申请日：2011-04-20

    申请人： Jung Hoo Seo ,  Do Hyung Kim ,  Byoung Ki Pyo ,  You Jin Kwon ,  Ju Yong Shim

    发明人： Jung Hoo Seo ,  Do Hyung Kim ,  Byoung Ki Pyo ,  You Jin Kwon ,  Ju Yong Shim

    IPC分类号： H01L33/62 ,  H01L33/58 ,  H01L25/075 ,  H01L33/50 ,  H01L33/64

    CPC分类号： H01L25/0753 ,  H01L33/504 ,  H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

    摘要翻译： 多LED封装包括散热器，其包括彼此分离的初级芯片和次级芯片，安装在初级芯片上的主要LED芯片，安装在次级芯片上的一个或多个次级LED芯片，电连接的引线框架结构 到主要和次要LED芯片以及覆盖主要LED芯片的至少一部分的荧光体。 另一个多LED封装包括具有上表面和从其突出的隔板的散热器，安装在隔板内的主LED芯片，安装在隔板外部的一个或多个次级LED芯片，电连接到主和次级LED的引线框架结构 芯片和覆盖主LED芯片的至少一部分的荧光体。

    LED package
    9.
    发明授权
    LED package 有权
    LED封装

    公开(公告)号：US08053799B2

    公开(公告)日：2011-11-08

    申请号：US12443293

    申请日：2007-09-27

    申请人： You Jin Kwon ,  Jung Hu Seo ,  Byoung Ki Pyo ,  Kang Hyun Cho

    发明人： You Jin Kwon ,  Jung Hu Seo ,  Byoung Ki Pyo ,  Kang Hyun Cho

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

    摘要： The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.

    摘要翻译： 本发明的目的是提供一种LED封装，其具有能够精确地限制含有荧光体的树脂在其上支撑LED芯片的部件上被点缀的区域的装置。 为此，根据本发明的LED封装包括具有安装在其中的LED芯片的内部空间的封装体，所述内部空间朝向发光方向开放; 安装到所述封装主体的内部空间以支撑所述LED芯片的芯片支撑构件; 通过将含有荧光体的树脂点到LED芯片上形成的荧光体树脂构件; 以及区域限制装置，其设置在所述芯片支撑构件上并且限定形成有所述荧光体树脂构件的区域。

    LIGHT EMITTING DEVICE AND DRIVING CIRCUIT THEREOF
    10.
    发明申请
    LIGHT EMITTING DEVICE AND DRIVING CIRCUIT THEREOF 有权
    发光装置及其驱动电路

    公开(公告)号：US20100237800A1

    公开(公告)日：2010-09-23

    申请号：US12550912

    申请日：2009-08-31

    申请人： Hyun Gu KANG ,  Sang Min Lee ,  Yoon Seok Lee ,  Won Il Kim ,  You Jin Kwon

    发明人： Hyun Gu KANG ,  Sang Min Lee ,  Yoon Seok Lee ,  Won Il Kim ,  You Jin Kwon

    IPC分类号： H05B37/02 ,  F21V21/00

    CPC分类号： H05B33/0809

    摘要： A light emitting device comprises a first light emitting unit and a second light emitting unit connected in series with each other, and a PTF unit connected in parallel with the first light emitting unit and in series with the second light emitting unit. Each of the first light emitting unit and second light emitting unit comprises at least one LED. The PTF unit allows the second light emitting unit to be operated before operation of the first light emitting unit upon application of an AC voltage source. The light emitting device reduces total harmonic distortion and flickering, and improves power factor and optical efficiency. A driving circuit of the light emitting device is also disclosed.

    摘要翻译： 发光装置包括彼此串联连接的第一发光单元和第二发光单元，以及与第一发光单元并联并与第二发光单元串联的PTF单元。 第一发光单元和第二发光单元中的每一个包括至少一个LED。 在施加AC电压源时，PTF单元允许第二发光单元在第一发光单元的操作之前被操作。 发光装置降低总谐波失真和闪烁，提高功率因数和光效。 还公开了发光器件的驱动电路。