公开(公告)号：US08024857B2

公开(公告)日：2011-09-27

申请号：US12347161

申请日：2008-12-31

申请人： Young Hy Jung ,  Jae Sung Oh ,  Ki Il Moon ,  Ki Chae Kim ,  Chan Sun Lee ,  Jin Ho Gwon ,  Jae Youn Choi

发明人： Young Hy Jung ,  Jae Sung Oh ,  Ki Il Moon ,  Ki Chae Kim ,  Chan Sun Lee ,  Jin Ho Gwon ,  Jae Youn Choi

IPC分类号： H05K3/02 ,  H05K1/02 ,  H05K1/03 ,  H01L21/00 ,  H01L23/13

CPC分类号： H01L23/13 ,  H01L23/538 ,  H01L23/562 ,  H01L2924/0002 ,  Y10T29/49155 ,  H01L2924/00

摘要： A substrate for a semiconductor package having a reinforcing member that prevents or minimizes distortions is presented. The substrate for the semiconductor package includes a substrate body, an insulation layer, and a reinforcing member. The substrate body has a first region having a plurality of chip mount regions, a second region disposed along a periphery of the first region, a circuit pattern disposed in each chip mount region and a dummy pattern disposed along the second region. The insulation layer covers the first and second regions and has an opening exposing some portion of each circuit pattern. The reinforcing member is disposed in the second region and prevents deflection of the substrate body.

摘要翻译： 提出了一种具有防止或最小化失真的加强构件的半导体封装的衬底。 用于半导体封装的衬底包括衬底主体，绝缘层和加强构件。 基板主体具有第一区域，具有多个芯片安装区域，沿着第一区域的周边设置的第二区域，设置在每个芯片安装区域中的电路图案和沿着第二区域布置的虚设图案。 绝缘层覆盖第一和第二区域，并且具有暴露每个电路图案的一部分的开口。 加强构件设置在第二区域中并防止基板主体的偏转。