Method of manufacturing TFT and array TFT
    2.
    发明申请
    Method of manufacturing TFT and array TFT 有权
    制造TFT和阵列TFT的方法

    公开(公告)号:US20110183478A1

    公开(公告)日:2011-07-28

    申请号:US12923051

    申请日:2010-08-31

    IPC分类号: H01L21/336

    摘要: A method of manufacturing a thin film transistor includes sequentially forming a gate and at least one insulation layer on a substrate, forming a source electrode and a drain electrode on the at least one insulation layer, and forming a channel layer formed of a semiconductor on a part of the source electrode and the drain electrode, wherein the gate, the source electrode, and the drain electrode are formed by using a hybrid inkjet printing apparatus.

    摘要翻译: 制造薄膜晶体管的方法包括在基板上依次形成栅极和至少一个绝缘层,在至少一个绝缘层上形成源电极和漏电极,以及在半导体层上形成沟道层 源电极和漏电极的一部分,其中栅极,源电极和漏电极通过使用混合喷墨打印装置形成。

    METHODS OF FORMING WIRINGS IN ELECTRONIC DEVICES
    3.
    发明申请
    METHODS OF FORMING WIRINGS IN ELECTRONIC DEVICES 有权
    电子设备中形成线的方法

    公开(公告)号:US20130164932A1

    公开(公告)日:2013-06-27

    申请号:US13601658

    申请日:2012-08-31

    IPC分类号: H01L21/768

    摘要: A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.

    摘要翻译: 形成布线的方法可以包括在基板上形成第一布线; 在所述基板上形成除了所述第一线之外的材料层; 在所述材料层上形成表面处理膜; 以及在所述第一线上形成第二线。 表面处理膜具有与第一丝相反的物理性质。 形成布线的方法可以包括在基板上形成第一布线; 在所述基板和所述第一线上形成材料层; 从所述第一丝线去除所述材料层的一部分; 在所述材料层和所述第一线上形成表面处理膜; 从所述第一丝线去除所述表面处理膜的一部分; 以及在所述第一线上形成第二线。 基板上的材料层的厚度大于基板上的第一布线的厚度。

    METHODS OF DRIVING HYBRID INKJET PRINTING APPARATUS
    4.
    发明申请
    METHODS OF DRIVING HYBRID INKJET PRINTING APPARATUS 有权
    混合喷墨印刷装置的驱动方法

    公开(公告)号:US20130176354A1

    公开(公告)日:2013-07-11

    申请号:US13568604

    申请日:2012-08-07

    IPC分类号: B41J29/38

    摘要: A method of driving a hybrid inkjet printing apparatus includes applying an electrostatic voltage to ink contained in a nozzle, applying a waveform voltage to ink contained in the nozzle, the waveform voltage being applied by a piezoelectric driving device, and applying an ejection voltage so as to eject the ink.

    摘要翻译: 驱动混合型喷墨打印装置的方法包括:将静电电压施加到喷嘴中所含的墨水中,对包含在喷嘴中的墨施加波形电压,通过压电驱动装置施加波形电压,并施加喷射电压,以便 喷出墨水。