Method of manufacturing TFT and array TFT
    2.
    发明申请
    Method of manufacturing TFT and array TFT 有权
    制造TFT和阵列TFT的方法

    公开(公告)号:US20110183478A1

    公开(公告)日:2011-07-28

    申请号:US12923051

    申请日:2010-08-31

    IPC分类号: H01L21/336

    摘要: A method of manufacturing a thin film transistor includes sequentially forming a gate and at least one insulation layer on a substrate, forming a source electrode and a drain electrode on the at least one insulation layer, and forming a channel layer formed of a semiconductor on a part of the source electrode and the drain electrode, wherein the gate, the source electrode, and the drain electrode are formed by using a hybrid inkjet printing apparatus.

    摘要翻译: 制造薄膜晶体管的方法包括在基板上依次形成栅极和至少一个绝缘层,在至少一个绝缘层上形成源电极和漏电极,以及在半导体层上形成沟道层 源电极和漏电极的一部分,其中栅极,源电极和漏电极通过使用混合喷墨打印装置形成。

    METHODS OF FORMING WIRINGS IN ELECTRONIC DEVICES
    3.
    发明申请
    METHODS OF FORMING WIRINGS IN ELECTRONIC DEVICES 有权
    电子设备中形成线的方法

    公开(公告)号:US20130164932A1

    公开(公告)日:2013-06-27

    申请号:US13601658

    申请日:2012-08-31

    IPC分类号: H01L21/768

    摘要: A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.

    摘要翻译: 形成布线的方法可以包括在基板上形成第一布线; 在所述基板上形成除了所述第一线之外的材料层; 在所述材料层上形成表面处理膜; 以及在所述第一线上形成第二线。 表面处理膜具有与第一丝相反的物理性质。 形成布线的方法可以包括在基板上形成第一布线; 在所述基板和所述第一线上形成材料层; 从所述第一丝线去除所述材料层的一部分; 在所述材料层和所述第一线上形成表面处理膜; 从所述第一丝线去除所述表面处理膜的一部分; 以及在所述第一线上形成第二线。 基板上的材料层的厚度大于基板上的第一布线的厚度。

    PIEZOELECTRIC INKJET HEAD AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    PIEZOELECTRIC INKJET HEAD AND METHOD OF MANUFACTURING THE SAME 有权
    压电喷嘴头及其制造方法

    公开(公告)号:US20080165228A1

    公开(公告)日:2008-07-10

    申请号:US11768293

    申请日:2007-06-26

    IPC分类号: B41J2/045 H01L41/22

    摘要: A piezoelectric inkjet head and a method of manufacturing the piezoelectric inkjet head. The piezoelectric inkjet head includes three single crystal silicon substrates bonded to each other. An upper substrate includes an ink inlet, a plurality of pressure chambers, and a plurality of piezoelectric actuators, a middle substrate includes a manifold, a plurality of restrictors, and a plurality of first dampers, and a lower substrate includes a plurality of nozzles. The middle substrate also includes a membrane that is formed under the manifold to mitigate a rapid pressure change in the manifold and if formed of a material different from the material used for forming the middle substrate. A cavity located under the membrane and at least one venting channel that connects the cavity to the outside are formed in the middle substrate or the lower substrate. Due to the above configuration, the membrane having flexibility mitigates a rapid pressure change in the manifold caused by backflow of ink, and thus, cross-talk between adjacent pressure chambers during ink ejection can be effectively prevented.

    摘要翻译: 压电喷墨头和压电喷墨头的制造方法。 压电喷墨头包括彼此结合的三个单晶硅衬底。 上基板包括墨入口,多个压力室和多个压电致动器,中间基板包括歧管,多个限流器和多个第一阻尼器,下基板包括多个喷嘴。 中间基板还包括形成在歧管下方的膜,以减轻歧管中的快速压力变化,并且如果由不同于用于形成中间基板的材料形成的材料形成。 在中间基板或下基板中形成位于膜下方的空腔和将空腔连接到外部的至少一个通气通道。 由于上述结构,具有柔性的膜减轻了由于油墨的回流引起的歧管中的快速压力变化,因此可以有效地防止在喷墨期间相邻压力室之间的串扰。

    METHOD OF FORMING HYDROPHOBIC COATING LAYER ON SURFACE OF NOZZLE PLATE OF INKJET PRINTHEAD
    5.
    发明申请
    METHOD OF FORMING HYDROPHOBIC COATING LAYER ON SURFACE OF NOZZLE PLATE OF INKJET PRINTHEAD 失效
    在喷嘴喷嘴板表面形成疏水涂层的方法

    公开(公告)号:US20070120889A1

    公开(公告)日:2007-05-31

    申请号:US11425204

    申请日:2006-06-20

    IPC分类号: B41J2/135

    摘要: A method of forming a hydrophobic coating layer on a surface of a nozzle plate of an inkjet printhead includes forming a plurality of nozzles in the nozzle plate, each of the nozzles having an exit, stacking a film on the surface of the nozzle plate to cover the exit of each of the nozzles, forming a predetermined metal layer on an inner wall of each of the nozzles and an inner surface of the film covering the exit of each of the nozzles using a plating method, removing the film from the surface of the nozzle plate, forming a hydrophobic coating layer on the surface of the nozzle plate to cover the metal layer exposed through the exit of each of the nozzles, and removing the metal layer formed on the inner wall of each of the nozzles and the hydrophobic coating layer formed on the surface of the metal layer.

    摘要翻译: 在喷墨打印头的喷嘴板的表面上形成疏水涂层的方法包括在喷嘴板中形成多个喷嘴,每个喷嘴具有出口,在喷嘴板的表面上堆叠膜以覆盖 每个喷嘴的出口,在每个喷嘴的内壁上形成预定的金属层,并且使用电镀方法将膜的内表面覆盖每个喷嘴的出口,从该表面移除该膜 喷嘴板,在喷嘴板的表面上形成疏水涂层,以覆盖通过每个喷嘴的出口暴露的金属层,并且去除形成在每个喷嘴的内壁上的金属层和疏水涂层 形成在金属层的表面上。