公开(公告)号：US20070195853A1

公开(公告)日：2007-08-23

申请号：US10561976

申请日：2004-07-01

申请人： Youngchul Park ,  Kazuhiro Kawamura ,  Yuichi Takenaga

发明人： Youngchul Park ,  Kazuhiro Kawamura ,  Yuichi Takenaga

IPC分类号： G01K15/00

CPC分类号： C23C16/52 ,  C23C16/46 ,  H01L21/67103 ,  H01L21/67248

摘要： The present invention provides precise temperature estimation in a heat treatment apparatus that estimates temperatures of process objects by using a thermal model and performs a heat treatment while performing a temperature control based on the estimated temperatures. The heat treatment apparatus 1 includes a processing vessel 11 accommodating plural wafers W, plural heaters 31 to 33 and plural temperature sensors S1 to S5, and stores the thermal model. The heat treatment apparatus 1 estimates temperatures of the wafers W based on outputs of the temperature sensors S1 to S5 by using the thermal model and controls the heaters 31 to 33 based on the estimated temperatures, applying a heat treatment to the wafers W. The thermal model for an individual apparatus is made by calibrating a standard thermal model designed for a standard apparatus. The standard model calibration is performed by heating an interior of the processing vessel 11, measuring the temperatures of the wafers W in the processing vessel 11, estimating the temperatures of the wafers W by using the thermal model, comparing the measured temperature and the estimated temperature, and calibrating the standard thermal model so that the measured temperature substantially coincide with the estimated temperature.

摘要翻译： 本发明在通过使用热模型估计过程物体的温度并在基于估计的温度执行温度控制的同时进行热处理的热处理设备中提供精确的温度估计。 热处理装置1包括容纳多个晶片W的处理容器11，多个加热器31〜33以及多个温度传感器S1〜S5，并存储热模型。 热处理装置1通过使用热模型，基于温度传感器S 1〜S 5的输出来估计晶片W的温度，并基于估计的温度控制加热器31〜33，对晶片W进行热处理。 单个设备的热模型通过校准为标准设备设计的标准热模型来进行。 通过加热处理容器11的内部，测量处理容器11中的晶片W的温度，通过使用热模型估计晶片W的温度，比较测量的温度和估计的温度来执行标准模型校准 ，并校准标准热模型，使得测量的温度基本上与估计的温度一致。

公开(公告)号：US07575370B2

公开(公告)日：2009-08-18

申请号：US10561976

申请日：2004-07-01

申请人： Youngchul Park ,  Kazuhiro Kawamura ,  Yuichi Takenaga

发明人： Youngchul Park ,  Kazuhiro Kawamura ,  Yuichi Takenaga

IPC分类号： G01K15/00 ,  G01K19/00 ,  G01K3/00

CPC分类号： C23C16/52 ,  C23C16/46 ,  H01L21/67103 ,  H01L21/67248

摘要： The present invention provides precise temperature estimation in a heat treatment apparatus that estimates temperatures of process objects by using a thermal model and performs a heat treatment while performing a temperature control based on the estimated temperatures. The heat treatment apparatus (1) includes a processing vessel (11) accommodating plural wafers W, plural heaters (31 to 33) and plural temperature sensors (S1 to S5), and stores the thermal model. The heat treatment apparatus 1 estimates temperatures of the wafers W based on outputs of the temperature sensors (S1 to S5) by using the thermal model and controls the heaters (31 to 33) based on the estimated temperatures, applying a heat treatment to the wafers W. The thermal model for an individual apparatus is made by calibrating a standard thermal model designed for a standard apparatus. The standard model calibration is performed by heating an interior of the processing vessel (11), measuring the temperatures of the wafers W in the processing vessel (11), estimating the temperatures of the wafers W by using the thermal model, comparing the measured temperature and the estimated temperature, and calibrating the standard thermal model so that the measured temperature substantially coincides with the estimated temperature.

摘要翻译： 本发明在通过使用热模型估计过程物体的温度并在基于估计的温度执行温度控制的同时进行热处理的热处理设备中提供精确的温度估计。 热处理装置（1）包括容纳多个晶片W的处理容器（11），多个加热器（31〜33）和多个温度传感器（S1〜S5），并存储热模型。 热处理装置1通过使用热模型，基于温度传感器（S1〜S5）的输出来估计晶片W的温度，并基于估计的温度控制加热器（31〜33），对晶片进行热处理 W.通过校准为标准设备设计的标准热模型来制作单个设备的热模型。 通过加热处理容器（11）的内部，测量处理容器（11）中的晶片W的温度，通过使用热模型估计晶片W的温度来进行标准模型校准，将测量的温度 和估计温度，并校准标准热模型，使得测量的温度基本上与估计的温度一致。

公开(公告)号：US20070074660A1

公开(公告)日：2007-04-05

申请号：US10577145

申请日：2004-11-01

申请人： Youngchul Park ,  Kazuhiro Kawamura ,  Wenling Wang

发明人： Youngchul Park ,  Kazuhiro Kawamura ,  Wenling Wang

IPC分类号： C23C16/00

CPC分类号： H01L21/67248 ,  H01L21/324

摘要： The thermal processing apparatus of the present invention includes: a processing container for containing an object to be processed; a plurality of heaters for heating the object to be processed; a plurality of temperature sensors for respectively detecting temperatures at a plurality of predetermined positions in the processing container; a storing part that stores: a thermal model for forecasting a temperature of the object to be processed contained in the processing container from outputs of the plurality of temperature sensors, and a recipe in which a desired temperature of the object to be processed is defined; and a controlling part that forecasts a temperature of the object to be processed by using the outputs of the plurality of temperature sensors and the thermal model, and that controls the plurality of heaters so as to cause the forecasted temperature of the object to be processed to coincide with the desired temperature of the object to be processed defined in the recipe. The thermal model is configured to forecast, from the outputs of the plurality of temperature sensors, not only a temperature of the object to be processed contained in the processing container but also a temperature of at least one other predetermined portion in the processing container. A desired temperature of the predetermined portion is also defined in the recipe. The controlling part is adapted to forecast a temperature of the object to be processed and a temperature of the predetermined portion by using the outputs of the plurality of temperature sensors and the thermal model, and to control the plurality of heaters so as to cause the forecasted temperature of the object to be processed and the forecasted temperature of the predetermined portion to respectively coincide with the desired temperature of the object to be processed and the desired temperature of the predetermined portion defined in the recipe.

摘要翻译： 本发明的热处理装置包括：处理容器，用于容纳被加工物; 多个用于加热待处理物体的加热器; 多个温度传感器，分别检测处理容器内的多个预定位置的温度; 存储部，其存储：用于从所述多个温度传感器的输出预测所述处理容器中包含的待处理对象的温度的热模型，以及定义所述待处理对象的期望温度的配方; 以及控制部件，其通过使用多个温度传感器和热模型的输出来预测待处理对象的温度，并且控制多个加热器以使得要处理对象的预测温度 与食谱中定义的待处理对象的期望温度一致。 热模型被配置为从多个温度传感器的输出预测不仅包含在处理容器中的待处理物体的温度，而且还预测处理容器中至少一个其它预定部分的温度。 预定部分的期望温度也在配方中定义。 控制部适于通过使用多个温度传感器和热模型的输出来预测待处理对象的温度和预定部分的温度，并且控制多个加热器以使预测的 要处理的物体的温度和预定部分的预测温度分别与待处理物体的期望温度和配方中限定的预定部分的期望温度一致。

公开(公告)号：US06847015B2

公开(公告)日：2005-01-25

申请号：US09963381

申请日：2001-09-27

申请人： Wenling Wang ,  Koichi Sakamoto ,  Youngchul Park ,  Fujio Suzuki

发明人： Wenling Wang ,  Koichi Sakamoto ,  Youngchul Park ,  Fujio Suzuki

IPC分类号： C23C16/46 ,  C23C16/52 ,  C30B25/16 ,  C30B31/18 ,  F27B5/18 ,  F27D19/00 ,  G05D23/19 ,  H01L21/205 ,  H01L21/22 ,  H01L21/66 ,  H05B1/02 ,  H05B3/02

CPC分类号： H05B1/0233 ,  C30B25/16 ,  C30B31/18 ,  F27D19/00 ,  G05D23/1917 ,  G05D23/1931 ,  H01L22/12

摘要： Temperature control is made without the risk of contaminating object-to-be-processed and with high accuracy. Temperatures are metered out of contact with the objects-to-be-processed, and based on a metered result, estimated temperatures of the objects-to-be-processed are computed. Furthermore, estimation errors of the estimated temperatures are computed to correct the estimated temperatures. Based on a temperature recipe stating relationships between set temperatures and times and the corrected estimated temperatures, a heater is controlled.

摘要翻译： 进行温度控制，没有污染被处理物体和高精度的风险。 温度与被处理物体不接触地计量，并且基于计量结果，计算待处理对象的估计温度。 此外，计算估计温度的估计误差以校正估计的温度。 根据描述设定温度和时间之间的关系的温度配方以及校正的估计温度，控制加热器。