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6 条记录 (耗时 0.019 秒)

    Engine mount
    1.
    发明申请
    Engine mount 有权
    发动机支架

    公开(公告)号：US20060108725A1

    公开(公告)日：2006-05-25

    申请号：US11270744

    申请日：2005-11-10

    申请人： Yuichi Ogawa ,  Akio Saiki ,  Yoshihiro Kawabata

    发明人： Yuichi Ogawa ,  Akio Saiki ,  Yoshihiro Kawabata

    IPC分类号： F16F13/00

    CPC分类号： F16F1/54 ,  F16F2230/0047

    摘要： An engine mount has: a mount body including an upper and lower fitting of plate shape, and a pair of rubber mount elements of block shape; and an inner tube fitting situated within a through-hole in the upper fitting, formed at a location between the pair of rubber mount elements, and a vibration damping bushing integrally vulcanization bonded with the inner tube fitting and the upper fitting, and connecting the inner and upper fittings in the diametrical direction. The pair of rubber mount elements and the bushing rubber are integrally vulcanization molded. A stopper fitting is affixed within the inner tube fitting, with a vehicle front-back direction fitting stopper portion and/or a left-right direction fitting stopper portion being disposed on the stopper fitting, and a corresponding rubber stopper portion is disposed on the upper fitting side, with the fitting stopper portion and the rubber stopper portion being placed abutting one another.

    摘要翻译： 发动机支架具有：具有板状的上下配件的安装体和块状的一对橡胶安装元件; 以及内管配件，其位于所述上配件的通孔内，形成在所述一对橡胶安装元件之间的位置处，以及与所述内管接头和所述上配件一体硫化的减振衬套， 和上部配件在直径方向。 一对橡胶安装元件和衬套橡胶是一体硫化成型的。 止动配件固定在内管配件内，车辆前后方向配合止动部分和/或左右方向配合止动部分设置在止动器配件上，相应的橡胶止动部分设置在上部 配合止动部和橡胶止动部被配置为彼此抵接。

    Engine mount
    2.
    发明授权
    Engine mount 有权
    发动机支架

    公开(公告)号：US07350777B2

    公开(公告)日：2008-04-01

    申请号：US11270744

    申请日：2005-11-10

    申请人： Yuichi Ogawa ,  Akio Saiki ,  Yoshihiro Kawabata

    发明人： Yuichi Ogawa ,  Akio Saiki ,  Yoshihiro Kawabata

    IPC分类号： F16F7/00

    CPC分类号： F16F1/54 ,  F16F2230/0047

    摘要： An engine mount has: a mount body including an upper and lower fitting of plate shape, and a pair of rubber mount elements of block shape; and an inner tube fitting situated within a through-hole in the upper fitting, formed at a location between the pair of rubber mount elements, and a vibration damping bushing integrally vulcanization bonded with the inner tube fitting and the upper fitting, and connecting the inner and upper fittings in the diametrical direction. The pair of rubber mount elements and the bushing rubber are integrally vulcanization molded. A stopper fitting is affixed within the inner tube fitting, with a vehicle front-back direction fitting stopper portion and/or a left-right direction fitting stopper portion being disposed on the stopper fitting, and a corresponding rubber stopper portion is disposed on the upper fitting side, with the fitting stopper portion and the rubber stopper portion being placed abutting one another.

    摘要翻译： 发动机支架具有：具有板状的上下配件的安装体和块状的一对橡胶安装元件; 以及内管配件，其位于所述上配件的通孔内，形成在所述一对橡胶安装元件之间的位置处，以及与所述内管接头和所述上配件一体硫化的减振衬套， 和上部配件在直径方向。 一对橡胶安装元件和衬套橡胶是一体硫化成型的。 止动配件固定在内管配件内，车辆前后方向配合止动部分和/或左右方向配合止动部分设置在止动器配件上，相应的橡胶止动部分设置在上部 配合止动部和橡胶止动部被配置为彼此抵接。

    Method for analyzing impurities
    5.
    发明申请
    Method for analyzing impurities 审中-公开
    杂质分析方法

    公开(公告)号：US20050208674A1

    公开(公告)日：2005-09-22

    申请号：US11080469

    申请日：2005-03-16

    申请人： Kaori Tokushima ,  Yoshihiro Kawabata

    发明人： Kaori Tokushima ,  Yoshihiro Kawabata

    IPC分类号： G01N1/28 ,  B08B3/12 ,  H01L21/00

    CPC分类号： H01L21/67253 ,  Y10T436/255

    摘要： The impurity analyzing method is for analyzing impurities that exist on a surface of a semiconductor wafer, which includes a step of bubbling a mixed solution including hydrofluoric acid and aqueous hydrogen peroxide or a mixed solution including hydrofluoric acid and aqueous ozone to generate a vapor including hydrofluoric acid and aqueous hydrogen peroxide or a vapor including hydrofluoric acid and aqueous ozone, a step of dissolving a film formed on the surface of the semiconductor wafer by means of the vapor including hydrofluoric acid and aqueous hydrogen peroxide or the vapor including hydrofluoric acid and aqueous ozone, a step of supplying liquid drops onto the surface of the semiconductor wafer and collecting the impurities along with the liquid drops, and a step of analyzing the collected impurities.

    摘要翻译： 杂质分析方法是用于分析存在于半导体晶片表面的杂质，该杂质包括使包含氢氟酸和过氧化氢水的混合溶液或包含氢氟酸和臭氧水溶液的混合溶液鼓泡的步骤，以产生包含氢氟酸的蒸汽 酸和水性过氧化氢或包含氢氟酸和臭氧水溶液的蒸气，通过包含氢氟酸和过氧化氢水溶液或包含氢氟酸和臭氧水溶液的蒸气溶解形成在半导体晶片的表面上的膜的步骤 向半导体晶片的表面供给液滴并与液滴一起收集杂质的步骤，以及分析所收集的杂质的步骤。