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公开(公告)号：US09073154B2
公开(公告)日：2015-07-07
申请号：US12311976
申请日：2007-12-12
IPC分类号： B23K35/362 , B23K35/26 , B23K35/36 , B23K35/38 , H05K3/34
CPC分类号： B23K35/362 , B23K35/262 , B23K35/3613 , B23K35/3618 , B23K35/383 , B23K2103/12 , H05K3/3489
摘要： A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.
摘要翻译： 适合作为流动焊接中的无清洁后焊剂的焊剂，其可以防止在使用无铅焊料（例如Sn-3.0Ag）将电子部件焊接到印刷电路板时容易发生的晶须的形成 -0.5Cu），除了松香作为基础树脂和活化剂之外，还含有0.2-4质量％的选自酸性磷酸酯和衍生物的至少一种化合物 其中。 通过在氮气气氛中进行焊接可以更有效地防止形成晶须。
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公开(公告)号：US20090308496A1
公开(公告)日：2009-12-17
申请号：US12311976
申请日：2007-12-12
CPC分类号： B23K35/362 , B23K35/262 , B23K35/3613 , B23K35/3618 , B23K35/383 , B23K2103/12 , H05K3/3489
摘要： A soldering flux which is suitable as a no-clean post flux in flow soldering and which can prevent the formation of whiskers which tends to occur when soldering electronic parts to a printed circuit board using a lead-free solder (such as Sn-3.0Ag-0.5Cu) having a higher Sn content and a higher melting point than the eutectic solder contains, in addition to a rosin as a base resin and an activator, 0.2-4 mass % of at least one compound selected from acid phosphate esters and derivatives thereof. The formation of whiskers can be more effectively prevented by carrying out soldering in a nitrogen atmosphere.
摘要翻译： 适合作为流动焊接中的无清洁后焊剂的焊剂，其可以防止在使用无铅焊料（例如Sn-3.0Ag）将电子部件焊接到印刷电路板时容易发生的晶须的形成 -0.5Cu），除了松香作为基础树脂和活化剂之外，还含有0.2-4质量％的选自酸性磷酸酯和衍生物的至少一种化合物 其中。 通过在氮气气氛中进行焊接可以更有效地防止形成晶须。
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