公开(公告)号：US5465598A

公开(公告)日：1995-11-14

申请号：US329783

申请日：1994-10-27

申请人： Yukio Hirai ,  Kouzou Kanayama ,  Kenji Yoshii ,  Kiyotoshi Iwasaki ,  Isao Kanai ,  Shin Suzuki

发明人： Yukio Hirai ,  Kouzou Kanayama ,  Kenji Yoshii ,  Kiyotoshi Iwasaki ,  Isao Kanai ,  Shin Suzuki

IPC分类号： B21D53/18 ,  B21D53/26 ,  B21H1/06

CPC分类号： B21D53/265 ,  B21D53/18

摘要： An annular member is placed on a forming profile of a convex die without fixing the annular member to the convex die. Then, the convex die is moved toward a concave die which has an axis inclining with respect to an axis of the convex die. When the convex die is moved toward the concave die, the concave die is revolved around the axis of the convex die. The concave die does not revolve about its own axis. Revolving the concave die around the axis of the convex die may be replaced by forcibly rotating the convex die about its own axis. When a compression load is imposed on the annular member, opposed ends of the annular member are formed simultaneously.

摘要翻译： 将环形构件放置在凸模的成形轮廓上，而不将环形构件固定到凸模上。 然后，将凸模移动到具有相对于凸模的轴线倾斜的轴的凹模。 当凸模移动到凹模时，凹模围绕凸模的轴线旋转。 凹模不围绕其自身的轴线旋转。 围绕凸模的轴线旋转凹模可以通过围绕其自身轴线强制旋转凸模来代替。 当对环形构件施加压缩载荷时，环形构件的相对端同时形成。

公开(公告)号：US4503452A

公开(公告)日：1985-03-05

申请号：US378435

申请日：1982-05-14

申请人： Masami Yokozawa ,  Isao Kanai

发明人： Masami Yokozawa ,  Isao Kanai

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L21/58 ,  H01L23/00 ,  H01L23/34

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49562 ,  H01L24/97 ,  H01L2924/12033 ,  H01L2924/181 ,  H01L2924/1815

摘要： A plastic encapsulated semiconductor device and a method for manufacturing the same are provided. A substrate support supports a semiconductor substrate and serves as a heat sink. Strips are connected to one side of the substrate support and an external lead is connected to the opposite side of the substrate support. Parts of the strips extend from one side surface of a plastic encapsulating housing. At least one notch or recess is formed in one side surface of the plastic encapsulating housing. The strips are then cut within at least one notch or recess so as not to extend the cut surfaces of the strips from the outermost side surface portion of the encapsulating housing.

摘要翻译： 提供了一种塑料封装的半导体器件及其制造方法。 衬底支撑件支撑半导体衬底并用作散热器。 条带连接到基板支撑件的一侧，并且外部引线连接到基板支撑件的相对侧。 条的一部分从塑料封装壳体的一个侧表面延伸。 在塑料封装壳体的一个侧表面中形成至少一个凹口或凹槽。 然后在至少一个切口或凹槽内切割条，以便不将条带的切割表面从封装壳体的最外侧表面部分延伸。