INPUT UNIT AND CONTROL METHOD THEREOF
    3.
    发明申请
    INPUT UNIT AND CONTROL METHOD THEREOF 审中-公开
    输入单元及其控制方法

    公开(公告)号:US20090217191A1

    公开(公告)日:2009-08-27

    申请号:US12364186

    申请日:2009-02-02

    IPC分类号: G06F3/048

    摘要: Provided are an input unit and a control method thereof. According to an embodiment of the input unit and the control method thereof, relationship information between the end of an input member and the end of the shadow of the input member, generated by a light source, are recognized through image processing, and is used to detect if an input is made by the input member.

    摘要翻译: 提供输入单元及其控制方法。 根据输入单元的实施例及其控制方法,通过图像处理识别由光源产生的输入构件的端部与输入构件的阴影结束之间的关系信息,并且被用于 检测输入是否由输入构成。

    Method for Fabricating Semiconductor Memory Device
    4.
    发明申请
    Method for Fabricating Semiconductor Memory Device 失效
    制造半导体存储器件的方法

    公开(公告)号:US20100190326A1

    公开(公告)日:2010-07-29

    申请号:US12489019

    申请日:2009-06-22

    IPC分类号: H01L21/28 H01L21/768

    摘要: A method for fabricating a semiconductor memory device includes: forming a lower conductive layer over a semiconductor substrate; forming an insulation layer over the lower conductive layer; etching the insulation layer to form a contact hole that exposes a portion of the lower conductive layer; forming a contact plug in the contact hole; doping the contact plug by performing a plasma doping process while varying a temperature of regions the semiconductor substrate; and forming an upper conductive layer connected with the lower conductive layer through the contact plug.

    摘要翻译: 一种制造半导体存储器件的方法包括:在半导体衬底上形成下导电层; 在所述下导电层上形成绝缘层; 蚀刻绝缘层以形成暴露下部导电层的一部分的接触孔; 在接触孔中形成接触塞; 通过在改变半导体衬底的区域的温度的同时执行等离子体掺杂工艺来对接触插塞进行掺杂; 以及通过所述接触插塞形成与所述下导电层连接的上导电层。

    Method for fabricating semiconductor memory device
    5.
    发明授权
    Method for fabricating semiconductor memory device 失效
    半导体存储器件的制造方法

    公开(公告)号:US07855113B2

    公开(公告)日:2010-12-21

    申请号:US12489019

    申请日:2009-06-22

    IPC分类号: H01L21/8234

    摘要: A method for fabricating a semiconductor memory device includes: forming a lower conductive layer over a semiconductor substrate; forming an insulation layer over the lower conductive layer; etching the insulation layer to form a contact hole that exposes a portion of the lower conductive layer; forming a contact plug in the contact hole; doping the contact plug by performing a plasma doping process while varying a temperature of regions the semiconductor substrate; and forming an upper conductive layer connected with the lower conductive layer through the contact plug.

    摘要翻译: 一种制造半导体存储器件的方法包括:在半导体衬底上形成下导电层; 在所述下导电层上形成绝缘层; 蚀刻绝缘层以形成暴露下部导电层的一部分的接触孔; 在接触孔中形成接触塞; 通过在改变半导体衬底的区域的温度的同时执行等离子体掺杂工艺来对接触插塞进行掺杂; 以及通过所述接触插塞形成与所述下导电层连接的上导电层。

    Transistor for Preventing or Reducing Short Channel Effect and Method for Manufacturing the Same
    6.
    发明申请
    Transistor for Preventing or Reducing Short Channel Effect and Method for Manufacturing the Same 审中-公开
    用于防止或减少短沟道效应的晶体管及其制造方法

    公开(公告)号:US20100117131A1

    公开(公告)日:2010-05-13

    申请号:US12345540

    申请日:2008-12-29

    IPC分类号: H01L29/78 H01L21/8232

    摘要: A transistor for preventing or reducing short channel effect includes a substrate; a gate stack disposed over the substrate; a first junction region disposed on the substrate at a first side surface of the gate stack, said first junction layer being formed of an epitaxial layer; a trench formed within the substrate at a second side surface of the gate stack; and a second junction region disposed below the trench, said second junction layer being lower than the first junction region.

    摘要翻译: 用于防止或减少短沟道效应的晶体管包括基板; 设置在所述基板上的栅极堆叠; 第一结区,其设置在所述栅极堆叠的第一侧表面处于所述衬底上,所述第一接合层由外延层形成; 在所述栅极堆叠的第二侧表面处形成在所述衬底内的沟槽; 以及设置在沟槽下方的第二结区,所述第二结层低于第一结区。