公开(公告)号：US09123754B2

公开(公告)日：2015-09-01

申请号：US13267336

申请日：2011-10-06

申请人： Yun-Tai Shih ,  Kuan-Ming Pan ,  Jeng-Hao Lin ,  I-Shi Wang ,  Jui-Mu Cho ,  Ching-Hou Su ,  Chyi-Tsong Ni ,  Wun-Kai Tsai

发明人： Yun-Tai Shih ,  Kuan-Ming Pan ,  Jeng-Hao Lin ,  I-Shi Wang ,  Jui-Mu Cho ,  Ching-Hou Su ,  Chyi-Tsong Ni ,  Wun-Kai Tsai

IPC分类号： B23Q17/00 ,  H01L21/67 ,  H01L21/68

CPC分类号： H01L24/75 ,  H01L21/67092 ,  H01L21/68 ,  H01L21/681 ,  H01L21/682 ,  H01L23/544 ,  H01L2223/54426 ,  H01L2224/75703 ,  H01L2224/75753 ,  H01L2224/75901 ,  Y10T29/49 ,  Y10T29/49002 ,  Y10T29/49131 ,  Y10T29/49764 ,  Y10T29/53022

摘要： An apparatus is disclosed for detecting flag velocity during a eutectic process for bonding two wafers. The apparatus includes a plurality of sensors for detecting a time and/or velocity of a plurality of flags within a flag-out mechanism. The apparatus also includes one or more displays displaying time durations associated with the movement of the flags during the bonding process. Also disclosed is a method of aligning wafers in a eutectic bonding process. The method includes determining one or more time durations associated with the movement of the flags in the plurality of flags. The method also includes determining if a misalignment has occurred based on the one or more time durations associated with the movement of the flags.

摘要翻译： 公开了一种用于在用于粘合两个晶片的共晶过程期间检测标记速度的装置。 该装置包括多个用于检测标志输出机构内的多个标志的时间和/或速度的传感器。 该装置还包括一个或多个显示器，显示在粘合过程期间与标志的移动相关联的持续时间。 还公开了一种在共晶接合工艺中对准晶片的方法。 该方法包括确定与多个标志中的标志的移动相关联的一个或多个持续时间。 该方法还包括基于与标志的移动相关联的一个或多个持续时间来确定是否发生了未对准。