公开(公告)号：US20100184385A1

公开(公告)日：2010-07-22

申请号：US12403630

申请日：2009-03-13

申请人： Yung-Da Lin ,  Sheng-Cheng Chang ,  Yu-Hsiang Chen ,  Kuan-Yu Liu

发明人： Yung-Da Lin ,  Sheng-Cheng Chang ,  Yu-Hsiang Chen ,  Kuan-Yu Liu

IPC分类号： H04B1/38

CPC分类号： H04N7/20 ,  H04H40/90 ,  H04N21/4143 ,  H04N21/6143

摘要： A data communication system and a data communication method are provided. The data communication system comprises a bidirectional cable, an antenna, a receiving and a function circuit block. The bidirectional cable transfers data through a high and a low frequency band. The antenna is to receive and transfer the analog data signal through the high frequency band of the bidirectional cable. The receiving circuit block comprises a receiving module to receive the analog data signal from the high frequency band and converts the analog data signal into a digital data to a host and a first control signal processing module to couple a control signal to the low frequency band. The function circuit block comprises a second control signal processing module to decouple the control signal from the low frequency band and a function module to perform an adjustment on the data communication system according to the control signal.

摘要翻译： 提供了数据通信系统和数据通信方法。 数据通信系统包括双向电缆，天线，接收和功能电路块。 双向电缆通过高频和低频带传输数据。 天线将通过双向电缆的高频段接收和传输模拟数据信号。 接收电路块包括接收模块，用于从高频带接收模拟数据信号，并将模拟数据信号转换成数字数据到主机和第一控制信号处理模块，以将控制信号耦合到低频带。 功能电路块包括用于使控制信号与低频带分离的第二控制信号处理模块和根据控制信号在数据通信系统上进行调整的功能模块。

公开(公告)号：US08078095B2

公开(公告)日：2011-12-13

申请号：US12403630

申请日：2009-03-13

申请人： Yung-Da Lin ,  Sheng-Cheng Chang ,  Yu-Hsiang Chen ,  Kuan-Yu Liu

发明人： Yung-Da Lin ,  Sheng-Cheng Chang ,  Yu-Hsiang Chen ,  Kuan-Yu Liu

IPC分类号： H04H20/74

CPC分类号： H04N7/20 ,  H04H40/90 ,  H04N21/4143 ,  H04N21/6143

摘要： A data communication system and a data communication method are provided. The data communication system comprises a bidirectional cable, an antenna, a receiving and a function circuit block. The bidirectional cable transfers data through a high and a low frequency band. The antenna is to receive and transfer the analog data signal through the high frequency band of the bidirectional cable. The receiving circuit block comprises a receiving module to receive the analog data signal from the high frequency band and converts the analog data signal into a digital data to a host and a first control signal processing module to couple a control signal to the low frequency band. The function circuit block comprises a second control signal processing module to decouple the control signal from the low frequency band and a function module to perform an adjustment on the data communication system according to the control signal.

摘要翻译： 提供了数据通信系统和数据通信方法。 数据通信系统包括双向电缆，天线，接收和功能电路块。 双向电缆通过高频和低频带传输数据。 天线将通过双向电缆的高频段接收和传输模拟数据信号。 接收电路块包括接收模块，用于从高频带接收模拟数据信号，并将模拟数据信号转换成数字数据到主机和第一控制信号处理模块，以将控制信号耦合到低频带。 功能电路块包括用于使控制信号与低频带分离的第二控制信号处理模块和根据控制信号在数据通信系统上进行调整的功能模块。

公开(公告)号：US20110186335A1

公开(公告)日：2011-08-04

申请号：US13010441

申请日：2011-01-20

申请人： Sheng-Cheng Chang ,  Chien-Chung Chiang ,  Wei-Lun Hsu ,  Jin-Fu Chen ,  Chien-Ming Yeh

发明人： Sheng-Cheng Chang ,  Chien-Chung Chiang ,  Wei-Lun Hsu ,  Jin-Fu Chen ,  Chien-Ming Yeh

IPC分类号： H05K7/20 ,  H05K3/12

CPC分类号： H05K1/0209 ,  H05K1/0207 ,  H05K3/3452 ,  H05K2201/0305 ,  H05K2201/09781 ,  Y10T29/49165

摘要： The circuit board with a heat dissipating structure is provided. A first grounding conductor layer is formed on a first surface of a substrate. A first insulting layer is formed on the first grounding conductor layer and defines a number of circuit element pin openings and a plurality of heat dissipating openings therein so that the first grounding conductor layer is exposed from the circuit element pin openings and the heat dissipating openings. A number of solder balls are disposed in the circuit element pin openings and contacted with the first grounding conductor layer. A number of heat dissipating structures are disposed in the heat dissipating openings and contacted with the first grounding conductor layer. The heat dissipating structures and the solder balls have an identical material. The method for manufacturing the circuit board is also provided.

摘要翻译： 提供具有散热结构的电路板。 第一接地导体层形成在基板的第一表面上。 第一绝缘层形成在第一接地导体层上并且在其中限定多个电路元件针开口和多个散热开口，使得第一接地导体层从电路元件销开口和散热开口露出。 多个焊球设置在电路元件销开口中并与第一接地导体层接触。 多个散热结构设置在散热开口中并与第一接地导体层接触。 散热结构和焊球具有相同的材料。 还提供了用于制造电路板的方法。