SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTOR FOR USE AS A HIGH-SPEED SWITCHING DEVICE AND A POWER DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTOR FOR USE AS A HIGH-SPEED SWITCHING DEVICE AND A POWER DEVICE 有权
    包括用作高速开关器件和功率器件的场效应晶体管的半导体器件

    公开(公告)号:US20100096696A1

    公开(公告)日:2010-04-22

    申请号:US12645072

    申请日:2009-12-22

    IPC分类号: H01L29/78

    摘要: A body layer of a first conductivity type is formed on a semiconductor substrate, and a source layer of a second conductivity type is formed in a surface region of the body layer. An offset layer of the second conductivity type is formed on the semiconductor substrate, and a drain layer of the second conductivity type is formed in a surface region of the offset layer. An insulating film is embedded in a trench formed in the surface region of the offset layer between the source layer and the drain layer. A gate insulating film is formed on the body layer and the offset layer between the source layer and the insulating film. A gate electrode is formed on the gate insulating film. A first peak of an impurity concentration profile in the offset layer is formed at a position deeper than the insulating film.

    摘要翻译: 在半导体衬底上形成第一导电类型的主体层,并且在主体层的表面区域中形成第二导电类型的源极层。 第二导电类型的偏移层形成在半导体衬底上,并且第二导电类型的漏极层形成在偏移层的表面区域中。 绝缘膜嵌入形成在源极层和漏极层之间的偏移层的表面区域中的沟槽中。 在主体层和源极层与绝缘膜之间的偏移层上形成栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 偏移层中的杂质浓度分布的第一峰形成在比绝缘膜更深的位置。

    Semiconductor device used as high-speed switching device and power device
    2.
    发明授权
    Semiconductor device used as high-speed switching device and power device 失效
    半导体器件用作高速开关器件和功率器件

    公开(公告)号:US07692242B2

    公开(公告)日:2010-04-06

    申请号:US11505337

    申请日:2006-08-17

    IPC分类号: H01L29/04 H01L29/06

    摘要: A low resistance layer is formed on a semiconductor substrate, and a high resistance layer formed on the low resistance layer. A source region of a first conductivity type is formed on a surface region of the high resistance layer. A drain region of the first conductivity type is formed at a distance from the source region. A first resurf region of the first conductivity type is formed in a surface region of the high resistance layer between the source region and the drain region. A channel region of a second conductivity type is formed between the source region and the first resurf region. A gate insulating film is formed on the channel region, and a gate electrode formed on the gate insulating film. An impurity concentration in the channel region under the gate electrode gradually lowers from the source region toward the first resurf region.

    摘要翻译: 在半导体衬底上形成低电阻层,形成在低电阻层上的高电阻层。 第一导电类型的源区形成在高电阻层的表面区域上。 第一导电类型的漏极区域形成在与源极区域一定距离处。 在源极区域和漏极区域之间的高电阻层的表面区域中形成第一导电类型的第一再结晶区域。 在源极区域和第一再结晶区域之间形成第二导电类型的沟道区域。 栅极绝缘膜形成在沟道区上,栅极形成在栅极绝缘膜上。 栅电极下方的沟道区域中的杂质浓度从源极区域朝向第一再结晶区域逐渐降低。

    Semiconductor device including field effect transistor for use as a high-speed switching device and a power device
    3.
    发明授权
    Semiconductor device including field effect transistor for use as a high-speed switching device and a power device 有权
    包括用作高速开关装置的场效应晶体管和功率器件的半导体装置

    公开(公告)号:US08502309B2

    公开(公告)日:2013-08-06

    申请号:US12645072

    申请日:2009-12-22

    摘要: A body layer of a first conductivity type is formed on a semiconductor substrate, and a source layer of a second conductivity type is formed in a surface region of the body layer. An offset layer of the second conductivity type is formed on the semiconductor substrate, and a drain layer of the second conductivity type is formed in a surface region of the offset layer. An insulating film is embedded in a trench formed in the surface region of the offset layer between the source layer and the drain layer. A gate insulating film is formed on the body layer and the offset layer between the source layer and the insulating film. A gate electrode is formed on the gate insulating film. A first peak of an impurity concentration profile in the offset layer is formed at a position deeper than the insulating film.

    摘要翻译: 在半导体衬底上形成第一导电类型的主体层,并且在主体层的表面区域中形成第二导电类型的源极层。 第二导电类型的偏移层形成在半导体衬底上,并且第二导电类型的漏极层形成在偏移层的表面区域中。 绝缘膜嵌入形成在源极层和漏极层之间的偏移层的表面区域中的沟槽中。 在主体层和源极层与绝缘膜之间的偏移层上形成栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 偏移层中的杂质浓度分布的第一峰形成在比绝缘膜更深的位置。

    Semiconductor device used as high-speed switching device and power device
    4.
    发明授权
    Semiconductor device used as high-speed switching device and power device 有权
    半导体器件用作高速开关器件和功率器件

    公开(公告)号:US07998849B2

    公开(公告)日:2011-08-16

    申请号:US12716352

    申请日:2010-03-03

    IPC分类号: H01L21/336

    摘要: A low resistance layer is formed on a semiconductor substrate, and a high resistance layer formed on the low resistance layer. A source region of a first conductivity type is formed on a surface region of the high resistance layer. A drain region of the first conductivity type is formed at a distance from the source region. A first resurf region of the first conductivity type is formed in a surface region of the high resistance layer between the source region and the drain region. A channel region of a second conductivity type is formed between the source region and the first resurf region. A gate insulating film is formed on the channel region, and a gate electrode formed on the gate insulating film. An impurity concentration in the channel region under the gate electrode gradually lowers from the source region toward the first resurf region.

    摘要翻译: 在半导体衬底上形成低电阻层,形成在低电阻层上的高电阻层。 第一导电类型的源区形成在高电阻层的表面区域上。 第一导电类型的漏极区域形成在与源极区域一定距离处。 在源极区域和漏极区域之间的高电阻层的表面区域中形成第一导电类型的第一再结晶区域。 在源极区域和第一再结晶区域之间形成第二导电类型的沟道区域。 栅极绝缘膜形成在沟道区上,栅极形成在栅极绝缘膜上。 栅电极下方的沟道区域中的杂质浓度从源极区域朝向第一再结晶区域逐渐降低。

    Semiconductor device including field effect transistor for use as a high-speed switching device and a power device
    5.
    发明授权
    Semiconductor device including field effect transistor for use as a high-speed switching device and a power device 失效
    包括用作高速开关装置的场效应晶体管和功率器件的半导体装置

    公开(公告)号:US07646059B2

    公开(公告)日:2010-01-12

    申请号:US11501715

    申请日:2006-08-10

    摘要: A body layer of a first conductivity type is formed on a semiconductor substrate, and a source layer of a second conductivity type is formed in a surface region of the body layer. An offset layer of the second conductivity type is formed on the semiconductor substrate, and a drain layer of the second conductivity type is formed in a surface region of the offset layer. An insulating film is embedded in a trench formed in the surface region of the offset layer between the source layer and the drain layer. A gate insulating film is formed on the body layer and the offset layer between the source layer and the insulating film. A gate electrode is formed on the gate insulating film. A first peak of an impurity concentration profile in the offset layer is formed at a position deeper than the insulating film.

    摘要翻译: 在半导体衬底上形成第一导电类型的主体层,并且在主体层的表面区域中形成第二导电类型的源极层。 第二导电类型的偏移层形成在半导体衬底上,并且第二导电类型的漏极层形成在偏移层的表面区域中。 绝缘膜嵌入形成在源极层和漏极层之间的偏移层的表面区域中的沟槽中。 在主体层和源极层与绝缘膜之间的偏移层上形成栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 偏移层中的杂质浓度分布的第一峰形成在比绝缘膜更深的位置。

    Semiconductor device used as high-speed switching device and power device
    6.
    发明申请
    Semiconductor device used as high-speed switching device and power device 失效
    半导体器件用作高速开关器件和功率器件

    公开(公告)号:US20070040216A1

    公开(公告)日:2007-02-22

    申请号:US11505337

    申请日:2006-08-17

    IPC分类号: H01L29/76

    摘要: A low resistance layer is formed on a semiconductor substrate, and a high resistance layer formed on the low resistance layer. A source region of a first conductivity type is formed on a surface region of the high resistance layer. A drain region of the first conductivity type is formed at a distance from the source region. A first resurf region of the first conductivity type is formed in a surface region of the high resistance layer between the source region and the drain region. A channel region of a second conductivity type is formed between the source region and the first resurf region. A gate insulating film is formed on the channel region, and a gate electrode formed on the gate insulating film. An impurity concentration in the channel region under the gate electrode gradually lowers from the source region toward the first resurf region.

    摘要翻译: 在半导体衬底上形成低电阻层,形成在低电阻层上的高电阻层。 第一导电类型的源区形成在高电阻层的表面区域上。 第一导电类型的漏极区域形成在与源极区域一定距离处。 在源极区域和漏极区域之间的高电阻层的表面区域中形成第一导电类型的第一再结晶区域。 在源极区域和第一再结晶区域之间形成第二导电类型的沟道区域。 栅极绝缘膜形成在沟道区上,栅极形成在栅极绝缘膜上。 栅电极下方的沟道区域中的杂质浓度从源极区域朝向第一再结晶区域逐渐降低。

    Semiconductor device including field effect transistor for use as a high-speed switching device and a power device
    7.
    发明申请
    Semiconductor device including field effect transistor for use as a high-speed switching device and a power device 失效
    包括用作高速开关装置的场效应晶体管和功率器件的半导体装置

    公开(公告)号:US20070034894A1

    公开(公告)日:2007-02-15

    申请号:US11501715

    申请日:2006-08-10

    IPC分类号: H01L29/74

    摘要: A body layer of a first conductivity type is formed on a semiconductor substrate, and a source layer of a second conductivity type is formed in a surface region of the body layer. An offset layer of the second conductivity type is formed on the semiconductor substrate, and a drain layer of the second conductivity type is formed in a surface region of the offset layer. An insulating film is embedded in a trench formed in the surface region of the offset layer between the source layer and the drain layer. A gate insulating film is formed on the body layer and the offset layer between the source layer and the insulating film. A gate electrode is formed on the gate insulating film. A first peak of an impurity concentration profile in the offset layer is formed at a position deeper than the insulating film.

    摘要翻译: 在半导体衬底上形成第一导电类型的主体层,并且在主体层的表面区域中形成第二导电类型的源极层。 第二导电类型的偏移层形成在半导体衬底上,并且第二导电类型的漏极层形成在偏移层的表面区域中。 绝缘膜嵌入形成在源极层和漏极层之间的偏移层的表面区域中的沟槽中。 在主体层和源极层与绝缘膜之间的偏移层上形成栅极绝缘膜。 在栅极绝缘膜上形成栅电极。 偏移层中的杂质浓度分布的第一峰形成在比绝缘膜更深的位置。

    SEMICONDUCTOR DEVICE USED AS HIGH-SPEED SWITCHING DEVICE AND POWER DEVICE
    8.
    发明申请
    SEMICONDUCTOR DEVICE USED AS HIGH-SPEED SWITCHING DEVICE AND POWER DEVICE 有权
    用作高速切换装置和电源装置的半导体装置

    公开(公告)号:US20100159659A1

    公开(公告)日:2010-06-24

    申请号:US12716352

    申请日:2010-03-03

    IPC分类号: H01L21/336

    摘要: A low resistance layer is formed on a semiconductor substrate, and a high resistance layer formed on the low resistance layer. A source region of a first conductivity type is formed on a surface region of the high resistance layer. A drain region of the first conductivity type is formed at a distance from the source region. A first resurf region of the first conductivity type is formed in a surface region of the high resistance layer between the source region and the drain region. A channel region of a second conductivity type is formed between the source region and the first resurf region. A gate insulating film is formed on the channel region, and a gate electrode formed on the gate insulating film. An impurity concentration in the channel region under the gate electrode gradually lowers from the source region toward the first resurf region.

    摘要翻译: 在半导体衬底上形成低电阻层,形成在低电阻层上的高电阻层。 第一导电类型的源区形成在高电阻层的表面区域上。 第一导电类型的漏极区域形成在与源极区域一定距离处。 在源极区域和漏极区域之间的高电阻层的表面区域中形成第一导电类型的第一再结晶区域。 在源极区域和第一再结晶区域之间形成第二导电类型的沟道区域。 栅极绝缘膜形成在沟道区上,栅极形成在栅极绝缘膜上。 栅电极下方的沟道区域中的杂质浓度从源极区域朝向第一再结晶区域逐渐降低。

    Method of manufacturing vertical power device
    9.
    发明授权
    Method of manufacturing vertical power device 失效
    垂直功率器件的制造方法

    公开(公告)号:US5985708A

    公开(公告)日:1999-11-16

    申请号:US816596

    申请日:1997-03-13

    摘要: A semiconductor apparatus comprising a vertical type semiconductor device having a first conducting type semiconductor substrate, a drain layer formed on the surface of the semiconductor substrate, a drain electrode formed on the surface of the drain layer, a second conducting type base layer selectively formed on the surface of the semiconductor substrate opposite to the drain layer, a first conducting type source layer selectively formed on the surface of the second conducting type base layer, a source electrode formed on the first conducting type source layer and the second conducting type base layer, and a gate electrode formed in contact with the first conducting type source layer, the second conducting type base layer and the semiconductor substrate through a gate insulating film and a lateral semiconductor device having an insulating layer formed in a region of the surface of the semiconductor substrate different from the second conducting type base layer, and a polycrystalline semiconductor layer formed on the insulating layer and having a first conducting type region and a second conducting type region, wherein the first conducting type source layer of the vertical semiconductor device and the first conducting type region of the polycrystalline semiconductor layer are simultaneously formed.

    摘要翻译: 一种半导体装置,包括具有第一导电型半导体衬底的垂直型半导体器件,形成在半导体衬底的表面上的漏极层,形成在漏极层的表面上的漏电极,第二导电型基极层, 所述半导体衬底的与所述漏极层相对的表面,选择性地形成在所述第二导电型基极层的表面上的第一导电型源极层,形成在所述第一导电型源极层和所述第二导电型基极层上的源电极, 以及通过栅极绝缘膜与第一导电型源极层,第二导电型基极层和半导体基板接触形成的栅电极,以及在半导体基板的表面的区域中形成有绝缘层的侧面半导体装置 不同于第二导电型基底层,和多晶 半导体层形成在绝缘层上并具有第一导电类型区域和第二导电类型区域,其中垂直半导体器件的第一导电型源极层和多晶半导体层的第一导电类型区域同时形成。