利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

20 条记录 (耗时 0.032 秒)

    Semiconductor device manufacturing method for grinding and dicing a wafer from a back side of the wafer
    1.
    发明授权
    Semiconductor device manufacturing method for grinding and dicing a wafer from a back side of the wafer 有权
    用于从晶片的背面研磨和切割晶片的半导体器件制造方法

    公开(公告)号：US06297131B1

    公开(公告)日：2001-10-02

    申请号：US09357657

    申请日：1999-07-20

    申请人： Yutaka Yamada ,  Takanori Muramoto

    发明人： Yutaka Yamada ,  Takanori Muramoto

    IPC分类号： H01L2146

    CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834

    摘要： A yield rate and a throughput of a semiconductor device can be increased when a large-diameter wafer having a reduced thickness is used. The semiconductor device is produced by using a wafer having a front surface on which circuits are formed and a back surface opposite to the front surface. A protective tape is applied to the front surface of the wafer. The wafer is mounted to a dicing tape via the protective tape, the dicing tape being spread on a wafer frame having a size larger than a diameter of the wafer. The back surface of the wafer is ground while the wafer is mounted on the dicing tape. The wafer is diced, after the wafer is ground, while the wafer is mounted on the dicing tape so as to form the semiconductor device by full-dicing.

    摘要翻译： 当使用具有减小的厚度的大直径晶片时，可以提高半导体器件的产率和产量。 半导体器件通过使用具有形成电路的前表面的晶片和与前表面相对的后表面来制造。 将保护带施加到晶片的前表面。 通过保护带将晶片安装到切割带上，切割带扩展在具有大于晶片直径的尺寸的晶片框架上。 当晶片安装在切割带上时，晶片的背面被研磨。 在晶片被研磨之后，晶片被切割，同时晶片安装在切割带上，以便通过全切割形成半导体器件。

    Apparatus and method for manufacturing laminated substrate
    8.
    发明申请
    Apparatus and method for manufacturing laminated substrate 审中-公开
    层叠基板的制造方法及装置

    公开(公告)号：US20060157192A1

    公开(公告)日：2006-07-20

    申请号：US11146095

    申请日：2005-06-07

    申请人： Joji Hasegawa ,  Yoshimasa Miyajima ,  Takanori Muramoto

    发明人： Joji Hasegawa ,  Yoshimasa Miyajima ,  Takanori Muramoto

    IPC分类号： B32B37/00

    CPC分类号： B32B37/0015 ,  B32B37/003 ,  B32B38/1858 ,  B32B2038/1891 ,  B32B2309/68 ,  B32B2457/20 ,  B32B2457/202 ,  G02F2001/133354 ,  Y10T156/1744

    摘要： A laminated substrate manufacturing device for eliminating deformation of substrates during a period between when the substrates undergo a conveying process and an attracting process before the substrates are laminated. The laminated substrate manufacturing device includes two holding plates arranged in a processing chamber. Each holding plate includes vacuum pads for attracting a corresponding substrate. A controller controls an attraction device provided for each holding plate so that the holding plate sequentially attracts the corresponding substrate from a central portion to the peripheral portion of the substrate.

    摘要翻译： 一种层压基板制造装置，用于在基板经历输送处理之前的期间和基板层压之前的吸引过程中消除基板的变形。 层叠基板制造装置包括布置在处理室中的两个保持板。 每个保持板包括用于吸引相应基板的真空垫。 控制器控制为每个保持板设置的吸引装置，使得保持板从基板的中心部分到周边部分顺序地吸引相应的基板。